AMD XC7A75T-1FTG256I

Overview

XC7A75T-1FTG256I from AMD is a Kintex-7 FPGA with 74,250 logic cells, 365 I/O pins, and -1 speed grade operating at 1.0V core voltage. It integrates 365 SelectIO™ pins, 220 Block RAM blocks (each 36 Kb), and supports DDR3 memory interfaces up to 800 MHz. It is used in high-performance industrial imaging and real-time video processing systems.

For engineers reviewing the XC7A75T-1FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, Block RAM capacity, DDR3 interface support, and thermal performance in compact PCB layouts.

Technical Context

The XC7A75T-1FTG256I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP slices (180 units), and integrated PCIe® Gen2 x4 endpoint capability. It supports transceiver line rates up to 6.6 Gb/s via four GTP transceivers.

It includes dual 12-bit, 1 MSPS ADCs for on-chip monitoring, and supports JTAG, ICAP, and SelectMAP configuration modes. The device uses a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm pitch and 17 mm × 17 mm body size.

Key Specifications

Pinout & Package

XC7A75T-1FTG256I is housed in a 256-pin Fine-Pitch BGA (FTG) package with 0.8 mm ball pitch and 17 mm × 17 mm footprint. Thermal pad is exposed on underside for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Compared with XC7A75T-1FTG256I, XC7A100T-1FGG484I offers higher density and I/O at the cost of larger footprint and thermal load, while XC7A50T-1CSG324I trades logic capacity for compactness and lower power-making XC7A75T-1FTG256I the balanced choice for mid-range video and interface-intensive designs.

Availability

XC7A75T-1FTG256I is available at Aetrix Electronics and suitable for industrial imaging, avionics data aggregation, and test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC7A75T-1FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and aerospace applications.

The Kintex-7 family targets high-performance, cost-sensitive applications requiring optimized logic-to-I/O ratio and robust transceiver integration for real-time signal processing.

FAQ

What is the maximum supported DDR3 memory interface speed for XC7A75T-1FTG256I?

The XC7A75T-1FTG256I supports DDR3 SDRAM interfaces up to 800 MHz data rate (1600 MT/s), validated with Xilinx UG473 documentation. This enables use with standard DDR3-1600 modules in video buffer and frame store applications. The device includes dedicated memory controller IP and I/O timing calibration logic to maintain signal integrity at these speeds.

Does XC7A75T-1FTG256I include built-in analog-to-digital conversion capability?

Yes, XC7A75T-1FTG256I integrates two independent 12-bit, 1 MSPS analog-to-digital converters (XADC). These are used exclusively for on-chip monitoring of die temperature and supply voltages (VCCINT, VCCAUX, VCCO), not for general-purpose signal acquisition. Calibration and readout are performed via dedicated JTAG or AXI interface.

What configuration modes does XC7A75T-1FTG256I support?

XC7A75T-1FTG256I supports three primary configuration modes: Master SPI (using internal oscillator), Slave SelectMAP (parallel synchronous), and JTAG boundary-scan. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstreams may be stored in external SPI flash, BPI flash, or loaded dynamically via ICAP port.

Is XC7A75T-1FTG256I qualified for extended temperature operation?

Yes, the "I" suffix in XC7A75T-1FTG256I denotes Industrial temperature grade (-40°C to +100°C junction). This qualification applies to the full device functionality including I/O banks, transceivers, and configuration logic, and is verified per Xilinx/AMD specification DS182.

Can XC7A75T-1FTG256I implement a PCIe Gen2 endpoint without external components?

Yes, XC7A75T-1FTG256I contains a hardened PCIe Gen2 x4 endpoint block with integrated PHY, link layer, and transaction layer. No external transceiver or protocol controller is required. Reference designs and IP cores are provided in Vivado to configure endpoints for root complex or endpoint roles in embedded systems.