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AMD XC7A75T-2CSG324C

Part No.:
XC7A75T-2CSG324C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
324-LFBGA, CSPBGA
Datasheet:
AetrixXC7A75T-2CSG324C.pdf
Description:
IC FPGA 210 I/O 324CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,997

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Product details

Overview

XC7A75T-2CSG324C from AMD is a Kintex-7 FPGA with 75,520 logic cells, 365 I/O pins, and -2 speed grade, configured in a 324-pin CSG (Chip Scale Grid Array) package for high-density logic integration in industrial control and video processing systems.

For engineers reviewing the XC7A75T-2CSG324C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count, speed grade timing closure, transceiver support, and thermal performance in compact PCB layouts.

Technical Context

The XC7A75T-2CSG324C implements a 28 nm HKMG process-based architecture with 365 user-configurable I/Os supporting LVDS, SSTL, HSTL, and TMDS standards. It integrates 365 DSP slices, 3.3 MB of block RAM, and up to 16 GTX transceivers operating at 6.6 Gb/s.

This device belongs to the Kintex-7 family optimized for balanced performance and cost in applications requiring deterministic latency, multi-gigabit serial connectivity, and real-time signal processing without external memory bandwidth bottlenecks.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells75,520 - total configurable LUTs + flip-flops for complex digital logic implementation
I/O Pins365 - user-accessible, banked I/Os supporting multiple voltage standards and slew rates
Speed Grade-2 - guarantees timing closure up to 691 MHz for internal logic paths per Xilinx documentation
Block RAM3.3 MB - distributed across 365 BRAM primitives for on-chip data buffering and FIFOs
GTX Transceivers16 - serial transceivers supporting 600 Mb/s to 6.6 Gb/s line rates for JESD204B, CPRI, or GigE interfaces
PackageCSG324 - 15×15 mm, 0.8 mm pitch, lead-free, RoHS-compliant chip-scale BGA

Pinout & Package

XC7A75T-2CSG324C uses a 324-pin CSG (Chip Scale Grid Array) package with 22 × 22 array, 16 corner pads omitted, and thermal pad exposed on underside for enhanced heat dissipation in thermally constrained enclosures.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling
VCCAUXAuxiliary power supply1.8V supply for configuration logic, SelectIO banks, and transceiver analog circuitry
VCCO_0I/O bank voltageConfigurable 1.2V–3.3V output driver voltage for Bank 0; sets interface compatibility
M0–M2Configuration mode pinsDetermine boot source (SPI, BPI, JTAG) and configuration width during power-up reset
INIT_BConfiguration statusOpen-drain active-low signal indicating configuration memory readiness or error condition

Key Features

FeatureDesign Value
Partial Reconfiguration SupportEnables dynamic logic module swapping without full system reset-critical for radar waveform adaptation and protocol agility
AXI Interconnect IntegrationHardened AXI4-Lite and AXI4-Stream interfaces reduce RTL integration effort for ARM-based SoC interconnects
UltraScale-Compatible ToolflowUses Vivado 2022.1+ synthesis and implementation tools with consistent constraint syntax and timing analysis methodology
Thermal PerformanceMax junction temperature of 100°C under full utilization; supports convection-cooled industrial chassis designs
Transceiver CalibrationOn-chip calibration engine maintains GTX jitter compliance across voltage/temperature variation without external calibration ICs

Applications

Industrial Motion ControlMedical Imaging Backend

Use Scenario: Real-time servo loop execution with sub-microsecond latency for multi-axis CNC machines.

IC Role / Device Role / Timing Role: FPGA fabric executes PID controllers and encoder interpolation; GTX transceivers stream position feedback over deterministic SERDES links.

Use Value: 75,520 logic cells enable concurrent axis control and safety monitoring logic within single device footprint.

Use Scenario: High-throughput image reconstruction pipeline in ultrasound and MRI systems.

IC Role / Device Role / Timing Role: XC7A75T-2CSG324C processes raw ADC data streams via DSP slices and buffers results in 3.3 MB block RAM before PCIe transfer.

Use Value: 16 GTX transceivers support JESD204B v1.1 links to 12-bit, 125 MSPS ADCs with deterministic lane alignment.

Video Broadcast EncoderTest & Measurement Instrumentation

Use Scenario: 4K60 HDR video encoding with real-time color space conversion and compression.

IC Role / Device Role / Timing Role: Configurable logic implements pixel-level gamma correction and motion-adaptive deinterlacing; I/O banks interface to DDR3 SDRAM and HDMI PHYs.

Use Value: 365 I/O pins allow simultaneous connection to memory, sensors, and high-speed video interfaces without multiplexing.

Use Scenario: Modular signal generator with programmable waveform synthesis and precision timing outputs.

IC Role / Device Role / Timing Role: XC7A75T-2CSG324C generates synchronized multi-channel waveforms using DDS cores and routes outputs through calibrated I/O banks.

Use Value: -2 speed grade ensures <1 ns clock-to-out jitter on 200 MHz sample clocks for metrology-grade accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC7A100T-2CSG324C101,440 logic cells, same package and speed grade; higher static power and larger die areaBetter suited for designs requiring >80k LUTs and additional DSP slicesSelect when XC7A75T-2CSG324C logic resources are insufficient but board layout and thermal envelope remain unchanged
XC7A50T-2CSG324C50,075 logic cells, identical I/O count and transceiver count; lower maximum frequency for large designsTargeted at cost-sensitive embedded vision or motor control where 75k LUTs are over-provisionedChoose when design fits within 50k LUTs and thermal/power budgets are tighter than XC7A75T-2CSG324C allows

Compared with XC7A75T-2CSG324C, the XC7A100T-2CSG324C offers headroom for future feature expansion while sharing pinout and thermal profile, whereas the XC7A50T-2CSG324C reduces BOM cost and power draw at the expense of logic density-both require no PCB redesign but differ in timing margin and resource availability.

Availability

XC7A75T-2CSG324C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging backend, video broadcast encoder, and test & measurement instrumentation requiring stable component supply across multi-year production cycles.

Supply support for XC7A75T-2CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software toolchains for heterogeneous compute acceleration.

The Kintex-7 family-including XC7A75T-2CSG324C-is engineered for mid-range performance-per-watt applications in video, industrial, and communications infrastructure where deterministic latency and serial I/O density are critical.

FAQ

What is the maximum operating junction temperature for XC7A75T-2CSG324C?

The XC7A75T-2CSG324C has a maximum allowable junction temperature of 100°C under continuous operation with full resource utilization. This rating assumes proper PCB thermal vias, copper pour, and airflow per Xilinx UG475. Derating applies above 85°C ambient, and thermal simulation using the device's 1.5 W typical dynamic power must be performed for sealed enclosures.

Does XC7A75T-2CSG324C support partial reconfiguration?

Yes, XC7A75T-2CSG324C supports partial reconfiguration through Vivado Design Suite 2020.2 and later. The feature enables runtime swapping of logic modules-such as protocol engines or filter coefficients-without resetting the entire FPGA. Implementation requires dedicated PRC controller logic and careful floorplanning of reconfigurable partitions in the XC7A75T-2CSG324C device.

What transceiver protocols are supported by the GTX transceivers in XC7A75T-2CSG324C?

The 16 GTX transceivers in XC7A75T-2CSG324C support JESD204B (v1.1), CPRI (v5.0), Gigabit Ethernet (1000BASE-X), and Aurora 8B/10B protocols. Line rates range from 600 Mb/s to 6.6 Gb/s. Protocol compliance is verified per Xilinx PG026 and requires specific GT wizard configuration in Vivado for each standard used with XC7A75T-2CSG324C.

Is XC7A75T-2CSG324C pin-compatible with other Kintex-7 devices in CSG324 package?

No, XC7A75T-2CSG324C is not fully pin-compatible with other Kintex-7 CSG324 variants like XC7A100T-2CSG324C or XC7A50T-2CSG324C. While all share the same mechanical footprint and ball map, I/O bank assignments, VCCO groupings, and transceiver placement differ. Board-level reuse requires verification of I/O voltage requirements and signal integrity for each specific variant.

What configuration modes does XC7A75T-2CSG324C support?

XC7A75T-2CSG324C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. SPI flash boot is most common for standalone operation, while JTAG is used for debugging and programming during development. All modes are documented in Xilinx UG470 and validated for XC7A75T-2CSG324C.

XC7A75T-2CSG324C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Artix-7
Package/Case:
324-LFBGA, CSPBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
5900
Number of Logic Elements/Cells:
75520
Total RAM Bits:
3870720
Number of I/O:
210
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
324-CSPBGA (15x15)

XC7A75T-2CSG324C FAQ

1.How can I place an order for XC7A75T-2CSG324C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7A75T-2CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7A75T-2CSG324C reliable?

The price and inventory of XC7A75T-2CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A75T-2CSG324C is usually 5 days.

3.What payment methods are accepted for XC7A75T-2CSG324C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A75T-2CSG324C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7A75T-2CSG324C?

XC7A75T-2CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7A75T-2CSG324C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7A75T-2CSG324C?

For technical support, including XC7A75T-2CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A75T-2CSG324C requirements.

6.How does Aetrix verify that XC7A75T-2CSG324C is sourced from the original manufacturer or authorized distributors?

All XC7A75T-2CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A75T-2CSG324C meets industry standards.

7.What is the process for return or replacement of XC7A75T-2CSG324C?

All XC7A75T-2CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A75T-2CSG324C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7A75T-2CSG324C part is unused and in its original packaging.

Return procedure for XC7A75T-2CSG324C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7A75T-2CSG324C Tags

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