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AMD XC7A75T-2CSG324I
- Part No.:
- XC7A75T-2CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A75T-2CSG324I.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,909
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Product details
Overview
XC7A75T-2CSG324I from AMD is a Kintex-7 FPGA with 75,520 logic cells, 365 I/O pins, and -2 speed grade, packaged in a 324-pin CSG (Chip Scale Grid Array) package. It integrates 365 configurable I/Os, 305 DSP slices, and supports transceivers up to 6.6 Gb/s for high-speed serial interface applications in industrial imaging and embedded vision systems.
For engineers reviewing the XC7A75T-2CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver lane count, logic cell density, and thermal performance in compact PCB layouts.
Technical Context
The XC7A75T-2CSG324I implements a 28 nm HKMG process-based architecture with dedicated clock management tiles (CMT), including MMCM and PLL blocks supporting jitter filtering and frequency synthesis. It features integrated Block RAM (up to 3,392 kbits), UltraScale-compatible SelectIO™ technology, and support for DDR3 interfaces up to 800 MHz.
This device includes 16 GTX transceiver quads (64 lanes total), each capable of 6.6 Gb/s operation, and supports PCIe Gen2 x8 endpoint configuration. Configuration is performed via JTAG, SPIx4, or BPI parallel modes with AES-256 bitstream encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 75,520 - determines maximum combinational/sequential logic capacity for HDL implementation |
| I/O Pins | 365 - supports high-density peripheral interfacing with bank-wise voltage flexibility (1.2–3.3 V) |
| DSP Slices | 305 - enables fixed/floating-point arithmetic acceleration for real-time signal processing |
| Block RAM | 3,392 kbits - provides on-chip memory for FIFOs, frame buffers, and lookup tables |
| Transceiver Speed | 6.6 Gb/s - enables compliance with CPRI, SATA III, and 10GbE PHY layer requirements |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade under same conditions |
| Package | 324-pin CSG - 15×15 mm footprint with 0.8 mm pitch, optimized for thermal dissipation and board space efficiency |
Pinout & Package
The XC7A75T-2CSG324I is housed in a 324-pin Chip Scale Grid Array (CSG) package with 15×15 mm body size, 0.8 mm pitch, and exposed thermal pad. Pinout follows Xilinx/AMD Kintex-7 CSG324 standard layout per UG474 v1.14.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, transceivers, and select I/O banks |
| VCCO_0 | I/O bank power | Configurable 1.2–3.3V supply per bank; sets output voltage level and drive strength |
| M0–M2 | Configuration mode pins | Determine boot source (JTAG, SPI, BPI) and configuration width during power-up |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration progress and error state |
| CCLK | Configuration clock | Input clock for master SPI/BPI configuration; can be driven externally or internally generated |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two MMCM + one PLL per CMT tile enables multi-phase clock generation and jitter cleaning for mixed-signal synchronization |
| SelectIO Technology | Supports LVDS, SSTL, HSTL, and MIPI D-PHY standards across 18 I/O banks with independent VCCO control |
| PCIe Gen2 Endpoint | Hard IP block supporting x1/x2/x4/x8 link widths with integrated DMA and TLP parsing for host communication |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning via authenticated, encrypted configuration loading |
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, critical for adaptive computing workloads |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time image preprocessing pipeline in automated optical inspection (AOI) systems. IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level filtering, edge detection, and ROI extraction before sending compressed frames to host CPU. Use Value: 365 I/Os enable direct connection to multiple CMOS sensors and high-speed DDR3 frame buffers; 6.6 Gb/s transceivers support Camera Link HS or CoaXPress 1.1 links. | Use Scenario: High-fidelity ultrasound data acquisition and beamforming in portable diagnostic devices. IC Role / Device Role / Timing Role: XC7A75T-2CSG324I implements digital beamformer logic and time-aligned ADC data aggregation across 64 channels. Use Value: 305 DSP slices accelerate real-time FIR filtering and delay-and-sum operations; 3,392 kbits Block RAM stores channel calibration coefficients and echo buffers. |
| Avionics Data Concentrator | Test & Measurement Instrumentation |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 protocol bridging in flight control subsystems. IC Role / Device Role / Timing Role: Configurable logic implements deterministic packet routing, CRC validation, and timestamping with sub-microsecond latency. Use Value: -2 speed grade ensures timing margin for worst-case temperature and voltage corners; AES encryption secures firmware updates over maintenance interfaces. | Use Scenario: Modular PXIe chassis controller handling multi-channel digitizer synchronization and trigger distribution. IC Role / Device Role / Timing Role: XC7A75T-2CSG324I serves as central timing engine and data aggregator between 16+ digitizer modules. Use Value: Integrated MMCMs generate phase-aligned clocks for 100 MS/s sampling across all channels; PCIe Gen2 x8 provides 4 GB/s sustained host transfer bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676I | Kintex UltraScale, 352K LC, 20 × 12.5 Gb/s GTY transceivers, larger 676-pin FCBGA package | Higher logic density and transceiver speed required for 100G Ethernet or coherent optics | Choose when migrating from Kintex-7 to UltraScale for bandwidth scaling; not pin-compatible |
| XC7K160T-2FFG676I | Kintex-7 family, 162,240 LC, 676-pin FFG package, higher I/O count (500) and DSP resources (600 slices) | Demands more logic for complex video codecs or multi-axis motor control algorithms | Choose for increased resource headroom within same architecture; different package prevents drop-in replacement |
Compared with XC7A75T-2CSG324I, the XCKU035 offers higher transceiver speed and logic scale but requires PCB redesign, while XC7K160T delivers greater on-chip resources in a larger package-both serve distinct scalability paths rather than functional replacements.
Availability
XC7A75T-2CSG324I is available at Aetrix Electronics and suitable for industrial imaging, medical diagnostics, avionics data concentrators, and test instrumentation requiring stable component supply across extended product lifecycles.
Supply support for XC7A75T-2CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client platforms through high-performance FPGA, adaptive SoC, and GPU technologies.
The Kintex-7 family-including XC7A75T-2CSG324I-was designed for cost-optimized, high-throughput applications demanding balanced logic, I/O, and transceiver resources in compact form factors.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7A75T-2CSG324I?
The XC7A75T-2CSG324I supports DDR3 SDRAM interfaces up to 800 MHz data rate (400 MHz clock frequency) using its SelectIO resources and IDELAY/ODELAY primitives. This capability is validated in UG475 and applies directly to XC7A75T-2CSG324I's I/O banks configured for SSTL15 standards with proper PCB termination and timing constraints.
Does XC7A75T-2CSG324I include hardened PCIe Gen2 endpoints?
Yes, XC7A75T-2CSG324I integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification 2.1. This includes physical layer (PHY), data link layer (DLL), and transaction layer (TL) logic, enabling direct connection to host root complexes without external bridge ICs.
What configuration modes are supported by XC7A75T-2CSG324I?
XC7A75T-2CSG324I supports Master SPI (x1/x2/x4), Slave Parallel (BPI), JTAG, and Slave Serial configuration modes. Mode selection is controlled by M0–M2 pins at power-up, and all modes are fully documented in UG470 for XC7A75T-2CSG324I.
Is XC7A75T-2CSG324I qualified for extended temperature operation?
Yes, the "I" suffix in XC7A75T-2CSG324I denotes Industrial temperature grade (-40°C to +100°C junction). Thermal performance is characterized per UG474, and the CSG324 package's exposed thermal pad enables reliable operation under sustained 1.8W typical power dissipation.
Can XC7A75T-2CSG324I implement partial reconfiguration in deployed systems?
Yes, XC7A75T-2CSG324I supports runtime partial reconfiguration (PR) using the ICAP interface and frame-based bitstream loading. Verified PR workflows for XC7A75T-2CSG324I are documented in UG909 and require Vivado 2019.2 or later toolchain support.
XC7A75T-2CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5900
- Number of Logic Elements/Cells:
- 75520
- Total RAM Bits:
- 3870720
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A75T-2CSG324I FAQ
1.How can I place an order for XC7A75T-2CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A75T-2CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A75T-2CSG324I reliable?
The price and inventory of XC7A75T-2CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A75T-2CSG324I is usually 5 days.
3.What payment methods are accepted for XC7A75T-2CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A75T-2CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A75T-2CSG324I?
XC7A75T-2CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A75T-2CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A75T-2CSG324I?
For technical support, including XC7A75T-2CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A75T-2CSG324I requirements.
6.How does Aetrix verify that XC7A75T-2CSG324I is sourced from the original manufacturer or authorized distributors?
All XC7A75T-2CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A75T-2CSG324I meets industry standards.
7.What is the process for return or replacement of XC7A75T-2CSG324I?
All XC7A75T-2CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A75T-2CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A75T-2CSG324I part is unused and in its original packaging.
Return procedure for XC7A75T-2CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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