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AMD XC7A75T-2FGG676C

Part No.:
XC7A75T-2FGG676C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BGA
Datasheet:
AetrixXC7A75T-2FGG676C.pdf
Description:
IC FPGA 300 I/O 676FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:212

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Product details

Overview

XC7A75T-2FGG676C from AMD is a Kintex-7 FPGA with 75,520 logic cells, 365 I/O pins, and 298 user-configurable I/Os in a 676-pin Fine-Pitch Flip-Chip BGA (FCBGA) package. It operates at -2 speed grade, supports 1.0V core voltage, and targets high-performance serial transceiver applications including PCIe Gen2 and Gigabit Ethernet.

For engineers reviewing the XC7A75T-2FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver lane count (8 GT lanes), distributed RAM capacity (3,494 kbits), and thermal performance in industrial temperature range (0°C to 85°C).

Technical Context

The XC7A75T-2FGG676C implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers supporting data rates up to 6.6 Gbps. It includes 365 total I/O pins with SelectIO™ technology supporting LVDS, SSTL, HSTL, and TMDS standards.

It features 220 DSP48E1 slices for arithmetic-intensive tasks and 3,494 kbits of block RAM. The device uses configuration via Master SPI or JTAG, with support for partial reconfiguration and bitstream encryption.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells75,520 - determines maximum combinational and sequential logic density for RTL implementation
I/O Pins365 - total physical package terminals, with 298 user-configurable I/Os
GT Transceivers8 lanes - supports PCIe Gen2 x4 or dual Gigabit Ethernet interfaces
Block RAM3,494 kbits - enables on-chip data buffering and FIFO implementation without external memory
DSP Slices220 × DSP48E1 - provides dedicated hardware for multiply-accumulate operations in signal processing
Speed Grade-2 - guarantees timing closure at worst-case industrial temperature and voltage conditions
Core Voltage1.0V ±3% - defines power delivery requirements and impacts dynamic power consumption

Pinout & Package

XC7A75T-2FGG676C is housed in a 27×27 mm, 676-pin Fine-Pitch Flip-Chip BGA (FCBGA) package with 1.0 mm ball pitch and Pb-free (RoHS-compliant) finish. Thermal characteristics include θJA = 15.6°C/W and θJB = 3.5°C/W.

Pin/TerminalCircuit RoleDesign Meaning
M17VCCINT1.0V core supply input for FPGA fabric and CLBs
P18VCCAUX1.8V auxiliary supply for configuration, clocking, and transceivers
R15VCCO_01.2–3.3V I/O bank supply for Bank 0
T14GNDSignal reference plane for adjacent I/O banks
Y16MRCCMulti-Region Clock Capable input for global clock distribution
W15SRCCSingle-Region Clock Capable input for regional clock networks
A12GTGREFCLK0Reference clock input for GT transceiver bank 0
B11GTHTXN0Differential negative transmit output for GT lane 0

Key Features

FeatureDesign Value
Integrated Multi-Gigabit Transceivers8 GT lanes operating up to 6.6 Gbps - enables native PCIe Gen2 and SATA 3G interfaces without external PHY
SelectIO™ TechnologySupports 18 I/O standards including LVDS, SSTL-18, and HSTL - simplifies interface to DDR3, ADCs, and FPGAs
Partial ReconfigurationAllows dynamic logic module swapping during operation - reduces system downtime in mission-critical applications
Bitstream EncryptionAES-256 with HMAC authentication - protects intellectual property against cloning and reverse engineering
Distributed RAM2,124 kbits of fast LUT-based RAM - used for small buffers, shift registers, and state machine storage

Applications

PCIe Gen2 EndpointGigabit Ethernet Interface

Use Scenario: High-speed add-in card for host CPU communication in industrial control systems.

IC Role / Device Role / Timing Role: PCIe endpoint implementing TLP packet generation, link training, and error reporting.

Use Value: 8 GT transceivers enable full x4 Gen2 link (5 GT/s per lane) with deterministic latency under 100 ns.

Use Scenario: Embedded network interface in programmable logic controllers (PLCs) with real-time traffic prioritization.

IC Role / Device Role / Timing Role: MAC-layer offload engine with integrated GMII/RGMII interface and time-stamped packet handling.

Use Value: 298 user I/Os support dual RGMII ports plus control signals, while block RAM buffers 128 KB of frame data.

Video Processing PipelineTest & Measurement Instrumentation

Use Scenario: Real-time 4K video scaling and color-space conversion in broadcast equipment.

IC Role / Device Role / Timing Role: Pixel-rate processing engine using DSP48E1 slices for chroma subsampling and 2D FIR filtering.

Use Value: 220 DSP slices deliver 440 GMAC/s peak throughput, enabling sub-frame latency for 60 fps 4K streams.

Use Scenario: Modular signal generator with programmable waveform synthesis and jitter injection.

IC Role / Device Role / Timing Role: Digital pattern generator controlling DAC timing, trigger sequencing, and calibration loop feedback.

Use Value: -2 speed grade ensures setup/hold timing margins >0.3 ns across 0–85°C, critical for <10 ps edge placement accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based high-speed interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC7A100T-2FGG676C101,440 logic cells, same package and GT count - higher logic density but identical I/O and transceiver capabilityPreferred when additional LUTs needed for complex control logic or larger state machinesSelect if design requires >75K LUTs without changing PCB layout or I/O constraints
XC7K160T-2FFG676CKintex-7 family, 162,240 logic cells, 12 GT lanes, larger die size - not pin-compatibleSuitable for designs requiring more transceivers or higher DSP resourcesChoose only with new board design; offers 50% more GT lanes but requires full layout revision

Compared with XC7A75T-2FGG676C, XC7A100T-2FGG676C provides headroom in logic utilization without layout change, while XC7K160T-2FFG676C delivers scalable transceiver bandwidth at the cost of mechanical and thermal redesign.

Availability

XC7A75T-2FGG676C is available at Aetrix Electronics and suitable for PCIe endpoint modules, industrial Ethernet gateways, video processing subsystems, and test instrumentation requiring stable component supply and long-term lifecycle support.

Supply support for XC7A75T-2FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, with leadership in FPGA, CPU, GPU, and AI accelerator technologies.

The Kintex-7 family, including XC7A75T-2FGG676C, was designed for cost-optimized high-performance applications demanding balanced logic, I/O, and transceiver resources in industrial and communications infrastructure.

FAQ

What is the maximum supported data rate for GT transceivers on XC7A75T-2FGG676C?

The XC7A75T-2FGG676C integrates 8 multi-gigabit GT transceivers rated for operation up to 6.6 Gbps. This enables compliance with PCIe Gen2 (5.0 GT/s), SATA III (6.0 Gbps), and CPRI (6.144 Gbps) protocols. Each GT lane supports programmable pre-emphasis and receiver equalization to maintain signal integrity over FR4 PCB traces.

Does XC7A75T-2FGG676C support partial reconfiguration?

Yes, XC7A75T-2FGG676C supports partial reconfiguration through Xilinx Vivado Design Suite. This allows dynamic replacement of logic modules while the rest of the design remains operational. Use cases include runtime protocol switching, firmware updates without system reset, and adaptive filter coefficient loading in signal processing pipelines.

What I/O standards are supported by XC7A75T-2FGG676C?

XC7A75T-2FGG676C supports 18 I/O standards via SelectIO™ technology, including LVDS, LVPECL, SSTL-18, SSTL-15, HSTL-I, HSTL-II, and TMDS. Each of its 14 I/O banks can be independently configured with different VCCO voltages (1.2V to 3.3V), enabling direct interfacing with DDR3 memory, ADCs, DACs, and other FPGAs.

What is the industrial temperature range for XC7A75T-2FGG676C?

XC7A75T-2FGG676C is specified for operation across the industrial temperature range of 0°C to +85°C ambient. Its thermal resistance values (θJA = 15.6°C/W, θJB = 3.5°C/W) and -2 speed grade ensure reliable timing closure and signal integrity under worst-case thermal conditions without derating.

How many block RAM resources does XC7A75T-2FGG676C provide?

XC7A75T-2FGG676C provides 3,494 kbits of total block RAM, implemented as 288 BRAM primitives (each 36 kbits). These are configurable as true dual-port RAM, single-port RAM, or shift registers. They support byte-write enable and parity generation, making them suitable for FIFOs, frame buffers, and lookup tables in real-time systems.

XC7A75T-2FGG676C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Artix-7
Package/Case:
676-BGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
5900
Number of Logic Elements/Cells:
75520
Total RAM Bits:
3870720
Number of I/O:
300
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FBGA (27x27)

XC7A75T-2FGG676C FAQ

1.How can I place an order for XC7A75T-2FGG676C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7A75T-2FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7A75T-2FGG676C reliable?

The price and inventory of XC7A75T-2FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A75T-2FGG676C is usually 5 days.

3.What payment methods are accepted for XC7A75T-2FGG676C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A75T-2FGG676C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7A75T-2FGG676C?

XC7A75T-2FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7A75T-2FGG676C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7A75T-2FGG676C?

For technical support, including XC7A75T-2FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A75T-2FGG676C requirements.

6.How does Aetrix verify that XC7A75T-2FGG676C is sourced from the original manufacturer or authorized distributors?

All XC7A75T-2FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A75T-2FGG676C meets industry standards.

7.What is the process for return or replacement of XC7A75T-2FGG676C?

All XC7A75T-2FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A75T-2FGG676C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7A75T-2FGG676C part is unused and in its original packaging.

Return procedure for XC7A75T-2FGG676C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7A75T-2FGG676C Tags

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