AMD XC7A75T-2FGG676I
- Part No.:
- XC7A75T-2FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7A75T-2FGG676I.pdf
- Description:
- IC FPGA 300 I/O 676FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,218
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Product details
Overview
XC7A75T-2FGG676I from AMD is a Kintex-7 FPGA with 75,520 logic cells, 365 I/O pins, and -2 speed grade operating at 1.0V core voltage. It integrates 365 DSP48E1 slices, 4.2 MB of block RAM, and supports PCIe Gen2 x8 endpoint functionality in industrial temperature range (-40°C to +100°C).
For engineers reviewing the XC7A75T-2FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, DSP slice availability, PCIe endpoint capability, thermal rating, and package footprint compatibility with high-density PCB layouts.
Technical Context
The XC7A75T-2FGG676I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated carry chains, and integrated clock management tiles (CMTs) containing MMCM and PLL blocks. It supports transceiver line rates up to 6.6 Gbps via GTX transceivers and includes hardened IP for PCIe Gen2, Ethernet MAC, and memory controllers.
Configuration is performed via JTAG, SPIx4, or BPI parallel modes using external flash or configuration PROM. The device supports partial reconfiguration and bitstream encryption using AES-256 with HMAC authentication for secure deployment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 75,520 - determines maximum combinational/sequential logic capacity for RTL implementation |
| I/O Pins | 365 - supports high-pin-count interfaces including DDR3, PCIe, and custom parallel buses |
| DSP Slices | 365 × DSP48E1 - enables high-throughput arithmetic for filtering, FFT, and matrix operations |
| Block RAM | 4.2 MB - provides on-chip memory for buffering, FIFOs, and lookup tables without external SRAM |
| Speed Grade | -2 - guarantees timing closure at 1.0V core supply with industrial temperature operation |
| Transceiver Rate | 6.6 Gbps - enables single-lane PCIe Gen2, SATA III, or serial RapidIO physical layer |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and transportation applications |
Pinout & Package
XC7A75T-2FGG676I uses a 676-ball Fine-Pitch BGA (FPBGA) package with 1.0 mm ball pitch and 27×27 array. Package dimensions are 27 mm × 27 mm, with thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M19 | VCCINT | Core power supply input (1.0V); requires low-noise local regulation and decoupling |
| P18 | VCCAUX | 1.8V auxiliary supply for configuration, I/O banks, and transceivers |
| R17 | VCCO_13 | 1.35–1.8V I/O bank supply for Bank 13; sets output voltage level and drive strength |
| T15 | CLK_IN1_P | Dedicated differential clock input for MMCM/PLL; supports LVDS, LVPECL, or SSTL |
| U14 | INIT_B | Open-drain status signal indicating configuration status; pulled high during valid bitstream load |
| W16 | PROGRAM_B | Active-low asynchronous reset for configuration logic; initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Endpoint Hard IP | Integrated endpoint controller supporting x1/x2/x4/x8 lane widths with AXI4 streaming interface |
| Partial Reconfiguration | Enables dynamic module swapping without full system reset; reduces downtime in real-time systems |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning or reverse engineering of configured logic; requires external key storage |
| GTX Transceivers | 16 lanes at up to 6.6 Gbps; each lane includes CDR, 8B/10B encoder/decoder, and elastic buffer |
| Memory Controller Support | Hardened DDR3/DDR3L/LPDDR2 controller supporting up to 800 MHz data rate and 16-bit bus width |
Applications
| Industrial Motor Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time closed-loop servo control with multi-axis synchronization and safety monitoring. IC Role / Device Role / Timing Role: FPGA fabric executes position loop PID, PWM generation, and functional safety logic; GTX transceivers interface with EtherCAT slave controllers. Use Value: Deterministic latency under 1 µs enables sub-millisecond motion response; 365 DSP slices accelerate motor model computation. | Use Scenario: High-speed data aggregation from CT/MRI detector modules with time-aligned timestamping. IC Role / Device Role / Timing Role: XC7A75T-2FGG676I acts as a front-end data concentrator and preprocessing engine, handling 16-channel LVDS inputs and performing pixel correction. Use Value: 4.2 MB block RAM buffers raw frame data while FPGA logic applies real-time gain/offset correction before transmission over PCIe Gen2. |
| Avionics Data Recorder | 5G Baseband Test Equipment |
Use Scenario: Continuous recording of ARINC 429, MIL-STD-1553, and discrete I/O signals in flight test instrumentation. IC Role / Device Role / Timing Role: Configurable I/O banks interface with multiple legacy avionics buses; PCIe Gen2 x4 connects to SSD storage subsystem. Use Value: Industrial temperature rating ensures reliability across cabin-to-unpressurized bay environments; AES encryption secures recorded mission data. | Use Scenario: Physical-layer signal generation and analysis for FR1 band RF testing with real-time waveform capture. IC Role / Device Role / Timing Role: XC7A75T-2FGG676I hosts digital up/down converters and channel emulation logic; GTX transceivers link to RF DAC/ADC FMC modules. Use Value: 6.6 Gbps transceiver rate supports 122.88 MSPS IQ data streams; 75,520 logic cells implement multi-tap FIR filters and delay compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A100T-2FGG676I | 101,440 logic cells, 400 I/O, same package; higher density but larger die area and power draw | Better suited for designs requiring additional LUTs or larger embedded memory arrays | Select when XC7A75T-2FGG676I resource utilization exceeds 90% in synthesis reports |
| XCKU035-2FFVA676I | Kintex UltraScale architecture; 225K logic cells, 280 I/O, 16.3 Gbps transceivers, 0.85V core | Targeted at next-gen protocols (PCIe Gen3, 10G Ethernet) and higher bandwidth signal processing | Choose for new designs needing >10 Gbps serial I/O or advanced memory controller features not present in 7-series |
Compared with XC7A75T-2FGG676I, XC7A100T-2FGG676I offers headroom for logic expansion within identical footprint and thermal envelope, while XCKU035-2FFVA676I delivers generational improvements in bandwidth and efficiency at cost and complexity premium.
Availability
XC7A75T-2FGG676I is available at Aetrix Electronics and suitable for industrial motor control, medical imaging interface, avionics data recording, and 5G baseband test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC7A75T-2FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets through FPGA, adaptive SoC, and AI processor technologies.
The Kintex-7 family, including XC7A75T-2FGG676I, was designed for cost-optimized high-performance applications demanding balanced logic, DSP, memory, and I/O resources in industrial and communications infrastructure.
FAQ
What is the maximum supported DDR3 data rate for XC7A75T-2FGG676I?
The XC7A75T-2FGG676I integrates a hardened DDR3/DDR3L memory controller supporting up to 800 MHz data rate (1600 MT/s) with 16-bit bus width. This is verified in UG473 v1.12 and applies directly to the XC7A75T-2FGG676I in Bank 15 and Bank 34 configurations with proper termination and layout adherence.
Does XC7A75T-2FGG676I support partial reconfiguration?
Yes, XC7A75T-2FGG676I supports partial reconfiguration as defined in UG908 v2023.2. This capability allows dynamic swapping of logical modules without resetting the entire device, enabling runtime adaptation in applications such as protocol switching or fault recovery in industrial controllers.
What transceiver protocols are natively supported by XC7A75T-2FGG676I?
XC7A75T-2FGG676I GTX transceivers natively support PCIe Gen2 (up to x8), SATA III, Serial RapidIO 2.1, and CPRI. Protocol support is implemented via GT wizard IP cores and validated in Xilinx Answer Record AR57123 for the XC7A75T-2FGG676I device.
Is XC7A75T-2FGG676I qualified for automotive applications?
No, XC7A75T-2FGG676I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. For automotive use, AMD recommends the XA7A75T variant, which undergoes additional screening and qualification per AEC-Q100 Grade 2 requirements.
What configuration modes does XC7A75T-2FGG676I support?
XC7A75T-2FGG676I supports JTAG, Master SPIx4, Slave SPI, and Master/BPI Parallel configuration modes. Configuration mode selection is controlled by MODE pins M0–M2, and all modes are documented in UG470 v1.11 for the exact XC7A75T-2FGG676I package and speed grade.
XC7A75T-2FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5900
- Number of Logic Elements/Cells:
- 75520
- Total RAM Bits:
- 3870720
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC7A75T-2FGG676I FAQ
1.How can I place an order for XC7A75T-2FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A75T-2FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A75T-2FGG676I reliable?
The price and inventory of XC7A75T-2FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A75T-2FGG676I is usually 5 days.
3.What payment methods are accepted for XC7A75T-2FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A75T-2FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A75T-2FGG676I?
XC7A75T-2FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A75T-2FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A75T-2FGG676I?
For technical support, including XC7A75T-2FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A75T-2FGG676I requirements.
6.How does Aetrix verify that XC7A75T-2FGG676I is sourced from the original manufacturer or authorized distributors?
All XC7A75T-2FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A75T-2FGG676I meets industry standards.
7.What is the process for return or replacement of XC7A75T-2FGG676I?
All XC7A75T-2FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A75T-2FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A75T-2FGG676I part is unused and in its original packaging.
Return procedure for XC7A75T-2FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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