AMD XC7A75T-2FTG256C

Overview

XC7A75T-2FTG256C from AMD is a Kintex-7 FPGA with 75,520 logic cells, 365 I/O pins, and a -2 speed grade operating at 1.0V core voltage. It integrates 365 DSP slices, 4.2 MB of block RAM, and supports PCIe Gen2 x8, DDR3-800 memory interface, and 6.6 Gb/s transceivers. It is used in high-performance industrial imaging and real-time signal processing systems.

For engineers reviewing the XC7A75T-2FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver speed, block RAM capacity, DSP slice density, and thermal performance in compact PCB layouts.

Technical Context

The XC7A75T-2FTG256C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and integrated clock management tiles (CMTs) containing MMCM and PLL blocks. It supports multi-gigabit transceivers compliant with PCIe Gen2, SATA, and CPRI protocols.

Its I/O bank structure includes 12 banks supporting LVDS, SSTL, HSTL, and TMDS signaling standards, with programmable output drive strength up to 24 mA and input termination options. The device uses SelectIO technology for flexible interface adaptation across mixed-voltage domains.

Key Specifications

Pinout & Package

XC7A75T-2FTG256C is housed in a 256-ball FTBGA (Fine-Pitch Ball Grid Array) package with 1.0 mm ball pitch, 11×11 mm footprint, and exposed thermal pad for enhanced heat dissipation in thermally constrained applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Compared with XC7A75T-2FTG256C, XC7K160T-2FFG676C offers greater resource headroom for scaling algorithms, while XCKU035-2FFVA676I provides architectural upgrades for bandwidth-critical applications-both require PCB redesign and toolchain migration.

Availability

XC7A75T-2FTG256C is available at Aetrix Electronics and suitable for industrial imaging, medical diagnostics, avionics data acquisition, and automated test equipment requiring stable component supply over extended production lifecycles.

Supply support for XC7A75T-2FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for datacenter, embedded, and aerospace applications.

The Kintex-7 family was designed for cost-optimized high-performance applications demanding balanced logic, memory, and I/O resources-targeting industrial automation, medical imaging, and communications infrastructure.

FAQ

What is the maximum supported DDR3 data rate for XC7A75T-2FTG256C?

The XC7A75T-2FTG256C supports DDR3-800 operation, delivering an effective data rate of 800 Mbps per pin with a 400 MHz clock. This is implemented via a hardened memory controller supporting 16-bit wide interfaces across two ranks. The -2 speed grade ensures timing closure under worst-case voltage and temperature conditions specified in the Kintex-7 DC and switching characteristics documentation.

Does XC7A75T-2FTG256C include built-in PCIe Gen2 endpoint functionality?

Yes, XC7A75T-2FTG256C integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.1. It supports link training, power management states (L0–L2), and transaction layer packet handling without soft-core implementation overhead. Configuration is managed through dedicated AXI4-Lite registers mapped into the FPGA's address space.

What thermal management considerations apply to XC7A75T-2FTG256C in sealed enclosures?

XC7A75T-2FTG256C features an exposed thermal pad compatible with standard solder reflow profiles. In sealed enclosures, thermal vias under the pad and copper pour on inner layers are required to maintain junction temperature ≤85°C at full utilization. Ambient temperature derating curves and power estimation tools in Vivado must be used to validate thermal margin before final layout.

Can XC7A75T-2FTG256C support partial reconfiguration in production systems?

Yes, XC7A75T-2FTG256C supports verified partial reconfiguration using Vivado Design Suite 2022.2 or later. Bitstream partitioning enables dynamic loading of logic modules such as filter coefficients or protocol stacks without resetting the entire device. Runtime validation requires internal configuration access port (ICAP) usage and proper frame-level CRC checking per Xilinx UG909 guidelines.

What I/O standards are supported by XC7A75T-2FTG256C's SelectIO banks?

XC7A75T-2FTG256C supports LVDS, Mini-LVDS, RSDS, BLVDS, SSTL-18/25, HSTL-I/II, POD12/15, and TMDS across its 12 I/O banks. Each bank operates at a user-defined VCCO voltage (1.2–3.3V), enabling mixed-standard interfaces on a single device. Differential standards require matched trace lengths and controlled impedance routing per UG471 specifications.