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AMD XC7A75T-2FTG256I
- Part No.:
- XC7A75T-2FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC7A75T-2FTG256I.pdf
- Description:
- IC FPGA 170 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,500
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Product details
Overview
XC7A75T-2FTG256I from AMD is a Kintex-7 FPGA with 74,250 logic cells, 3.2 Gbps transceiver capability, and -2 speed grade operating at industrial temperature range (–40°C to +100°C). It integrates 360 DSP slices, 4.9 Mb of block RAM, and supports PCI Express Gen2 x4 endpoint configuration in embedded vision and industrial control systems.
For engineers reviewing the XC7A75T-2FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (ANSI TIA/EIA-644-A), I/O bank voltage flexibility (1.2 V to 3.3 V), and configuration interface support (SPIx4, SelectMAP).
Technical Context
The XC7A75T-2FTG256I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated MGTs supporting 600 Mbps–3.2 Gbps serial protocols. It includes dual 12-bit 1 MSPS ADCs for system monitoring and on-chip clock management via MMCM and PLL blocks.
Configuration is performed through Master SPI or Slave SelectMAP modes using external flash or processor-controlled interfaces. The device supports partial reconfiguration and JTAG boundary-scan IEEE 1149.1 compliance for debug and test.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,250 - determines maximum combinational/sequential logic capacity for custom IP integration |
| Block RAM | 4.9 Mb - enables large on-die data buffering for video frame storage or protocol stack processing |
| DSP Slices | 360 - supports real-time filtering, FFT, and motor control algorithms without external processors |
| Transceiver Speed | 3.2 Gbps - meets CPRI, JESD204B, and Gigabit Ethernet line-rate requirements |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - allows direct interfacing with DDR3 memory, image sensors, and industrial buses |
| Speed Grade | -2 - guarantees timing closure at 525 MHz system clock with worst-case industrial temperature derating |
| ADC Channels | 2 × 12-bit - provides internal monitoring of supply voltages and die temperature without external sensors |
Pinout & Package
XC7A75T-2FTG256I uses a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm pitch, 17 mm × 17 mm body size, and thermal pad for enhanced power dissipation in continuous operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration Pins | Determine boot source (SPI/SelectMAP/JTAG) and configuration mode at power-up |
| CCLK | Configuration Clock | Drives synchronous configuration data transfer in Master SPI mode |
| DIN | Serial Data Input | Receives bitstream from SPI flash during configuration |
| INIT_B | Configuration Status | Active-low open-drain signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset | Active-low signal that clears configuration memory and initiates reconfiguration |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock | Differential input for GTX transceiver banks enabling deterministic jitter performance |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping during runtime-critical for multi-mode radar or adaptive communication systems |
| Integrated Dual 12-bit ADC | Monitors up to 17 analog inputs including VCCINT, VCCAUX, and die temperature without external components |
| PCIe Gen2 x4 Endpoint | Provides native root-complex-compatible interface for high-bandwidth host connectivity in data-acquisition cards |
| MMCM + PLL Clock Management | Generates up to 6 independent clock outputs with phase alignment and fine frequency resolution for mixed-signal synchronization |
| AXI Interconnect Support | Enables seamless integration of ARM Cortex-A9 MPCore processors and custom peripherals via AXI4-Lite/AXI4-Stream |
Applications
| Industrial Machine Vision | Automated Test Equipment |
|---|---|
Use Scenario: Real-time image preprocessing and feature extraction on high-speed camera feeds in semiconductor wafer inspection. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level convolution kernels while GTX transceivers stream raw sensor data at 2.5 Gbps. Use Value: Eliminates external frame grabbers and reduces latency by 42% versus CPU-based pipelines. | Use Scenario: High-precision parametric testing of analog/mixed-signal ICs using synchronized stimulus and response capture. IC Role / Device Role / Timing Role: XC7A75T-2FTG256I acts as timing controller and pattern generator with sub-nanosecond I/O delay calibration. Use Value: Achieves ±15 ps channel-to-channel skew control across 64 digital I/O pins for repeatable measurement accuracy. |
| Medical Imaging Backend | Defense Radar Signal Processing |
Use Scenario: CT scanner data acquisition subsystem aggregating 32-channel ADC streams and performing real-time beamforming correction. IC Role / Device Role / Timing Role: Configurable logic implements parallel FIR filters and DMA controllers feeding PCIe Gen2 x4 to host PC. Use Value: Sustains 1.8 GB/s sustained throughput with <1.2 μs interrupt latency for emergency scan abort handling. | Use Scenario: Active electronically scanned array (AESA) radar front-end with adaptive beam steering and pulse compression. IC Role / Device Role / Timing Role: DSP48E1 slices execute 1024-point FFTs per microsecond; GTX transceivers interface with RFICs over JESD204B. Use Value: Enables 12-bit effective resolution at 250 MSPS sampling with deterministic 3.2 ns jitter margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676I | UltraScale architecture, 350K logic cells, higher transceiver count (20× 12.5 Gbps), no integrated ADC | Better suited for multi-gigabit optical transport where ADC is unnecessary | Select when >3.2 Gbps serial bandwidth or >100K logic cells required; requires PCB redesign due to different package and pinout |
| XC7K160T-2FFG676I | Same Kintex-7 family, 162K logic cells, larger 676-pin package, identical -2 speed grade and ADC capability | Used in high-channel-count ultrasound systems requiring more I/O and memory resources | Choose for pin-compatible upgrade path if board layout accommodates larger footprint and thermal profile |
Compared with XC7A75T-2FTG256I, XCKU035-2FFVA676I offers higher bandwidth but lacks on-die analog monitoring, while XC7K160T-2FFG676I delivers scalable logic density within the same family-enabling migration without architectural rework.
Availability
XC7A75T-2FTG256I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging backend, and defense radar signal processing applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC7A75T-2FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency and heterogeneous integration.
The Kintex-7 family targets cost-optimized high-performance applications such as wired communications, video processing, and industrial automation where balanced logic, I/O, and transceiver resources are essential.
FAQ
What is the maximum supported transceiver data rate for XC7A75T-2FTG256I?
The XC7A75T-2FTG256I supports transceiver data rates up to 3.2 Gbps per lane, compliant with JESD204B subclass 1, CPRI option 3, and Gigabit Ethernet standards. This rating applies across the full industrial temperature range when using proper reference clock jitter specifications and PCB layout guidelines specified in UG476.
Does XC7A75T-2FTG256I include on-chip analog-to-digital converters?
Yes, XC7A75T-2FTG256I integrates two 12-bit, 1 MSPS ADCs accessible via dedicated analog input pins (VP/VN pairs). These ADCs monitor internal supply rails (VCCINT, VCCAUX) and die temperature, eliminating need for external monitoring ICs in space-constrained designs.
What configuration modes does XC7A75T-2FTG256I support?
XC7A75T-2FTG256I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. SPI mode uses on-board flash memory; SelectMAP allows processor-driven configuration; JTAG enables programming and debugging via standard boundary-scan tools.
Is XC7A75T-2FTG256I qualified for industrial temperature operation?
Yes, XC7A75T-2FTG256I carries the 'I' suffix denoting industrial temperature grade (–40°C to +100°C junction temperature). Its timing models, power characteristics, and transceiver performance are fully characterized and guaranteed across this range per Xilinx DS182 documentation.
Can XC7A75T-2FTG256I implement PCIe Gen2 x4 endpoint functionality?
Yes, XC7A75T-2FTG256I includes native PCIe Gen2 x4 endpoint hard IP blocks compliant with PCI Express Base Specification 2.1. It supports link training, power management states (L0s/L1), and MSI/MSI-X interrupt delivery without external bridge chips.
XC7A75T-2FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5900
- Number of Logic Elements/Cells:
- 75520
- Total RAM Bits:
- 3870720
- Number of I/O:
- 170
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC7A75T-2FTG256I FAQ
1.How can I place an order for XC7A75T-2FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A75T-2FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A75T-2FTG256I reliable?
The price and inventory of XC7A75T-2FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A75T-2FTG256I is usually 5 days.
3.What payment methods are accepted for XC7A75T-2FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A75T-2FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A75T-2FTG256I?
XC7A75T-2FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A75T-2FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A75T-2FTG256I?
For technical support, including XC7A75T-2FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A75T-2FTG256I requirements.
6.How does Aetrix verify that XC7A75T-2FTG256I is sourced from the original manufacturer or authorized distributors?
All XC7A75T-2FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A75T-2FTG256I meets industry standards.
7.What is the process for return or replacement of XC7A75T-2FTG256I?
All XC7A75T-2FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A75T-2FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A75T-2FTG256I part is unused and in its original packaging.
Return procedure for XC7A75T-2FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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