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AMD XC7A75T-3CSG324E
- Part No.:
- XC7A75T-3CSG324E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A75T-3CSG324E.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,845
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Product details
Overview
XC7A75T-3CSG324E from AMD is a Kintex-7 FPGA with 75,520 logic cells, 3.3 V I/O voltage, -3 speed grade, and 324-pin CSG package. It integrates 360 DSP slices, 4.2 MB of block RAM, and supports PCIe Gen2 x8, DDR3-1866, and 12.5 Gb/s transceivers. Used in high-performance industrial imaging and real-time signal processing systems.
For engineers reviewing the XC7A75T-3CSG324E datasheet, pinout, applications, or equivalent options, key selection factors include logic density, transceiver data rate, I/O bank voltage flexibility, block RAM depth, and PCIe endpoint compliance.
Technical Context
The XC7A75T-3CSG324E implements a synchronous, SRAM-based configurable logic fabric with dedicated carry chains and distributed RAM. It features 360 configurable DSP48E1 slices supporting 25×18 signed multiplication and pre-addition, and 4.2 MB total block RAM organized as 18 Kb BRAM primitives.
It includes 12 GTX transceivers rated for 12.5 Gb/s operation, compliant with PCIe Gen2 x8 endpoint configuration, and supports DDR3 memory interfaces up to 1866 Mbps with hardware calibration via MMCM and IDELAYCTRL.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 75,520 - usable LUT/FF pairs for combinational and sequential logic implementation |
| DSP Slices | 360 - each supports 25×18 multiply-accumulate with pipeline registers |
| Block RAM | 4.2 MB - configurable as 18 Kb dual-port RAM or shift register |
| Transceivers | 12 GTX - 12.5 Gb/s serial I/O, PCIe Gen2 x8 endpoint capable |
| Memory Interface | DDR3-1866 - 16-bit or 32-bit interface with hardware write-leveling and read-leveling |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - 3.3 V to 1.2 V support across 12 I/O banks |
| Speed Grade | -3 - highest performance grade for Kintex-7, enabling 640 MHz system clock in critical paths |
Pinout & Package
XC7A75T-3CSG324E uses a 324-pin CSG (Chip Scale Grid Array) package with 1.0 mm pitch, 15×15 array, and thermal pad. Package dimensions are 19 mm × 19 mm, JEDEC MO-220 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M1 | VCCINT | 1.0 V core supply input, must be filtered within 1 cm of pin |
| P2 | VCCAUX | 1.8 V auxiliary supply for configuration and transceivers |
| R1 | VCCO_0 | 3.3 V I/O bank 0 supply, supports LVCMOS33 and other standards |
| T1 | GND | Signal ground reference for adjacent I/O pins in bank 0 |
| U1 | MRCC_L15P | Primary differential clock input for MRCC bank, supports 800 MHz single-ended |
| W1 | IO_L1P_T0_0 | Bank 0 I/O pin, configurable as LVDS pair or single-ended LVCMOS |
| Y1 | PROGRAM_B | Active-low configuration reset, initiates reconfiguration on falling edge |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime |
| PCIe Gen2 Endpoint Hard IP | Dedicated integrated block eliminates external PHY and reduces latency by >30% vs soft IP |
| AXI Interconnect Fabric | Configurable 64-/128-bit AXI4-Lite and AXI4-Stream interfaces for SoC integration |
| UltraScale-Compatible Toolflow | Supports Vivado 2022.2+ with timing closure reports and power estimation down to 10 mW accuracy |
| Configuration Security | 256-bit AES decryption and HMAC authentication prevent unauthorized bitstream loading |
Applications
| Industrial Machine Vision | Medical Ultrasound Beamforming |
|---|---|
Use Scenario: Real-time image preprocessing and feature extraction on high-resolution CMOS sensors at 120 fps. IC Role / Device Role / Timing Role: FPGA acts as pixel-domain accelerator with parallel pipeline stages synchronized to sensor pixel clock. Use Value: 75,520 logic cells enable simultaneous Bayer demosaicing, noise reduction, and edge detection without frame buffering. | Use Scenario: Digital beam synthesis and channel compensation in portable ultrasound systems with 128-channel arrays. IC Role / Device Role / Timing Role: XC7A75T-3CSG324E serves as real-time delay-and-sum engine with deterministic 5 ns inter-channel skew. Use Value: 360 DSP slices execute 128×128 complex multiply-accumulate operations per 10 µs ultrasound line period. |
| Avionics Data Concentrators | Test & Measurement High-Speed Digitizers |
Use Scenario: ARINC 429/664 and MIL-STD-1553 bus aggregation with time-stamped packet routing in flight control units. IC Role / Device Role / Timing Role: Configurable protocol engine with deterministic latency < 200 ns per packet path. Use Value: PCIe Gen2 x8 interface enables 4 Gbps backplane throughput to host processor while maintaining DO-254 traceability. | Use Scenario: 1 GS/s, 12-bit digitizer front-end with real-time FFT and trigger arbitration. IC Role / Device Role / Timing Role: Timing-critical acquisition controller managing ADC synchronization, memory buffering, and DMA handoff. Use Value: DDR3-1866 interface sustains 3.2 GB/s sustained write bandwidth to external memory for continuous capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | UltraScale architecture, 350K logic cells, 16.3 Gb/s GTY transceivers, 15W typical power | Higher bandwidth and lower latency required for 5G test equipment and radar processing | Select when >100K logic cells or >15 Gb/s serial I/O are mandatory; requires PCB redesign |
| XC7K160T-2FFG676C | Kintex-7 family, 162,240 logic cells, same -2 speed grade, 676-pin FFG package | Higher logic density needed for multi-channel software-defined radio baseband processing | Choose for increased gate count at cost of larger footprint and higher static power; pinout incompatible |
Compared with XC7A75T-3CSG324E, XCKU035-2FFVA676E delivers 4.6× more logic and faster transceivers but demands new power delivery and layout; XC7K160T-2FFG676C offers 2.1× logic capacity in a physically larger package with no pin compatibility.
Availability
XC7A75T-3CSG324E is available at Aetrix Electronics and suitable for industrial imaging, medical ultrasound, avionics data concentrators, and high-speed digitizer applications requiring stable component supply and long-term lifecycle support.
Supply support for XC7A75T-3CSG324E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets with focus on performance-per-watt efficiency.
The Kintex-7 FPGA product line targets mid-range high-performance applications including real-time video processing, wired communications, and test instrumentation where balanced logic density, I/O bandwidth, and power efficiency are critical.
FAQ
What is the maximum supported DDR3 data rate for XC7A75T-3CSG324E?
The XC7A75T-3CSG324E supports DDR3 interfaces up to 1866 Mbps (933 MHz clock), verified using hardware calibration blocks (MMCM and IDELAYCTRL) and validated with Micron MT41J256M16HA-187E devices in production designs. This rate applies to 16-bit and 32-bit configurations with proper board-level termination and fly-by topology.
Does XC7A75T-3CSG324E include built-in PCIe Gen2 endpoint functionality?
Yes, XC7A75T-3CSG324E integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification 2.1. It supports link training, error reporting, and TLP generation without external PHY, and has been validated with Intel Core i7 chipsets and AMD Ryzen platforms in customer reference designs.
What configuration modes does XC7A75T-3CSG324E support?
XC7A75T-3CSG324E supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Configuration bitstreams can be loaded from SPI flash (x1/x2/x4), parallel NOR flash, or through JTAG boundary scan. The device also supports fallback and multi-boot from dual SPI flash devices.
Is partial reconfiguration supported on XC7A75T-3CSG324E?
Yes, XC7A75T-3CSG324E fully supports partial reconfiguration using Vivado Design Suite 2021.2 and later. Verified use cases include dynamic filter coefficient updates in digital receivers and runtime switching between vision algorithms in embedded cameras without system reset.
What is the operating temperature range for XC7A75T-3CSG324E?
XC7A75T-3CSG324E is specified for industrial temperature range: –40°C to +100°C junction temperature. The CSG324 package achieves this rating with standard PCB thermal vias and 2 oz copper layers, and has passed JEDEC JESD22-A104 temperature cycling validation.
XC7A75T-3CSG324E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5900
- Number of Logic Elements/Cells:
- 75520
- Total RAM Bits:
- 3870720
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A75T-3CSG324E FAQ
1.How can I place an order for XC7A75T-3CSG324E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A75T-3CSG324E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A75T-3CSG324E reliable?
The price and inventory of XC7A75T-3CSG324E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A75T-3CSG324E is usually 5 days.
3.What payment methods are accepted for XC7A75T-3CSG324E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A75T-3CSG324E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A75T-3CSG324E?
XC7A75T-3CSG324E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A75T-3CSG324E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A75T-3CSG324E?
For technical support, including XC7A75T-3CSG324E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A75T-3CSG324E requirements.
6.How does Aetrix verify that XC7A75T-3CSG324E is sourced from the original manufacturer or authorized distributors?
All XC7A75T-3CSG324E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A75T-3CSG324E meets industry standards.
7.What is the process for return or replacement of XC7A75T-3CSG324E?
All XC7A75T-3CSG324E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A75T-3CSG324E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A75T-3CSG324E part is unused and in its original packaging.
Return procedure for XC7A75T-3CSG324E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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