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AMD XC7A75T-3FGG484E
- Part No.:
- XC7A75T-3FGG484E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC7A75T-3FGG484E.pdf
- Description:
- IC FPGA 285 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,724
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Product details
Overview
XC7A75T-3FGG484E from AMD is a Kintex-7 FPGA with 75,520 logic cells, 3.3 V I/O voltage support, -3 speed grade, and 484-pin Fine-Pitch Flip-Chip BGA (FFG) package. It integrates 360 DSP slices, 4.2 MB of block RAM, and supports PCIe Gen2 x8 endpoint functionality in industrial motor control and high-speed data acquisition systems.
For engineers reviewing the XC7A75T-3FGG484E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (350 user I/Os), transceiver line rate (6.6 Gb/s), thermal performance (100°C junction temperature), and configuration interface compatibility (SPIx4, JTAG, SelectMAP).
Technical Context
The XC7A75T-3FGG484E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated MGT transceivers supporting multi-gigabit serial protocols. It includes dual 32-bit AXI interconnect infrastructure and hardened memory controllers for DDR3/DDR2/LPDDR2.
Configuration is performed via Master SPI, Slave SelectMAP, or JTAG; bitstream encryption and HMAC authentication are supported. The device operates across Industrial temperature range (-40°C to +100°C) and requires separate VCCINT (1.0V), VCCAUX (1.8V), and VCCO (1.2–3.3V) supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 75,520 - determines maximum combinational and sequential logic capacity for HDL synthesis |
| User I/O Pins | 350 - supports high-density board routing with bank-wise voltage and standard flexibility |
| DSP Slices | 360 - enables parallel multiply-accumulate operations up to 18×25-bit per slice |
| Block RAM | 4.2 MB - provides on-chip memory for FIFOs, buffers, and lookup tables without external DRAM |
| Transceiver Line Rate | 6.6 Gb/s - enables PCIe Gen2 x8, SATA III, or CPRI links with embedded clocking |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for this family variant |
| Junction Temp | 100°C - qualifies for extended-temperature industrial deployments without derating |
Pinout & Package
XC7A75T-3FGG484E uses a 484-pin Fine-Pitch Flip-Chip BGA (FFG) package with 23×23 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-271AC footprint. Thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G19 | VCCINT | Core logic supply (1.0V ±3%) - must be filtered and decoupled near package |
| K20 | VCCAUX | Auxiliary supply (1.8V ±3%) - powers configuration, clocking, and transceiver analog circuitry |
| R18 | VCCO_14 | I/O bank 14 supply (1.2–3.3V) - sets voltage level and drive strength for associated pins |
| T15 | M0 | Configuration mode select - low during power-up to enable Master SPI boot |
| Y16 | INIT_B | Open-drain status signal - asserted low during configuration error or CRC failure |
| W15 | CCLK | Configuration clock input - driven externally in Master SPI mode or internally in Slave modes |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Hardened endpoint block eliminates need for soft IP, reducing latency and resource usage |
| AXI Interconnect | Dual 32-bit AXI4-Lite/AXI4 master/slave interfaces simplify SoC integration with processors and peripherals |
| DDR3 Memory Controller | Integrated controller supports 800–1066 Mbps data rates with calibration and ECC support |
| Bitstream Encryption | AES-256 encryption with HMAC authentication prevents unauthorized configuration and cloning |
| Partial Reconfiguration | Enables dynamic logic module swapping without full device reset or system interruption |
Applications
| Industrial Motor Control | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of servo drives with sub-microsecond loop timing. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop PWM generation, encoder interpolation, and safety monitoring logic. Use Value: 75,520 logic cells and 360 DSP slices enable concurrent execution of multiple FOC axes and safety-certified diagnostics. | Use Scenario: Multi-channel oscilloscope capturing at 1 GS/s with real-time FFT and trigger processing. IC Role / Device Role / Timing Role: Configurable logic processes ADC samples, applies digital filters, and streams data over PCIe Gen2 x8. Use Value: 6.6 Gb/s transceivers and 4.2 MB block RAM allow sustained 8 Gb/s data throughput with zero-drop buffering. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Ultrasound beamforming engine aggregating and phase-aligning hundreds of echo channels. IC Role / Device Role / Timing Role: DSP48E1 slices perform fixed-point delay-and-sum operations; CLBs manage channel synchronization and data packing. Use Value: 360 DSP slices deliver >1.2 TFLOPS peak fixed-point throughput for real-time image reconstruction. | Use Scenario: Automated test equipment (ATE) executing parallel DUT stimulus/response validation across 64 pins. IC Role / Device Role / Timing Role: FPGA implements high-precision pattern generators, comparators, and pass/fail decision logic. Use Value: 350 user I/Os and -3 speed grade support simultaneous 64-bit vector I/O at 200 MHz with deterministic timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A100T-3FGG484E | 101,440 logic cells, 480 DSP slices, same package and speed grade | Higher gate count supports larger algorithm partitions and additional peripheral IP | Select when design exceeds XC7A75T-3FGG484E resource utilization by >15% |
| XC7A50T-3FGG484E | 50,040 logic cells, 240 DSP slices, same package and speed grade | Lower cost and power for simpler control or bridging functions with reduced I/O or compute needs | Select when design fits within 50K LC budget and requires <300 DSP slices |
Compared with XC7A75T-3FGG484E, the XC7A100T-3FGG484E offers headroom for future feature expansion while maintaining identical pinout and thermal profile; the XC7A50T-3FGG484E reduces BOM cost and static power by ~35% but constrains real-time processing bandwidth.
Availability
XC7A75T-3FGG484E is available at Aetrix Electronics and suitable for industrial motor control, high-speed data acquisition, and medical imaging backend systems requiring stable component supply and long-term production continuity.
Supply support for XC7A75T-3FGG484E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client applications through high-performance and energy-efficient architectures.
The Kintex-7 family targets cost-optimized, high-performance applications including wired communications, video processing, and industrial automation where balanced logic, DSP, and I/O resources are critical.
FAQ
What is the maximum supported DDR3 data rate for XC7A75T-3FGG484E?
The XC7A75T-3FGG484E integrates a hardened DDR3 memory controller supporting data rates up to 1066 Mbps (533 MHz clock). This controller includes built-in calibration logic and optional ECC support, enabling reliable interfacing with standard DDR3 SODIMMs or discrete components in high-throughput buffer applications. XC7A75T-3FGG484E does not support DDR4 or LPDDR4.
Does XC7A75T-3FGG484E support partial reconfiguration?
Yes, XC7A75T-3FGG484E supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated frame-based bitstream loading mechanism. This allows dynamic replacement of logic modules without resetting the entire device or halting system operation. XC7A75T-3FGG484E requires Vivado Design Suite 2018.2 or later for implementation and verification of partial bitstreams.
What configuration modes are supported by XC7A75T-3FGG484E?
XC7A75T-3FGG484E supports Master SPI, Slave SelectMAP, JTAG, and Slave Serial configuration modes. Master SPI is most common for single-device boot from quad-SPI flash; Slave SelectMAP enables high-speed parallel loading from microcontrollers or processors. XC7A75T-3FGG484E requires correct M[2:0] pin states at power-up to select the active mode.
Is XC7A75T-3FGG484E qualified for automotive applications?
No, XC7A75T-3FGG484E is specified for Industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, fault injection coverage, and qualification documentation. For automotive use, AMD offers the XA7A75T variant with extended screening and automotive-grade documentation. XC7A75T-3FGG484E remains suitable for industrial and medical equipment.
What is the purpose of the INIT_B pin on XC7A75T-3FGG484E?
INIT_B is an open-drain, active-low output that signals configuration status: it remains low during power-up and initial configuration, goes high upon successful bitstream load, and pulses low if CRC error, IDCODE mismatch, or watchdog timeout occurs. XC7A75T-3FGG484E uses INIT_B to coordinate system-level reset sequencing and provide visible fault indication during field deployment.
XC7A75T-3FGG484E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5900
- Number of Logic Elements/Cells:
- 75520
- Total RAM Bits:
- 3870720
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC7A75T-3FGG484E FAQ
1.How can I place an order for XC7A75T-3FGG484E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A75T-3FGG484E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A75T-3FGG484E reliable?
The price and inventory of XC7A75T-3FGG484E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A75T-3FGG484E is usually 5 days.
3.What payment methods are accepted for XC7A75T-3FGG484E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A75T-3FGG484E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A75T-3FGG484E?
XC7A75T-3FGG484E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A75T-3FGG484E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A75T-3FGG484E?
For technical support, including XC7A75T-3FGG484E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A75T-3FGG484E requirements.
6.How does Aetrix verify that XC7A75T-3FGG484E is sourced from the original manufacturer or authorized distributors?
All XC7A75T-3FGG484E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A75T-3FGG484E meets industry standards.
7.What is the process for return or replacement of XC7A75T-3FGG484E?
All XC7A75T-3FGG484E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A75T-3FGG484E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A75T-3FGG484E part is unused and in its original packaging.
Return procedure for XC7A75T-3FGG484E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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