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AMD XC7A75T-3FGG676E
- Part No.:
- XC7A75T-3FGG676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7A75T-3FGG676E.pdf
- Description:
- IC FPGA 300 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,171
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Product details
Overview
XC7A75T-3FGG676E from AMD is a Kintex-7 FPGA with 75,520 logic cells, 340 I/O pins, and -3 speed grade, configured in a 676-pin Fine-Pitch Flip-Chip BGA (FPGA package FGG676) for high-performance industrial control and video processing systems.
For engineers reviewing the XC7A75T-3FGG676E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), embedded Block RAM (3.8 Mbit), DSP48E1 slices (360), and thermal performance in industrial ambient conditions.
Technical Context
The XC7A75T-3FGG676E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated transceivers supporting up to 6.6 Gb/s line rates. It supports SelectIO™ technology with programmable I/O standards and on-die termination.
Configuration is performed via JTAG, Master SPI, or Slave SelectMAP modes. The device includes dual-boot capability, AES encryption for bitstream security, and built-in system monitoring with on-chip temperature and supply sensors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 75,520 - total available LUTs + flip-flops for combinational and sequential logic implementation |
| I/O Pins | 340 - user-configurable bidirectional pins with programmable drive strength and slew rate |
| Block RAM | 3.8 Mbit - distributed across 280 BRAM blocks (18 Kb each), usable as memory or FIFO |
| DSP Slices | 360 - DSP48E1 units supporting 25×18 multiply-accumulate operations per cycle |
| Transceiver Speed | 6.6 Gb/s - maximum serial line rate per GTPE2 transceiver channel |
| Speed Grade | -3 - highest commercial speed bin, enabling higher clock frequencies than -2 or -1 grades |
| Operating Temp | 0°C to 100°C - junction temperature range qualified for extended industrial applications |
Pinout & Package
Package: 676-pin Fine-Pitch Flip-Chip BGA (FGG676), 27×27 mm body, 1.0 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, clock management, and transceivers |
| VCCO_0 | I/O bank power | Programmable 1.2–3.3V supply per I/O bank; sets voltage standard for associated pins |
| M0–M2 | Mode configuration pins | Determine boot source (JTAG, SPI, SelectMAP) at power-up |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness |
| CCLK | Configuration clock | Input clock for Master SPI mode; output clock for Slave SelectMAP mode |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime |
| AES Bitstream Encryption | 256-bit AES key protection prevents unauthorized configuration and IP theft |
| Integrated System Monitor | On-die ADC measures die temperature and supply voltages (VCCINT, VCCAUX, VCCBRAM) |
| PCIe Gen2 x4 Endpoint | Built-in hard IP block supporting root complex or endpoint operation without soft-core overhead |
| UltraFast Memory Interface | Hardened DDR3/DDR3L/LPDDR2 controller supporting up to 800 MHz data rate (1600 MT/s) |
Applications
| Industrial Machine Vision | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time image preprocessing and feature extraction on high-resolution camera feeds in automated inspection systems. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level filtering, histogram equalization, and edge detection pipelines with sub-microsecond latency. Use Value: 360 DSP48E1 slices enable parallel 2D convolution kernels; 340 I/O pins interface directly to CMOS image sensors and frame buffers. | Use Scenario: Accelerating CT/MRI reconstruction algorithms and DICOM data compression in portable diagnostic equipment. IC Role / Device Role / Timing Role: Configurable logic implements custom FFT engines and lossless JPEG-LS encoders synchronized to medical timing standards. Use Value: 3.8 Mbit Block RAM provides local buffer storage for multi-slice volumetric data; PCIe Gen2 x4 enables rapid host transfer of reconstructed images. |
| Avionics Data Concentrators | Test & Measurement Equipment |
Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control subsystems. IC Role / Device Role / Timing Role: FPGA implements protocol bridging, time-stamped logging, and deterministic packet scheduling with <1 µs jitter. Use Value: -3 speed grade ensures reliable operation at 200+ MHz clock domains; 0°C to 100°C qualification meets DO-254 environmental requirements. | Use Scenario: High-speed digital pattern generation and real-time signal analysis in automated test systems. IC Role / Device Role / Timing Role: FPGA serves as reconfigurable pattern engine and acquisition controller for multi-channel digitizers. Use Value: 6.6 Gb/s transceivers support JESD204B interface to ADC/DAC ICs; SelectIO™ supports LVDS, HSTL, and SSTL standards for mixed-signal board integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration and interface consolidation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A100T-3FGG676E | 101,440 logic cells, 400 I/O pins, same package and speed grade | Higher gate count supports larger designs with more concurrent functions | Select when additional CLBs or BRAM are required beyond XC7A75T-3FGG676E capacity |
| XC7A50T-3FGG676E | 50,040 logic cells, 210 I/O pins, same package and speed grade | Lower density reduces cost and power for less complex control or bridging roles | Choose when design fits within reduced resources and thermal envelope is tighter |
Compared with XC7A75T-3FGG676E, the XC7A100T-3FGG676E offers headroom for future feature expansion, while the XC7A50T-3FGG676E lowers BOM cost and static power by ~35%, making it suitable for resource-constrained edge nodes.
Availability
XC7A75T-3FGG676E is available at Aetrix Electronics and suitable for industrial automation, medical imaging systems, and avionics data concentrators requiring stable component supply across long production lifecycles.
Supply support for XC7A75T-3FGG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Kintex-7 family, including XC7A75T-3FGG676E, was designed for cost-optimized high-performance applications demanding balanced logic, memory, and I/O resources in industrial and aerospace environments.
FAQ
What is the maximum supported memory interface speed for XC7A75T-3FGG676E?
The XC7A75T-3FGG676E integrates a hardened UltraFast memory controller supporting DDR3, DDR3L, and LPDDR2 interfaces up to 800 MHz clock frequency (1600 MT/s data rate). This capability is implemented in dedicated hardware blocks, eliminating soft-core overhead and ensuring deterministic timing closure in memory-intensive applications.
Does XC7A75T-3FGG676E support partial reconfiguration?
Yes, XC7A75T-3FGG676E supports partial reconfiguration through its configuration logic and frame-based bitstream architecture. This allows runtime swapping of functional modules without resetting the entire device, enabling dynamic adaptation in applications like protocol conversion or multi-standard wireless baseband processing.
What configuration modes are available for XC7A75T-3FGG676E?
XC7A75T-3FGG676E supports three primary configuration modes: JTAG (for debugging and programming), Master SPI (using internal oscillator to drive external flash), and Slave SelectMAP (host-controlled parallel loading). Mode selection is determined by M0–M2 pin states at power-up.
Is XC7A75T-3FGG676E qualified for extended temperature operation?
Yes, XC7A75T-3FGG676E is rated for 0°C to 100°C junction temperature operation and is qualified under AMD's extended industrial temperature grade (E suffix). This makes it suitable for deployment in uncontrolled environments such as factory floors, outdoor kiosks, and airborne equipment bays.
How many GTPE2 transceiver quads does XC7A75T-3FGG676E include?
XC7A75T-3FGG676E includes four GTPE2 transceiver quads, providing up to 16 transceiver channels. Each channel supports serial line rates from 600 Mb/s to 6.6 Gb/s and protocols including PCIe Gen2, SATA, and CPRI, enabling high-bandwidth interconnect in test equipment and communications infrastructure.
XC7A75T-3FGG676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5900
- Number of Logic Elements/Cells:
- 75520
- Total RAM Bits:
- 3870720
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC7A75T-3FGG676E FAQ
1.How can I place an order for XC7A75T-3FGG676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A75T-3FGG676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A75T-3FGG676E reliable?
The price and inventory of XC7A75T-3FGG676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A75T-3FGG676E is usually 5 days.
3.What payment methods are accepted for XC7A75T-3FGG676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A75T-3FGG676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A75T-3FGG676E?
XC7A75T-3FGG676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A75T-3FGG676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A75T-3FGG676E?
For technical support, including XC7A75T-3FGG676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A75T-3FGG676E requirements.
6.How does Aetrix verify that XC7A75T-3FGG676E is sourced from the original manufacturer or authorized distributors?
All XC7A75T-3FGG676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A75T-3FGG676E meets industry standards.
7.What is the process for return or replacement of XC7A75T-3FGG676E?
All XC7A75T-3FGG676E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A75T-3FGG676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A75T-3FGG676E part is unused and in its original packaging.
Return procedure for XC7A75T-3FGG676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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