My Inquiry
My Account
AMD XC7A75T-L1CSG324I
- Part No.:
- XC7A75T-L1CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A75T-L1CSG324I.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,026
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7A75T-L1CSG324I from AMD is a Kintex-7 FPGA with 75,520 logic cells, 365 I/O pins, and -1L speed grade operating at 1.0V core voltage. It integrates 365 DSP slices, 4.2 MB of block RAM, and supports PCIe Gen2 x8, DDR3-800 memory interface, and 6.6 Gb/s transceivers. It is used in high-performance industrial imaging and real-time signal processing systems.
For engineers reviewing the XC7A75T-L1CSG324I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, transceiver data rate, block RAM capacity, speed grade compatibility, and thermal performance in compact PCB layouts.
Technical Context
The XC7A75T-L1CSG324I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated clock management tiles (CMT) with MMCM and PLL for low-jitter clock synthesis. It supports SelectIO standards including LVDS, SSTL, HSTL, and MIPI D-PHY.
Its transceiver bank includes eight GTPE2 transceivers capable of 6.6 Gb/s line rates, supporting protocols such as CPRI, Aurora, and Gigabit Ethernet. The device uses a 324-pin CSG (Chip-Scale Grid Array) package with 0.8 mm pitch and exposes 365 user-configurable I/Os across 14 banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 75,520 - determines maximum combinational/sequential logic density for custom RTL implementation |
| I/O Pins | 365 - supports high-pin-count interfaces like parallel camera sensors or multi-lane ADC/DAC buses |
| Block RAM | 4.2 MB - enables large on-chip buffering for video frame storage or FFT coefficient tables |
| DSP Slices | 365 - delivers 18-bit × 25-bit multiply-accumulate throughput for real-time filtering or modulation |
| Transceiver Rate | 6.6 Gb/s - meets CPRI Option 3 and GigE PHY requirements without external retimers |
| Speed Grade | -1L - specifies guaranteed timing closure at 1.0V core supply with extended temperature range operation |
| Package | CSG324 - 324-ball, 0.8 mm pitch, 15 mm × 15 mm footprint with thermal pad for industrial convection cooling |
Pinout & Package
The XC7A75T-L1CSG324I is housed in a 324-ball CSG package with exposed thermal pad, designed for industrial temperature range (–40°C to +100°C) and reflow-compatible assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% input required for CLB, BRAM, and DSP logic operation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, clock management, and transceiver analog circuitry |
| MGTAVCC | Transceiver analog supply | 1.0V supply for GTPE2 transceiver analog front-end; requires ultra-low-noise regulation |
| IO_L1P_T0_0 | User I/O bank 0 | Configurable as LVDS pair or single-ended SSTL-15 for DDR3 address/command interface |
| CCLK | Configuration clock | Input-only clock during master SPI or JTAG configuration; not usable in user logic |
| INIT_B | Configuration status | Open-drain output indicating configuration memory readiness; pulled high externally |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP enabling direct host CPU communication without external bridge logic |
| DDR3-800 Memory Controller | Hard macro supporting 16-bit/32-bit interfaces up to 400 MHz clock, reducing soft controller resource usage |
| MMCM + PLL Clock Management | Two independent clock synthesis units allow simultaneous generation of multiple phase-aligned clocks for mixed-signal synchronization |
| AXI Interconnect Support | Native integration with AXI4/AXI4-Lite protocols simplifies SoC subsystem interconnection and DMA engine interfacing |
| Partial Reconfiguration Ready | Supports dynamic module swapping in operational systems, enabling field-upgradable functionality without full reconfiguration |
Applications
| Industrial Machine Vision | Medical Ultrasound Beamforming |
|---|---|
Use Scenario: Real-time image preprocessing pipeline with multi-sensor fusion and ROI extraction. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level convolution, histogram equalization, and sensor synchronization using deterministic I/O timing. Use Value: 365 I/Os enable direct connection to 12-bit CMOS image sensors and high-speed LVDS video links without glue logic. | Use Scenario: Digital beamformer processing echo signals from 128-channel transducer arrays. IC Role / Device Role / Timing Role: XC7A75T-L1CSG324I performs channel delay alignment, FIR filtering, and envelope detection in fixed-point arithmetic. Use Value: 365 DSP slices deliver >20 GOPS peak compute for real-time B-mode image reconstruction at 60 fps. |
| Wireless Remote Radio Unit (RRU) | Test & Measurement Signal Analyzer |
Use Scenario: CPRI-based fronthaul interface between baseband unit and remote radio head in LTE/5G infrastructure. IC Role / Device Role / Timing Role: Transceiver bank handles 6.6 Gb/s CPRI lanes while fabric processes IQ data resampling and CFR. Use Value: Integrated GTPE2 transceivers eliminate need for external SerDes, reducing BOM cost and board area by 35%. | Use Scenario: High-resolution spectrum analysis with real-time FFT and digital down-conversion. IC Role / Device Role / Timing Role: XC7A75T-L1CSG324I implements dual 14-bit ADC interfaces, 4096-point pipelined FFT, and PCIe Gen2 x8 host streaming. Use Value: 4.2 MB block RAM buffers 2 million samples for zero-gap acquisition at 250 MS/s sample rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A100T-1CSG324I | 101,440 logic cells, same package and speed grade, higher DSP slice count (400) | Better suited for larger FFTs or multi-channel modulation where logic density exceeds 75K LUTs | Select when design requires >75K LUTs or additional DSP resources without changing PCB layout |
| XCKU035-1FFVA676I | Kintex UltraScale architecture, 280K logic cells, 16.3 Gb/s transceivers, different package (676-pin FCBGA) | Required for 5G NR physical layer acceleration or 100G Ethernet MAC offload | Choose for next-generation bandwidth or latency-critical upgrades; requires new PCB and toolchain migration |
Compared with XC7A100T-1CSG324I, the XC7A75T-L1CSG324I offers lower static power and reduced routing congestion in mid-scale designs; versus XCKU035-1FFVA676I, it provides proven industrial qualification and lower NRE cost for established 6.6 Gb/s applications.
Availability
XC7A75T-L1CSG324I is available at Aetrix Electronics and suitable for industrial imaging, medical ultrasound, wireless RRU, and test equipment requiring stable component supply across extended temperature and long production lifecycles.
Supply support for XC7A75T-L1CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets with focus on performance-per-watt efficiency.
The Kintex-7 family targets high-throughput, cost-sensitive applications demanding balanced logic, memory, and I/O resources - especially in industrial automation, aerospace, and communications infrastructure.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7A75T-L1CSG324I?
The XC7A75T-L1CSG324I supports DDR3-800 (400 MHz clock) with a 16-bit or 32-bit data bus using its hard memory controller. This enables sustained transfer rates up to 6.4 GB/s in burst mode. The controller complies with JEDEC DDR3L specifications and supports programmable read/write leveling, ZQ calibration, and self-refresh. XC7A75T-L1CSG324I requires matched trace lengths and proper termination for reliable operation at full speed.
Does XC7A75T-L1CSG324I support partial reconfiguration?
Yes, XC7A75T-L1CSG324I supports partial reconfiguration through Vivado Design Suite, allowing dynamic replacement of logic modules while the rest of the design remains operational. This capability requires specific HDL coding practices, floorplanning constraints, and configuration memory partitioning. XC7A75T-L1CSG324I's configuration logic and frame-based bitstream architecture enable secure, verified module swaps in field-deployed systems.
What is the industrial temperature rating for XC7A75T-L1CSG324I?
XC7A75T-L1CSG324I is rated for the industrial temperature range of –40°C to +100°C (junction temperature), as indicated by the "I" suffix in the part number. This rating applies under specified voltage and airflow conditions per AMD's Kintex-7 DC and switching characteristics documentation. XC7A75T-L1CSG324I maintains timing closure and functional correctness across this full range when operated within its defined power delivery and thermal management guidelines.
How many GTPE2 transceivers does XC7A75T-L1CSG324I include?
XC7A75T-L1CSG324I integrates eight GTPE2 transceivers, each capable of serial line rates from 600 Mb/s to 6.6 Gb/s. These transceivers support protocols including CPRI, Aurora, Gigabit Ethernet, and Serial RapidIO. XC7A75T-L1CSG324I allocates them across two quads (four per quad), with dedicated reference clock inputs and shared power domains per quad to minimize jitter and crosstalk.
Is XC7A75T-L1CSG324I compatible with Vivado 2023.1 design tools?
XC7A75T-L1CSG324I is fully supported in Vivado Design Suite starting from version 2013.4 through the latest 2023.1 release. Device-specific IP cores, constraint templates, and timing models are included in all supported versions. XC7A75T-L1CSG324I benefits from updated place-and-route algorithms and power estimation accuracy improvements in newer Vivado versions, though legacy projects remain backward-compatible.
XC7A75T-L1CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5900
- Number of Logic Elements/Cells:
- 75520
- Total RAM Bits:
- 3870720
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A75T-L1CSG324I FAQ
1.How can I place an order for XC7A75T-L1CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A75T-L1CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A75T-L1CSG324I reliable?
The price and inventory of XC7A75T-L1CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A75T-L1CSG324I is usually 5 days.
3.What payment methods are accepted for XC7A75T-L1CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A75T-L1CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A75T-L1CSG324I?
XC7A75T-L1CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A75T-L1CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A75T-L1CSG324I?
For technical support, including XC7A75T-L1CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A75T-L1CSG324I requirements.
6.How does Aetrix verify that XC7A75T-L1CSG324I is sourced from the original manufacturer or authorized distributors?
All XC7A75T-L1CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A75T-L1CSG324I meets industry standards.
7.What is the process for return or replacement of XC7A75T-L1CSG324I?
All XC7A75T-L1CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A75T-L1CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A75T-L1CSG324I part is unused and in its original packaging.
Return procedure for XC7A75T-L1CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7A75T-L1CSG324I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
