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AMD XC7A75T-L2FGG676E
- Part No.:
- XC7A75T-L2FGG676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7A75T-L2FGG676E.pdf
- Description:
- IC FPGA 300 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,452
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Product details
Overview
XC7A75T-L2FGG676E from AMD is a Kintex-7 FPGA featuring 75,520 logic cells, 365 I/O pins, and a -2 speed grade operating at 1.0V core voltage. It integrates 365 DSP48E1 slices, 4.2 MB of block RAM, and supports PCIe Gen2 x8 endpoint functionality in industrial temperature range (–40°C to +100°C).
For engineers reviewing the XC7A75T-L2FGG676E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, DSP slice availability, PCIe endpoint capability, thermal rating, and package footprint compatibility with high-density PCB layouts.
Technical Context
The XC7A75T-L2FGG676E implements a heterogeneous architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for high-speed arithmetic, and integrated transceivers supporting up to 6.6 Gb/s. It includes hardened PCIe Gen2 x8 endpoint logic and dual 12-bit 1 MSPS ADCs for system monitoring.
Configuration is performed via JTAG or master SPI mode using external flash; bitstream encryption and HMAC authentication are supported. The device uses SelectIO technology with support for LVDS, SSTL, HSTL, and TMDS signaling standards across its 365 user I/Os.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 75,520 - determines maximum combinational/sequential logic capacity for custom digital functions |
| I/O Pins | 365 - supports high-pin-count interface bridging, multi-protocol connectivity, and dense peripheral interfacing |
| DSP Slices | 365 × DSP48E1 - enables parallel multiply-accumulate operations for real-time signal processing |
| Block RAM | 4.2 MB - provides on-chip memory for FIFOs, buffers, lookup tables, and data caching without external SRAM |
| PCIe Interface | Gen2 x8 endpoint - delivers 4 GB/s bidirectional bandwidth for host-attached acceleration or I/O expansion |
| Operating Temp | –40°C to +100°C - qualified for extended industrial environments including motor control and outdoor infrastructure |
| Core Voltage | 1.0 V ±3% - requires tight-regulation power delivery with low-noise LDO or multiphase buck converter |
Pinout & Package
XC7A75T-L2FGG676E is housed in a 676-ball Fine-Pitch BGA (FPBGA) package with 1.0 mm ball pitch and 27 × 27 mm body size. Pin assignments follow AMD's Kintex-7 FG676 mechanical and electrical specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M19 | VCCINT | 1.0 V core supply input requiring local decoupling and low-ESR ceramic capacitors |
| P18 | VCCAUX | 1.8 V auxiliary supply for configuration, JTAG, and transceiver reference circuitry |
| R17 | GND | Ground reference for analog and digital domains; must be connected to solid ground plane |
| T15 | INIT_B | Open-drain active-low configuration status indicator; pulled high during successful bitstream load |
| U14 | CCLK | Configuration clock output from FPGA during master SPI mode; drives external flash clock input |
| Y16 | PCIE_RXP[0] | Differential high-speed receive pair for PCIe Gen2 x1 lane; routed with controlled 100 Ω differential impedance |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2 x8 Endpoint | Reduces integration effort by eliminating external bridge ICs and associated timing closure challenges |
| Dual 12-bit 1 MSPS ADCs | Enables real-time board-level voltage/current/temperature monitoring without external sensor interface components |
| Bitstream Encryption & HMAC | Protects intellectual property against cloning and unauthorized reprogramming in field-deployed systems |
| SelectIO Technology | Supports mixed-voltage I/O banks with independent VCCO per bank, simplifying interface to legacy and modern peripherals |
| Transceiver Line Rates | Up to 6.6 Gb/s per lane enables serial protocols including SATA, DisplayPort, and custom high-speed links |
Applications
| Industrial Motor Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time closed-loop servo control with synchronized encoder feedback and PWM generation for multi-axis drives. IC Role / Device Role / Timing Role: FPGA fabric executes position loop algorithms; PCIe endpoint connects to host CPU for diagnostics and parameter updates. Use Value: Deterministic latency under 1 µs and deterministic I/O timing enable sub-microsecond jitter in PWM edge placement. | Use Scenario: Aggregation and preprocessing of high-bandwidth sensor data from ultrasound or MRI front-end modules. IC Role / Device Role / Timing Role: Configurable logic processes time-critical beamforming or filtering; transceivers stream processed data over PCIe to host GPU. Use Value: On-chip DSP slices accelerate convolution kernels while block RAM buffers burst-mode ADC streams without DRAM latency. |
| Test & Measurement Equipment | Avionics Data Acquisition |
Use Scenario: High-resolution waveform capture and real-time FFT analysis in portable spectrum analyzers. IC Role / Device Role / Timing Role: FPGA implements trigger logic, sample buffering, and spectral computation; ADCs monitor internal supply health. Use Value: Integrated dual ADCs eliminate external monitoring ICs, reducing BOM count and board area in space-constrained enclosures. | Use Scenario: ARINC 429/664 (AFDX) protocol bridging and deterministic packet timestamping in flight control subsystems. IC Role / Device Role / Timing Role: FPGA handles protocol translation and time-stamping; PCIe endpoint interfaces with safety-certified host processor. Use Value: –40°C to +100°C qualification and SEU mitigation features meet DO-254 design assurance requirements for airborne hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K70T-2FBG676E | Lower logic density (70,000 LUTs), same FG676 package, identical speed grade and temp range | Suitable where DSP slice count and block RAM can be reduced by ~15% without compromising throughput | Select when cost sensitivity outweighs need for full XC7A75T resources and no PCIe x8 bandwidth headroom is required |
| XC7A100T-L2FGG676I | Higher logic count (101,440 LUTs), same package, but industrial temp range (–40°C to +100°C) and -2 speed grade | Preferred for designs needing additional CLBs for complex control logic or larger on-chip buffers | Choose when future scalability or concurrent multi-algorithm execution justifies higher unit cost and power consumption |
Compared with XC7A75T-L2FGG676E, XC7K70T-2FBG676E offers lower resource cost for constrained compute tasks, while XC7A100T-L2FGG676I provides headroom for algorithm expansion-both retain identical pinout, thermal envelope, and PCIe Gen2 x8 endpoint capability.
Availability
XC7A75T-L2FGG676E is available at Aetrix Electronics and suitable for industrial motor control, medical imaging interface, and avionics data acquisition requiring stable component supply across long-lifecycle programs.
Supply support for XC7A75T-L2FGG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt and programmable logic innovation.
The Kintex-7 family targets high-performance, cost-sensitive applications requiring balanced logic, DSP, memory, and I/O resources-designed specifically for industrial automation, test equipment, and medical systems.
FAQ
What is the maximum supported transceiver line rate for XC7A75T-L2FGG676E?
The XC7A75T-L2FGG676E supports transceiver line rates up to 6.6 Gb/s per lane. This enables compliance with PCIe Gen2, SATA III, and DisplayPort 1.2 protocols. The transceivers are located in dedicated GT lanes within the FPGA fabric and require proper AC-coupling and impedance-controlled routing per AMD UG476 specifications.
Does XC7A75T-L2FGG676E include built-in analog-to-digital converters?
Yes, XC7A75T-L2FGG676E integrates two 12-bit, 1 MSPS ADCs accessible via dedicated analog input pins (VP/VN pairs). These ADCs support system monitoring of supply voltages, temperatures, and currents without external components. Calibration and sequencing are managed through the XADC wizard in Vivado.
What configuration modes does XC7A75T-L2FGG676E support?
XC7A75T-L2FGG676E supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Master SPI is most common for single-flash boot; JTAG is used for debugging and programming during development. Configuration mode is selected via mode pins (M0–M2) at power-up and must match the external memory interface.
Is XC7A75T-L2FGG676E pin-compatible with other Kintex-7 devices in the FG676 package?
XC7A75T-L2FGG676E shares the same FG676 package footprint and ball map with other Kintex-7 devices rated for that package, including XC7K70T-2FBG676E and XC7A100T-L2FGG676I. Power and configuration pins are identically placed; I/O bank assignments and voltage requirements must still be verified per device-specific datasheets.
What security features are implemented in XC7A75T-L2FGG676E?
XC7A75T-L2FGG676E includes AES-256 bitstream encryption and HMAC-based authentication to prevent unauthorized configuration and cloning. These features require enabling in Vivado during bitstream generation and provisioning secure keys into on-chip eFUSE or external flash. No security license fee is required for basic encryption use.
XC7A75T-L2FGG676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5900
- Number of Logic Elements/Cells:
- 75520
- Total RAM Bits:
- 3870720
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC7A75T-L2FGG676E FAQ
1.How can I place an order for XC7A75T-L2FGG676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A75T-L2FGG676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A75T-L2FGG676E reliable?
The price and inventory of XC7A75T-L2FGG676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A75T-L2FGG676E is usually 5 days.
3.What payment methods are accepted for XC7A75T-L2FGG676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A75T-L2FGG676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A75T-L2FGG676E?
XC7A75T-L2FGG676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A75T-L2FGG676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A75T-L2FGG676E?
For technical support, including XC7A75T-L2FGG676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A75T-L2FGG676E requirements.
6.How does Aetrix verify that XC7A75T-L2FGG676E is sourced from the original manufacturer or authorized distributors?
All XC7A75T-L2FGG676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A75T-L2FGG676E meets industry standards.
7.What is the process for return or replacement of XC7A75T-L2FGG676E?
All XC7A75T-L2FGG676E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A75T-L2FGG676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A75T-L2FGG676E part is unused and in its original packaging.
Return procedure for XC7A75T-L2FGG676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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