My Inquiry
My Account
AMD XC7K160T-1FB484I
- Part No.:
- XC7K160T-1FB484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7K160T-1FB484I.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,471
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7K160T-1FB484I from AMD (Xilinx) is a Kintex-7 FPGA with 158,400 logic cells, 8.45 Gb/s transceiver capability, and -1 speed grade in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It serves as a high-performance programmable logic fabric for PCIe Gen2 endpoint designs, video processing pipelines, and industrial real-time control systems.
For engineers reviewing the XC7K160T-1FB484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), transceiver lane count (16 GTs), block RAM capacity (7.8 Mbit), and thermal design power (12.5 W typical).
Technical Context
The XC7K160T-1FB484I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 16 multi-gigabit transceivers (GTs), and integrated PCI Express® v2.1 hard IP. It supports DDR3 memory interfaces up to 800 MHz and includes 360 DSP slices for high-throughput arithmetic.
Configuration occurs via JTAG, SPIx4, or SelectMAP interfaces; startup time is 45 ms from master SPI flash. The device operates across industrial temperature range (–40°C to +100°C junction) and complies with IEEE 1149.1/1149.6 boundary-scan standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - total available LUTs+FFs for custom digital logic implementation |
| Transceivers | 16 GT lanes - supports 600 Mb/s to 6.6 Gb/s serial protocols including PCIe Gen2 |
| Block RAM | 7.8 Mbit - distributed as 360 × 36 Kb BRAM primitives for on-chip data buffering |
| DSP Slices | 360 - each provides 25 × 18-bit multiplier + accumulator for signal processing |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, TMDS - supports mixed-voltage board interfacing |
| Speed Grade | -1 - guarantees timing closure at specified maximum frequencies under industrial temp |
| TDP | 12.5 W typical - informs thermal solution sizing and power delivery design |
Pinout & Package
XC7K160T-1FB484I uses a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23 mm × 23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad on underside requires solder paste stencil opening per Xilinx UG475.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O bank | Configurable as PS peripherals (UART, SDIO, USB) or PL I/O in Zynq-7000 context; not applicable here - XC7K160T is pure PL device |
| GTX_CLK0_M2C_P/N | Transceiver reference clock input | Differential pair driving GT reference clock; must meet jitter spec ≤ 1.0 ps RMS |
| VCCINT | Core supply | 1.0V ±3% regulated supply for FPGA fabric; decoupling required per UG475 Section 5.3 |
| VCCAUX | Auxiliary supply | 1.8V ±3% for configuration logic, transceivers, and select I/O banks |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset; pulls device into configuration mode when asserted |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error state |
Key Features
| Feature | Design Value |
|---|---|
| 28 nm High-K Metal Gate process | Enables higher logic density and lower static power vs. 40 nm FPGAs |
| 16 GT transceivers | Supports native PCIe Gen2 x4 endpoint without external bridge logic |
| Integrated clock management (MMCM/PLL) | Provides sub-100 fs jitter synthesis for high-speed SerDes and memory interfaces |
| AXI-4 compliant interconnect | Enables seamless integration with ARM-based processors in heterogeneous SoC designs |
| Partial reconfiguration support | Allows dynamic logic module swapping during operation for adaptive computing workloads |
Applications
| PCIe Gen2 Endpoint Acceleration | Industrial Machine Vision Processing |
|---|---|
Use Scenario: FPGA-based co-processor attached via x4 PCIe link to host CPU for real-time image filtering and feature extraction. IC Role / Device Role / Timing Role: Programmable logic fabric executing pixel pipeline kernels with deterministic latency under 2 µs. Use Value: Offloads CPU-intensive vision tasks while maintaining PCIe Gen2 bandwidth (up to 2 GB/s aggregate throughput). | Use Scenario: Embedded vision system in robotic arm controller performing high-speed object localization using multi-camera inputs. IC Role / Device Role / Timing Role: Synchronization hub and frame buffer manager coordinating camera sensors, DDR3 memory, and motion control outputs. Use Value: Enables sub-millisecond frame-to-action latency using 7.8 Mbit on-chip BRAM for dual-frame buffering. |
| Avionics Data Concentrator | Test & Measurement Signal Generator |
Use Scenario: ARINC 429/664 (AFDX) gateway aggregating sensor telemetry from multiple line-replaceable units (LRUs). IC Role / Device Role / Timing Role: Protocol translation engine with deterministic packet scheduling and CRC validation logic. Use Value: Meets DO-254 Level A timing requirements using -1 speed grade and industrial temperature rating. | Use Scenario: Modular PXIe instrument generating multi-channel arbitrary waveforms synchronized to external triggers. IC Role / Device Role / Timing Role: Real-time waveform sequencer controlling DACs with jitter-controlled sample clocks from MMCM. Use Value: Achieves <100 fs clock jitter enabling >12 ENOB at 100 MS/s sampling rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K325T-1FB676I | 298,000 logic cells, 24 GT transceivers, larger 676-pin FBGA package | Higher gate count and transceiver count suitable for multi-lane PCIe Gen2 x8 or 10G Ethernet MAC offload | Select when XC7K160T-1FB484I resource utilization exceeds 85% or additional GT lanes are required |
| XC7K70T-1FB484I | 74,000 logic cells, 8 GT transceivers, same 484-pin FBGA footprint | Lower cost and power option for single-lane PCIe endpoints or smaller video pipelines | Choose for cost-sensitive designs where XC7K160T-1FB484I resources are underutilized |
Compared with XC7K325T-1FB676I, the XC7K160T-1FB484I offers optimized balance of transceiver count and logic density in compact 484-pin packaging; versus XC7K70T-1FB484I, it delivers 114% more logic cells and doubles GT lane count without changing PCB footprint.
Availability
XC7K160T-1FB484I is available at Aetrix Electronics and suitable for PCIe acceleration, machine vision, avionics data concentration, and test equipment requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC7K160T-1FB484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) designs adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, aerospace, and industrial markets.
The Kintex-7 family targets high-performance, cost-sensitive applications demanding transceiver-rich I/O and balanced logic-to-memory ratio - specifically engineered for PCIe endpoints, video processing, and real-time control.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7K160T-1FB484I?
The XC7K160T-1FB484I supports DDR3 SDRAM interfaces up to 800 MHz data rate (1600 MT/s), implemented using dedicated memory interface logic and calibrated I/O buffers. This capability is validated in Xilinx UG475 and applies directly to the XC7K160T-1FB484I device under industrial temperature conditions with proper board layout and termination.
Does XC7K160T-1FB484I include hardened PCIe Gen2 endpoint logic?
No, the XC7K160T-1FB484I does not integrate hardened PCIe Gen2 endpoint blocks. It relies on Xilinx's LogiCORE IP PCIe v2.1 endpoint core implemented in programmable logic, consuming ~12,000 LUTs and requiring GT transceivers. This implementation is fully supported for x1/x2/x4 configurations in the XC7K160T-1FB484I.
What configuration modes are supported by XC7K160T-1FB484I?
The XC7K160T-1FB484I supports three primary configuration modes: Master SPI (from external flash), Slave SelectMAP (parallel bus from processor), and JTAG (boundary-scan programming). Configuration startup time is 45 ms from SPI flash, and all modes are documented in Xilinx UG470 for the XC7K160T-1FB484I.
Is XC7K160T-1FB484I qualified for automotive applications?
The XC7K160T-1FB484I is rated for industrial temperature range (–40°C to +100°C junction) but is not AEC-Q100 qualified. It lacks automotive-specific screening, failure-in-time (FIT) reporting, and PPAP documentation. For automotive use, designers must perform full qualification per ISO 26262 ASIL-B/C requirements independently.
What is the purpose of the INIT_B pin on XC7K160T-1FB484I?
The INIT_B pin on XC7K160T-1FB484I is an open-drain output that signals configuration status: driven low during configuration and released high upon successful completion. If configuration fails (e.g., CRC error), INIT_B remains low. This signal is essential for system-level boot sequencing and fault detection in the XC7K160T-1FB484I.
XC7K160T-1FB484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7K160T-1FB484I FAQ
1.How can I place an order for XC7K160T-1FB484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-1FB484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-1FB484I reliable?
The price and inventory of XC7K160T-1FB484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-1FB484I is usually 5 days.
3.What payment methods are accepted for XC7K160T-1FB484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-1FB484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-1FB484I?
XC7K160T-1FB484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-1FB484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-1FB484I?
For technical support, including XC7K160T-1FB484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-1FB484I requirements.
6.How does Aetrix verify that XC7K160T-1FB484I is sourced from the original manufacturer or authorized distributors?
All XC7K160T-1FB484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-1FB484I meets industry standards.
7.What is the process for return or replacement of XC7K160T-1FB484I?
All XC7K160T-1FB484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-1FB484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-1FB484I part is unused and in its original packaging.
Return procedure for XC7K160T-1FB484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7K160T-1FB484I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
