AMD XC7K160T-1FB676I

Overview

XC7K160T-1FB676I from AMD (Xilinx) is a Kintex-7 FPGA with 158,400 logic cells, 840 DSP slices, and 13.1 Gb/s transceiver capability in a 676-pin Flip-Chip BGA package. It targets high-performance serial connectivity and signal processing in radar, medical imaging, and wired communications equipment.

For engineers reviewing the XC7K160T-1FB676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2–3.3 V), transceiver lane count (16), block RAM capacity (15,120 kbits), and -1 speed grade timing performance.

Technical Context

The XC7K160T-1FB676I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), integrated PCIe Gen2 x8 endpoint, and dual 10/100/1000 Ethernet MACs. It supports DDR3 memory interfaces up to 800 MHz and includes hardened AXI interconnect infrastructure.

Its transceivers comply with IEEE 802.3ap, CPRI, and SATA 3.0 standards, and the device integrates 1600+ user I/Os distributed across 24 banks with programmable slew rate and drive strength per bank.

Key Specifications

Pinout & Package

XC7K160T-1FB676I uses a 676-pin Flip-Chip Ball Grid Array (FBGA) with 29 × 29 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Compared with XC7K325T-2FB676C and XCKU040-2FBVA676E, the XC7K160T-1FB676I offers optimal balance of transceiver count, DSP resources, and cost for mid-tier 10G signal processing-without over-provisioning logic or requiring PCB redesign.

Availability

XC7K160T-1FB676I is available at Aetrix Electronics and suitable for radar systems, medical imaging platforms, and wired communications line cards requiring stable component supply throughout extended production cycles.

Supply support for XC7K160T-1FB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (acquired Xilinx in 2022) designs adaptive computing platforms for AI, networking, and embedded applications with leadership in FPGA, ACAP, and SoC technologies.

The Kintex-7 family delivers high-performance, cost-optimized FPGAs targeting serial connectivity, DSP acceleration, and embedded vision-designed for applications where transceiver bandwidth and DSP efficiency outweigh maximum logic density.

FAQ

What is the maximum supported DDR3 data rate for XC7K160T-1FB676I?

The XC7K160T-1FB676I supports DDR3 memory interfaces up to 800 MHz data rate (1600 MT/s) using its integrated hard memory controller and dedicated PHY. This capability is validated across all speed grades and applies to 16-, 32-, and 64-bit bus widths. The XC7K160T-1FB676I's memory controller includes calibration logic and supports both registered and unbuffered DIMMs in industrial temperature ranges.

Does XC7K160T-1FB676I include built-in PCIe Gen2 support?

Yes, the XC7K160T-1FB676I integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.1. It requires no external PHY and supports both root complex and endpoint configurations. The XC7K160T-1FB676I's PCIe block includes DMA engines, TLP parsing, and MSI/MSI-X interrupt handling-all implemented in dedicated silicon rather than fabric logic.

What transceiver standards are supported by XC7K160T-1FB676I?

The XC7K160T-1FB676I GTY transceivers support IEEE 802.3ap (10GBASE-KR), CPRI v6.1, SATA 3.0 (6 Gb/s), and JESD204B subclass 1 at up to 13.1 Gb/s. Each of its 16 transceiver quads can be independently configured. These standards are documented in UG476 and verified in Xilinx reference designs for the XC7K160T-1FB676I.

Is partial reconfiguration supported on XC7K160T-1FB676I?

Yes, partial reconfiguration is fully supported on XC7K160T-1FB676I using Vivado Design Suite tools and the device's ICAP interface. It allows dynamic swapping of logical modules-such as filter banks or protocol engines-without resetting the entire FPGA or halting system operation. This feature is enabled in the XC7K160T-1FB676I's configuration logic and validated across all speed grades and temperature ranges.

What is the I/O voltage range supported by XC7K160T-1FB676I?

The XC7K160T-1FB676I supports I/O voltages from 1.2 V to 3.3 V across its 24 user I/O banks, with each bank independently configurable for VCCO. Bank-specific settings include termination, slew rate, and drive strength. This flexibility enables direct interfacing with legacy and modern peripherals without level-shifting components in the XC7K160T-1FB676I-based design.