My Inquiry
My Account
AMD XC7K160T-1FBG676C
- Part No.:
- XC7K160T-1FBG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-1FBG676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,123
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7K160T-1FBG676C from AMD is a Kintex-7 FPGA with 158,400 logic cells, 12.5 Gb/s transceiver capability, and 16.8 Mb of block RAM, deployed in high-throughput data acquisition and PCIe Gen2 endpoint systems.
For engineers reviewing the XC7K160T-1FBG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (16 lanes), and thermal design power (12.5 W).
Technical Context
The XC7K160T-1FBG676C implements a 28 nm HKMG process architecture with integrated multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. It includes configurable logic blocks (CLBs), DSP slices, and clock management tiles (CMTs) with MMCM and PLL.
It supports SelectIO standards including LVCMOS, LVDS, and SSTL across 350 user I/O pins, and features dual-register flip-flops, shift registers, and built-in memory controllers for DDR3/DDR2/LPDDR2.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - determines maximum combinational and sequential logic capacity for RTL implementation |
| Block RAM | 16.8 Mb - supports on-chip buffering, FIFOs, and data caching without external memory |
| Transceivers | 16 lanes @ 12.5 Gb/s - enables PCIe Gen2 x8 or dual SATA 3.0 links with embedded clock recovery |
| I/O Pins | 350 user-configurable - provides flexible interface routing across multiple voltage domains |
| Max I/O Voltage | 3.3 V - allows direct interfacing with legacy parallel buses and industrial peripherals |
| TDP | 12.5 W - defines thermal envelope for heatsink sizing and airflow planning in enclosed systems |
Pinout & Package
XC7K160T-1FBG676C is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 35×35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core supply input (1.0 V) - powers CLBs, interconnect, and configuration logic |
| P19 | VCCAUX | Auxiliary supply (1.8 V) - powers configuration, JTAG, and transceiver reference circuits |
| R14 | VCCO_0 | I/O bank 0 supply (1.2–3.3 V) - sets output voltage level and drive strength per bank |
| H13 | MRCC_1 | Multi-Region Clock Capable - primary differential clock input for global clock distribution |
| M15 | GTHTXN1 | Transceiver differential TX negative - paired with GTHTXP1 for 12.5 Gb/s serial output |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 Endpoint | Hard IP block supporting x1/x2/x4/x8 link widths with AXI4 streaming interface |
| DSP Slices | 740 - enables real-time FIR filtering, FFT, and matrix operations at 400+ MHz |
| MMCM + PLL Clock Management | Two independent clock generators per CMT - supports jitter cleaning and frequency synthesis |
| Configurable I/O Standards | Supports 21 I/O standards including SSTL15, HSTL_I, and LVDS_25 within same bank |
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset or system interruption |
Applications
| High-Speed Data Acquisition | PCIe-Based Acceleration Card |
|---|---|
Use Scenario: Real-time digitization of multi-channel RF signals at 250 MS/s with timestamping and packetization. IC Role / Device Role / Timing Role: FPGA fabric processes ADC samples, applies digital down-conversion, and formats data for PCIe transmission. Use Value: XC7K160T-1FBG676C delivers deterministic latency (< 200 ns) and 16-lane transceiver bandwidth to sustain 8 GB/s throughput. | Use Scenario: Co-processor card accelerating image stitching and feature extraction in edge vision systems. IC Role / Device Role / Timing Role: XC7K160T-1FBG676C hosts custom convolution engines and manages DMA transfers between host CPU and local DDR3. Use Value: On-chip 16.8 Mb block RAM eliminates external buffer memory, reducing BOM cost and board area. |
| Industrial Machine Vision Controller | Software-Defined Radio Baseband Processor |
Use Scenario: Synchronized control of four GigE Vision cameras and real-time blob detection on conveyor lines. IC Role / Device Role / Timing Role: XC7K160T-1FBG676C implements GigE MACs, frame buffers, and binary morphology logic in fabric. Use Value: 350 user I/O pins enable concurrent camera interfaces, encoder inputs, and discrete I/O without glue logic. | Use Scenario: Multi-band LTE/FDD baseband processing with adaptive modulation and channel estimation. IC Role / Device Role / Timing Role: XC7K160T-1FBG676C executes OFDM symbol generation, MIMO equalization, and CRC offload in programmable logic. Use Value: 740 DSP slices deliver >12 GOPS at 250 MHz, meeting 3GPP Release 10 throughput requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FBVA676E | UltraScale architecture, 215K logic cells, higher transceiver speed (16.3 Gb/s), 15W TDP | Better suited for PCIe Gen3 x16 and 10G Ethernet line-rate processing | Select when migrating to higher bandwidth or requiring hardened 10G MACs |
| XC7K325T-2FBG676C | Same Kintex-7 family, 326K logic cells, identical I/O and transceiver specs, 18.2W TDP | Provides headroom for larger algorithm implementations without changing PCB layout | Choose for designs needing additional logic density while retaining pin compatibility |
Compared with XC7K160T-1FBG676C, XCKU040-2FBVA676E offers higher performance but requires new PCB layout and power delivery redesign, while XC7K325T-2FBG676C maintains footprint compatibility and simplifies scalability within the same family.
Availability
XC7K160T-1FBG676C is available at Aetrix Electronics and suitable for high-speed data acquisition, PCIe-based acceleration cards, and industrial machine vision controllers requiring stable component supply over extended production cycles.
Supply support for XC7K160T-1FBG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Kintex-7 FPGA family targets cost-optimized, high-throughput applications such as wired communications, video processing, and test equipment where balanced logic density, I/O count, and transceiver performance are critical.
FAQ
What is the maximum supported transceiver data rate for XC7K160T-1FBG676C?
The XC7K160T-1FBG676C supports transceiver data rates up to 12.5 Gb/s per lane. This enables compliance with PCIe Gen2, SATA III, and SRIO Gen2 protocols. The transceiver architecture includes built-in clock data recovery (CDR) and elastic buffers to maintain signal integrity across varying channel loss conditions. All 16 transceiver lanes in XC7K160T-1FBG676C operate within this specification under recommended thermal and voltage conditions.
Does XC7K160T-1FBG676C support partial reconfiguration?
Yes, XC7K160T-1FBG676C supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic replacement of logic modules while the rest of the design remains operational. Use cases include runtime protocol switching, firmware updates without system reset, and adaptive filter coefficient loading. Implementation requires dedicated configuration controller logic and proper floorplanning of reconfigurable partitions in the XC7K160T-1FBG676C device.
What I/O standards are supported by XC7K160T-1FBG676C?
XC7K160T-1FBG676C supports 21 SelectIO standards including LVCMOS, LVDS, SSTL, HSTL, and TMDS. Each of its 16 I/O banks can be independently configured for voltage levels from 1.2 V to 3.3 V. Differential standards like LVDS_25 and BLVDS are supported with internal termination. The XC7K160T-1FBG676C datasheet specifies timing parameters and drive strength settings for each standard under defined loading and temperature conditions.
What is the total block RAM capacity of XC7K160T-1FBG676C?
The XC7K160T-1FBG676C contains 16.8 Mb of total block RAM distributed across 720 BRAM primitives. Each BRAM can be configured as single-port, dual-port, or simple dual-port memory with depths up to 36 Kb. This capacity supports large on-chip FIFOs, lookup tables, and data buffering without external memory access, reducing latency in real-time signal processing pipelines implemented on XC7K160T-1FBG676C.
Is XC7K160T-1FBG676C compatible with Vivado Design Suite?
Yes, XC7K160T-1FBG676C is fully supported in Xilinx Vivado Design Suite versions 2013.1 through 2023.1. Synthesis, implementation, and bitstream generation workflows are validated for this device. Constraint management, timing analysis, and debug probe integration (via ILA and VIO cores) are all functional. Users must select the correct part number and package variant (FBG676) during project setup to ensure accurate pin mapping and timing closure for XC7K160T-1FBG676C.
XC7K160T-1FBG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-1FBG676C FAQ
1.How can I place an order for XC7K160T-1FBG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-1FBG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-1FBG676C reliable?
The price and inventory of XC7K160T-1FBG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-1FBG676C is usually 5 days.
3.What payment methods are accepted for XC7K160T-1FBG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-1FBG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-1FBG676C?
XC7K160T-1FBG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-1FBG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-1FBG676C?
For technical support, including XC7K160T-1FBG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-1FBG676C requirements.
6.How does Aetrix verify that XC7K160T-1FBG676C is sourced from the original manufacturer or authorized distributors?
All XC7K160T-1FBG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-1FBG676C meets industry standards.
7.What is the process for return or replacement of XC7K160T-1FBG676C?
All XC7K160T-1FBG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-1FBG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-1FBG676C part is unused and in its original packaging.
Return procedure for XC7K160T-1FBG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7K160T-1FBG676C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
