AMD XC7K160T-1FBG676I
- Part No.:
- XC7K160T-1FBG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-1FBG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,846
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Product details
Overview
XC7K160T-1FBG676I from AMD is a Kintex-7 FPGA with 158,400 logic cells, 8.8 Gb/s transceiver capability, and -1 speed grade, used in high-throughput data acquisition systems requiring deterministic latency and multi-gigabit serial I/O.
For engineers reviewing the XC7K160T-1FBG676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage support, CLB density, and thermal performance under sustained 1.0 W/mm² power density.
Technical Context
The XC7K160T-1FBG676I implements a 28 nm HKMG process architecture with 16 DSP48E1 slices, 1,080 Block RAM tiles (each 36 Kb), and integrated PCI Express Gen2 x8 endpoint logic. It supports SelectIO standards including LVDS, SSTL, HSTL, and MIPI D-PHY at up to 1.25 Gbps per pin.
Configuration is performed via Master SPI or JTAG, with dual-boot support from two external flash devices. The device includes hardened clock management tiles (CMT) with MMCM and PLL blocks capable of sub-100 fs jitter synthesis for synchronous multi-domain timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Transceiver Lanes | 16 - supports up to 16 independent 6.6 Gb/s GTPE2 transceivers for serial protocol stacking |
| Block RAM | 39.4 Mb - enables large on-die buffering for video frame stores or packet FIFOs |
| I/O Pins | 400 - provides scalable parallel interface connectivity across 18 I/O banks with independent VCCO |
| Speed Grade | -1 - guarantees timing closure at 1.0 GHz system clock with 12 ns input setup time margin |
| Package | FBG676 - 27×27 mm flip-chip BGA with 1.0 mm pitch and thermal lid for industrial ambient operation |
Pinout & Package
XC7K160T-1FBG676I uses a 676-pin flip-chip ball grid array (FBGA) package with thermal lid, 27×27 mm body, 1.0 mm pitch, and 400 user I/Os distributed across 18 selectable I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M18 | MRCC_L15P | Dedicated multi-region clock-capable differential input pair for primary system clock domain |
| P17 | SRCC_L14N | Secondary regional clock-capable differential input for auxiliary timing domain |
| A12 | IO_L1P_T0_0 | User-configurable single-ended I/O in Bank 0 supporting 1.2–3.3 V VCCO |
| E15 | GTXE2_CHANNEL_111 | Transceiver channel with dedicated TX/RX analog front-end and CDR loop |
| T11 | VCCAUX | 1.8 V auxiliary supply for configuration logic, transceiver PLLs, and clock management |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2 x8 Endpoint | Reduces integration effort by eliminating external bridge IC and associated PHY layer design |
| Integrated MMCM + PLL Clock Management | Enables sub-100 fs RMS jitter synthesis for synchronous multi-clock domain systems |
| SelectIO Technology with 18 I/O Banks | Allows mixed-voltage interface coexistence (e.g., 1.8 V FPGA core with 3.3 V legacy peripherals) |
| Dual-Boot Configuration Support | Permits field-upgradable bitstreams with fail-safe fallback to known-good configuration image |
Applications
| Radar Signal Processing | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: High-speed data ingestion from ADCs, parallel FFT execution, and deterministic low-latency output to DACs. Use Value: 158,400 logic cells and 16 GTPE2 transceivers enable simultaneous 8-channel RF sampling at 250 MSPS with <500 ns end-to-end latency. | Use Scenario: High-fidelity ultrasound image reconstruction pipeline with raw echo data aggregation. IC Role / Device Role / Timing Role: Time-aligned merging of multi-sensor echo streams and real-time digital beam synthesis. Use Value: 39.4 Mb Block RAM supports full-frame line buffering for 128-line scan modes at 60 fps without external memory. |
| Industrial Machine Vision | Test & Measurement Equipment |
Use Scenario: Sub-millisecond defect classification on high-speed production lines using CNN inference acceleration. IC Role / Device Role / Timing Role: Configurable hardware accelerator tightly coupled to DDR3 controller and camera interface IP. Use Value: 16 DSP48E1 slices deliver 256 GOPS peak throughput for convolution layers while maintaining deterministic frame capture timing. | Use Scenario: Modular signal analyzer with reconfigurable IF processing and real-time spectrum analysis. IC Role / Device Role / Timing Role: Multi-standard protocol engine handling USB 3.0 host control, GigE streaming, and analog trigger synchronization. Use Value: 400 I/O pins and 18 independent I/O banks allow concurrent connection to FPGA Mezzanine Card (FMC), SMA RF inputs, and PCIe host interface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-1FFVA676I | UltraScale architecture, 215K logic cells, higher transceiver bandwidth (12.5 Gb/s), no native PCIe Gen2 hard IP | Better suited for 10G Ethernet transport and higher-frequency RF sampling (>1 GHz IF) | Choose XCKU035-1FFVA676I when migrating to 16 nm process benefits and require >8 Gb/s serial rates |
| XC7K325T-1FBG676I | Same Kintex-7 family, 326K logic cells, identical FBG676 package and I/O compatibility | Supports larger algorithm partitions and deeper pipeline stages without board redesign | Choose XC7K325T-1FBG676I when additional CLB resources are required while retaining pinout and thermal footprint |
Compared with XC7K160T-1FBG676I, the XC7K325T-1FBG676I offers double the logic capacity in identical packaging, whereas the XCKU035-1FFVA676I delivers higher serial bandwidth but requires PCB layout changes and new transceiver calibration workflows.
Availability
XC7K160T-1FBG676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging interface, and industrial machine vision applications requiring stable component supply across extended product lifecycles.
Supply support for XC7K160T-1FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on adaptive computing, AI, and high-performance processing solutions for data centers, edge, and embedded markets.
The Kintex-7 FPGA family targets cost-optimized high-performance applications such as wired communications, video processing, and test equipment where balanced logic density, I/O bandwidth, and power efficiency are critical.
FAQ
What is the maximum supported transceiver data rate for XC7K160T-1FBG676I?
The XC7K160T-1FBG676I supports up to 6.6 Gb/s per GTPE2 transceiver lane. This rate is guaranteed under industrial temperature conditions (-40°C to +100°C) with proper reference clock jitter compliance and PCB interconnect design meeting S-parameter requirements for ≤15 dB insertion loss at 3.3 GHz.
Does XC7K160T-1FBG676I include built-in PCIe Gen2 x8 endpoint functionality?
Yes, XC7K160T-1FBG676I integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification Revision 2.1. It supports both root complex and endpoint roles, includes AXI4 streaming interfaces, and requires no external PHY for basic link training and enumeration.
What I/O standards are supported by XC7K160T-1FBG676I in Bank 13?
XC7K160T-1FBG676I supports LVDS, BLVDS, RSDS, and mini-LVDS in Bank 13. These standards operate at 1.2–2.5 V VCCO with programmable drive strength and termination, enabling direct interfacing to high-speed ADCs and DACs without level-shifting circuitry.
How many Block RAM tiles does XC7K160T-1FBG676I contain, and what is their total capacity?
XC7K160T-1FBG676I contains 1,080 Block RAM tiles, each configurable as 36 Kb dual-port RAM or 18 Kb single-port RAM. Total usable capacity is 39.4 Mb, with true dual-port access and byte-write enable for simultaneous read/write operations in video buffer applications.
Is XC7K160T-1FBG676I compatible with Vivado Design Suite 2022.1 for synthesis and implementation?
Yes, XC7K160T-1FBG676I is fully supported in Vivado Design Suite 2022.1, including timing analysis, bitstream generation, and hardware manager programming. Device-specific IP cores such as GTPE2 transceiver wizard and PCIe Gen2 endpoint are included and validated for this speed grade and package combination.
XC7K160T-1FBG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-1FBG676I FAQ
1.How can I place an order for XC7K160T-1FBG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-1FBG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-1FBG676I reliable?
The price and inventory of XC7K160T-1FBG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-1FBG676I is usually 5 days.
3.What payment methods are accepted for XC7K160T-1FBG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-1FBG676I transactions.
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XC7K160T-1FBG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-1FBG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-1FBG676I?
For technical support, including XC7K160T-1FBG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-1FBG676I requirements.
6.How does Aetrix verify that XC7K160T-1FBG676I is sourced from the original manufacturer or authorized distributors?
All XC7K160T-1FBG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-1FBG676I meets industry standards.
7.What is the process for return or replacement of XC7K160T-1FBG676I?
All XC7K160T-1FBG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-1FBG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-1FBG676I part is unused and in its original packaging.
Return procedure for XC7K160T-1FBG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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