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AMD XC7K160T-1FF676C
- Part No.:
- XC7K160T-1FF676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-1FF676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,868
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Product details
Overview
XC7K160T-1FF676C from AMD (Xilinx) is a Kintex-7 FPGA featuring 158,400 logic cells, 840 DSP slices, 12.5 Gb/s transceivers, and 16.8 Mb of block RAM. It implements high-performance signal processing and protocol bridging in PCIe Gen2 endpoint designs.
For engineers reviewing the XC7K160T-1FF676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2–3.3 V), transceiver lane count (16 lanes), and thermal design power (12.5 W).
Technical Context
The XC7K160T-1FF676C integrates SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS. Its transceivers comply with PCIe Gen2, SATA, and CPRI protocols with programmable equalization and clock data recovery.
Configurable logic blocks include dual 6-input LUTs with distributed RAM and shift register capability. The device uses 28 nm HKMG process technology and supports JTAG, ICAP, and SelectMAP configuration interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 840 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Transceiver Lanes | 16 - supports multi-lane serial protocols including PCIe Gen2 x8 or SATA x4 |
| Block RAM | 16.8 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables |
| I/O Standards | SSTL-18/15, HSTL-I/II, LVCMOS, LVDS - enables direct interfacing to DDR3, QDR SRAM, and video PHYs |
| TDP | 12.5 W - defines thermal solution requirements for sustained operation at -1 speed grade |
Pinout & Package
The XC7K160T-1FF676C is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FF676) package with 0.8 mm pitch and 27 × 27 mm body size. Thermal pad on underside requires solder paste stencil opening per Xilinx UG475.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC | Analog supply for transceiver banks | Must be filtered with 100 nF + 4.7 µF capacitors per bank; noise sensitivity ≤ 10 mVpp |
| VRP/VRN | Reference voltage pair for differential I/O | Used for calibration of input thresholds in SSTL/HSTL banks; tied to external resistor divider |
| CCLK | Configuration clock input | Drives internal configuration logic during master SPI or slave selectMAP mode |
| INIT_B | Configuration status indicator | Active-low open-drain output signaling successful bitstream load or error condition |
| PROGRAM_B | Configuration reset control | Pulse-low initiates reconfiguration; must be held high during normal operation |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset-critical for radar waveform adaptation |
| AXI Interconnect Integration | On-die interconnect fabric reduces latency and routing congestion for multi-master SoC designs |
| UltraScale-Compatible Toolflow | Uses Vivado 2019.2+ synthesis and implementation tools with identical constraint syntax as later families |
| Industrial Temperature Range | Operates reliably from –40°C to +100°C junction temperature-suitable for base station and avionics |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical filtering and FFT pipelines; transceivers interface to ADC/DAC FMC mezzanine cards. Use Value: 840 DSP slices enable 128-channel beamformer with sub-microsecond latency per frame. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanners. IC Role / Device Role / Timing Role: Configurable logic manages PCIe Gen2 x8 host interface and DDR3 memory controller for raw k-space data buffering. Use Value: 16.8 Mb block RAM eliminates external frame buffer, reducing BOM cost and board area. |
| 5G Baseband Unit | Test & Measurement Equipment |
Use Scenario: Layer 1 PHY processing in massive MIMO remote radio heads. IC Role / Device Role / Timing Role: Implements CPRI framer/de-framer and OFDM modulation/demodulation using dedicated DSP slices and transceivers. Use Value: 16 transceiver lanes support eight 614.4 Mbps CPRI links with deterministic jitter < 0.3 UI. | Use Scenario: Protocol-aware logic analyzer with real-time pattern matching and deep trace memory. IC Role / Device Role / Timing Role: Captures and correlates multi-protocol signals (PCIe, USB 3.0, MIPI) using embedded ILA cores and high-speed I/O banks. Use Value: SelectIO support for 1.2–3.3 V I/O voltages allows direct probing of legacy and modern digital buses without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K325T-1FF900C | 298,000 logic cells, 1,920 DSP slices, 24 transceiver lanes, larger FF900 package | Higher channel count radar, multi-sector 5G RU, wider PCIe Gen3 x16 host interface | Select when XC7K160T-1FF676C resource utilization exceeds 85% across LUT, DSP, and BRAM |
| XC7K70T-1FBG484C | 74,000 logic cells, 360 DSP slices, 8 transceiver lanes, smaller FBG484 package | Cost-sensitive medical edge devices, compact test instrumentation, single-stream video processing | Choose for lower power (<7 W TDP) and reduced PCB layer count where XC7K160T-1FF676C resources are underutilized |
Compared with XC7K325T-1FF900C and XC7K70T-1FBG484C, the XC7K160T-1FF676C delivers balanced logic density, DSP throughput, and I/O bandwidth in a thermally manageable 676-ball footprint-ideal for mid-tier 5G and imaging platforms requiring scalability without overdesign.
Availability
XC7K160T-1FF676C is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and medical imaging backend systems requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC7K160T-1FF676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) designs adaptive computing platforms for data center, AI, and wired/wireless infrastructure.
The Kintex-7 family targets high-performance, cost-sensitive applications demanding optimized DSP-to-logic ratio and multi-protocol serial connectivity.
FAQ
What is the maximum supported data rate per transceiver lane in XC7K160T-1FF676C?
The XC7K160T-1FF676C supports up to 12.5 Gb/s per transceiver lane. This rate is validated for protocols including PCIe Gen2 (5 Gb/s), SATA III (6 Gb/s), and CPRI (10.1376 Gb/s). Operation at 12.5 Gb/s requires proper PCB stackup, controlled impedance routing, and compliance with Xilinx UG476 AC specifications.
Does XC7K160T-1FF676C support partial reconfiguration?
Yes, XC7K160T-1FF676C supports partial reconfiguration through Vivado Design Suite. This capability allows dynamic swapping of logic modules while maintaining system operation-enabling adaptive radar waveform updates or protocol switching in test equipment without full FPGA reset.
What configuration modes are supported by XC7K160T-1FF676C?
XC7K160T-1FF676C supports Master SPI, Slave SelectMAP, JTAG, and ICAP configuration modes. Master SPI uses on-board flash memory; Slave SelectMAP enables configuration via processor or microcontroller; JTAG is used for debugging and programming during development.
Is XC7K160T-1FF676C qualified for industrial temperature operation?
Yes, the XC7K160T-1FF676C is rated for industrial temperature range (–40°C to +100°C junction). This qualification is specified in Xilinx DS182 and applies to the -1 speed grade in FF676 packaging, making it suitable for base station radios and avionics subsystems.
What I/O standards does XC7K160T-1FF676C support for memory interfacing?
XC7K160T-1FF676C supports DDR3, DDR2, and LPDDR2 memory interfaces via dedicated I/O banks configured for SSTL-15 or SSTL-18 standards. These are implemented using SelectIO technology with programmable drive strength and input termination, per Xilinx UG471 timing closure guidelines.
XC7K160T-1FF676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-1FF676C FAQ
1.How can I place an order for XC7K160T-1FF676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-1FF676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-1FF676C reliable?
The price and inventory of XC7K160T-1FF676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-1FF676C is usually 5 days.
3.What payment methods are accepted for XC7K160T-1FF676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-1FF676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-1FF676C?
XC7K160T-1FF676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-1FF676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-1FF676C?
For technical support, including XC7K160T-1FF676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-1FF676C requirements.
6.How does Aetrix verify that XC7K160T-1FF676C is sourced from the original manufacturer or authorized distributors?
All XC7K160T-1FF676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-1FF676C meets industry standards.
7.What is the process for return or replacement of XC7K160T-1FF676C?
All XC7K160T-1FF676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-1FF676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-1FF676C part is unused and in its original packaging.
Return procedure for XC7K160T-1FF676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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