My Inquiry
My Account
AMD XC7K160T-1FF676I
- Part No.:
- XC7K160T-1FF676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-1FF676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,299
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7K160T-1FF676I from AMD (Xilinx) is a Kintex-7 FPGA with 158,400 logic cells, 12.5 Gb/s transceiver capability, and -1 speed grade in a 676-pin Flip-Chip Fine-Pitch BGA package. It serves as a high-performance programmable logic fabric for PCIe Gen3 endpoint and 10G Ethernet line-card applications.
For engineers reviewing the XC7K160T-1FF676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (400 user I/Os), transceiver lane count (16 GT lanes), block RAM (7.8 Mb), DSP slice count (600), and thermal design power (12.5 W at typical operating conditions).
Technical Context
The XC7K160T-1FF676I implements a 28 nm HKMG process-based architecture with SelectIO technology supporting LVDS, SSTL, HSTL, and TMDS standards up to 1.25 Gb/s per pin. It integrates 16 multi-gigabit GT transceivers compliant with PCIe Gen3, SATA, and CPRI protocols.
Configuration is performed via Master SPI or JTAG, with support for dual-boot and encrypted bitstream loading. The device includes hardened IP blocks for PCIe Gen3 Endpoint, 10/100/1000 Ethernet MAC, and AXI interconnect infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| User I/O Pins | 400 - supports high-density board-level interface routing with bank-wise voltage and standard flexibility |
| GT Transceivers | 16 lanes @ 12.5 Gb/s - enables single-chip 10G Ethernet PHY or dual-lane PCIe Gen3 x8 endpoint |
| Block RAM | 7.8 Mb - provides on-die memory for FIFOs, frame buffers, or lookup tables without external DRAM |
| DSP Slices | 600 - delivers 220+ GMACs for real-time filtering, FFT, or beamforming in signal processing pipelines |
| Speed Grade | -1 - specifies timing closure margin for designs targeting 600 MHz system clock with balanced hold time |
Pinout & Package
XC7K160T-1FF676I is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FF676) package with 25 × 25 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-clock-rate operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multifunction I/O Bank | Configurable as PS peripherals (SDIO, UART, SPI, I2C) or PL-connected general-purpose I/O |
| GTxP/N[0:15] | Transceiver Differential Pair | 16 bidirectional high-speed serial lanes supporting PCIe Gen3, SATA, or SRIO protocols |
| HR[0:199] | High-Range I/O Bank | Supports 1.8 V/2.5 V/3.3 V signaling with source-series termination and programmable slew rate |
| VCCINT | Core Power Supply | Requires regulated 1.0 V ±3% supply delivering up to 12 A peak current |
| PROGRAM_B | Configuration Initiation | Active-low asynchronous reset that triggers reconfiguration from external flash or host processor |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 Hard IP Endpoint | Integrated endpoint controller with AXI4-Lite configuration space and MSI-X interrupt support |
| AXI Interconnect Infrastructure | Programmable crossbar supporting up to 16 AXI4 master/slave interfaces with QoS arbitration |
| UltraScale-Compatible Configuration | Supports partial reconfiguration and bitstream encryption using AES-256 and HMAC-SHA-256 |
| Thermal Monitoring Diode | On-die sensor providing real-time junction temperature readout via XADC auxiliary channel |
| Multi-Boot Capability | Enables field-upgradable firmware with fallback to golden image stored in dual SPI flash banks |
Applications
| PCIe Gen3 Endpoint Acceleration | 10G Ethernet Line Card |
|---|---|
Use Scenario: High-throughput data offload in server NICs or smart SSD controllers using PCIe Gen3 x8 interface. IC Role / Device Role / Timing Role: Configurable FPGA fabric implementing PCIe endpoint logic, DMA engines, and protocol translation layers. Use Value: Eliminates need for external PCIe switch or bridge IC while delivering deterministic sub-100 ns latency for RDMA operations. | Use Scenario: Aggregation of four 10G Ethernet ports into a single backplane interface for telecom edge routers. IC Role / Device Role / Timing Role: Line-side PHY interfacing, MAC layer processing, and packet buffering using integrated 10G Ethernet hard IP. Use Value: Reduces bill-of-materials by integrating SerDes, PCS, and MAC functions-no external PHY or buffer memory required. |
| Medical Imaging Data Pipeline | Defense Radar Signal Processing |
Use Scenario: Real-time reconstruction of CT/MRI scan data using parallelized FFT and back-projection algorithms. IC Role / Device Role / Timing Role: High-bandwidth data acquisition engine synchronizing ADC streams and executing streaming DSP kernels. Use Value: Delivers 220+ GMACs of sustained compute throughput with deterministic latency for FDA-cleared real-time imaging loops. | Use Scenario: Pulse-Doppler radar front-end processing including STAP, beamforming, and CFAR detection in airborne EW systems. IC Role / Device Role / Timing Role: Low-latency signal conditioning core handling 16-channel ADC inputs and driving DAC outputs with precise timing alignment. Use Value: Enables full pipeline execution within one 500 ns radar pulse repetition interval using hardened DSP slices and BRAM-based delay lines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K325T-2FF900I | Higher logic density (326,080 LC), 24 GT lanes, -2 speed grade, larger FF900 package | Supports wider PCIe Gen3 x16 or dual 10G Ethernet + 4x SATA interfaces simultaneously | Select when additional transceiver count or logic capacity is required beyond XC7K160T-1FF676I limits |
| XCKU040-2FFVA1156I | Ku040 offers UltraScale architecture, 192 GTY transceivers @ 16.3 Gb/s, and higher DSP efficiency (2,688 slices) | Better suited for 25G/100G Ethernet, coherent optical transport, or AI inference acceleration | Choose for next-generation bandwidth or algorithmic complexity exceeding Kintex-7 capabilities |
Compared with XC7K160T-1FF676I, XC7K325T-2FF900I provides greater resource headroom for complex control-plane logic, while XCKU040-2FFVA1156I delivers architectural improvements in transceiver speed and DSP throughput-both require PCB redesign due to different packages and pinouts.
Availability
XC7K160T-1FF676I is available at Aetrix Electronics and suitable for PCIe Gen3 endpoint acceleration, 10G Ethernet line cards, and medical imaging data pipelines requiring stable component supply across extended product lifecycles.
Supply support for XC7K160T-1FF676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) is a global semiconductor leader specializing in adaptive computing, high-performance CPUs, GPUs, and FPGAs for data center, AI, and embedded markets.
The Kintex-7 family was designed for cost-optimized high-performance applications including wired communications, video processing, and test equipment where balanced logic, I/O, and transceiver resources are critical.
FAQ
What is the maximum supported transceiver data rate for XC7K160T-1FF676I?
The XC7K160T-1FF676I supports transceiver data rates up to 12.5 Gb/s per lane. This enables compliance with PCIe Gen3 (8 GT/s encoded), SATA III (6 Gb/s), and CPRI Option 7 (10.1376 Gb/s). All 16 GT transceivers on the XC7K160T-1FF676I are rated for this maximum rate under specified thermal and voltage conditions.
Does XC7K160T-1FF676I include hardened PCIe Gen3 endpoint logic?
Yes, XC7K160T-1FF676I integrates a hardened PCIe Gen3 endpoint block compliant with PCI Express Base Specification v3.0. It supports x1, x2, x4, x8 configurations, MSI/MSI-X interrupts, and AXI4-Lite register interface. This eliminates the need for soft-core PCIe implementations and reduces logic utilization in the XC7K160T-1FF676I fabric.
What configuration modes does XC7K160T-1FF676I support?
XC7K160T-1FF676I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Primary boot is typically from quad-SPI flash using the internal boot ROM, with optional fallback to JTAG for debug or field updates. Dual-boot capability allows switching between two independent bitstreams stored in external flash.
How many block RAM resources are available in XC7K160T-1FF676I?
XC7K160T-1FF676I contains 780 total 36 Kb block RAM primitives, totaling 7.8 Mb of on-chip memory. Each block RAM can be configured as true dual-port, simple dual-port, or single-port memory with byte-write enable, supporting synchronous read/write operations at up to 550 MHz in the XC7K160T-1FF676I -1 speed grade.
Is XC7K160T-1FF676I qualified for industrial temperature operation?
Yes, the "I" suffix in XC7K160T-1FF676I denotes Industrial temperature grade (-40°C to +100°C junction). This qualification includes extended burn-in, high-temperature operating life testing, and screening per Xilinx specification DS182, making XC7K160T-1FF676I suitable for harsh-environment deployments such as base stations and factory automation controllers.
XC7K160T-1FF676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-1FF676I FAQ
1.How can I place an order for XC7K160T-1FF676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-1FF676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-1FF676I reliable?
The price and inventory of XC7K160T-1FF676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-1FF676I is usually 5 days.
3.What payment methods are accepted for XC7K160T-1FF676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-1FF676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-1FF676I?
XC7K160T-1FF676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-1FF676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-1FF676I?
For technical support, including XC7K160T-1FF676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-1FF676I requirements.
6.How does Aetrix verify that XC7K160T-1FF676I is sourced from the original manufacturer or authorized distributors?
All XC7K160T-1FF676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-1FF676I meets industry standards.
7.What is the process for return or replacement of XC7K160T-1FF676I?
All XC7K160T-1FF676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-1FF676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-1FF676I part is unused and in its original packaging.
Return procedure for XC7K160T-1FF676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7K160T-1FF676I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
