My Inquiry
My Account
AMD XC7K160T-1FFG676C
- Part No.:
- XC7K160T-1FFG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-1FFG676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:105
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7K160T-1FFG676C from AMD (Xilinx) is a Kintex-7 FPGA featuring 158,400 logic cells, 740 DSP slices, 13.1 Mb of block RAM, and high-speed transceivers supporting up to 6.6 Gb/s. It is packaged in a 676-pin FCBGA with 0.8 mm pitch and targets high-performance serial connectivity and real-time signal processing in radar and medical imaging systems.
For engineers reviewing the XC7K160T-1FFG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (16 GTs), and thermal design power (12.5 W at typical operation).
Technical Context
The XC7K160T-1FFG676C implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated PCIe Gen2 x8 endpoint capability. It supports DDR3 memory interfaces up to 1,866 Mb/s and includes hardened Gigabit Ethernet MACs.
Its configuration is performed via quad-SPI flash or JTAG, and it supports partial reconfiguration for dynamic function swapping. The device includes SelectIO technology with programmable I/O standards including LVDS, SSTL, and HSTL across banks operating at independent voltages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - determines maximum combinational/sequential logic capacity for custom digital functions |
| DSP Slices | 740 - enables parallel fixed/floating-point computation for filtering, FFT, and matrix operations |
| Block RAM | 13.1 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external memory latency |
| Transceivers | 16 GT lanes @ 6.6 Gb/s - supports multi-lane protocols like PCIe Gen2, CPRI, and Serial RapidIO |
| I/O Standards | LVDS, SSTL-18/25, HSTL-I/II - allows direct interfacing with ADCs, DACs, memory, and FMC mezzanine cards |
| Configuration Mode | Master SPI, JTAG, SelectMAP - enables flexible boot sources and field updates |
Pinout & Package
XC7K160T-1FFG676C is housed in a 676-ball Fine-Pitch Flip-Chip BGA (FFG) package with 0.8 mm ball pitch, 27 × 27 mm body size, and thermal lid. The package supports thermal dissipation up to 12.5 W TDP and is compatible with standard reflow profiles for lead-free assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (SPI/JTAG/SelectMAP) at power-up |
| CCLK | Configuration Clock | Drives internal configuration logic during master SPI programming |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading |
| INIT_B | Configuration Initialization | Active-low signal asserting reset during configuration failure or reload |
| GTX/GTH RefClk | Transceiver Reference Clock | Provides low-jitter clock source for high-speed serial lanes |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables runtime logic module swapping without full device reboot-critical for adaptive radar and protocol gateways |
| PCIe Gen2 x8 Endpoint Hard IP | Reduces FPGA resource usage and verification effort for host interface integration |
| DDR3 Memory Controller (up to 1,866 Mb/s) | Eliminates need for external memory controller IC and simplifies board-level timing closure |
| UltraScale-compatible I/O Banking | Allows mixed-voltage I/O (1.2 V–3.3 V) per bank, enabling direct connection to diverse peripherals |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; transceivers interface with ADC/DAC FMC modules. Use Value: 740 DSP slices and 16 GT lanes enable concurrent multi-channel processing with deterministic latency under 100 ns. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanners. IC Role / Device Role / Timing Role: Configurable logic manages data flow between 16-bit ADCs, DDR3 buffers, and GPU-hosted reconstruction engines. Use Value: 13.1 Mb block RAM supports dual-frame buffering while 158,400 logic cells implement custom interpolation and filtering IP. |
| Industrial Machine Vision | Test & Measurement Equipment |
Use Scenario: Sub-millisecond image capture, preprocessing, and defect classification on factory-floor vision controllers. IC Role / Device Role / Timing Role: XC7K160T-1FFG676C acts as real-time vision coprocessor, offloading CPU with hardware-accelerated edge detection and blob analysis. Use Value: SelectIO compatibility with Camera Link and CoaXPress PHYs enables direct sensor interfacing without bridge ICs. | Use Scenario: Modular signal generation and analysis in PXIe-based ATE platforms. IC Role / Device Role / Timing Role: FPGA implements protocol-aware pattern generators and jitter-tolerant analyzers synchronized to system backplane clocks. Use Value: PCIe Gen2 x8 endpoint and deterministic I/O timing allow sub-10 ns timestamp resolution and <1 µs command-response latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K325T-2FFG901C | Higher logic density (326,080 CLBs), more GT lanes (20), larger package (901-ball FFG) | Required for designs needing >2× logic resources or additional transceiver bandwidth | Choose when XC7K160T-1FFG676C resource utilization exceeds 85% or transceiver count is insufficient |
| XC7A200T-2FBG676I | Artix-7 family; lower power (6.8 W TDP), fewer GT lanes (16 @ 6.6 Gb/s), no PCIe hard IP | Suitable for cost-sensitive, thermally constrained embedded vision but lacks PCIe endpoint acceleration | Prefer for battery-powered or fanless systems where PCIe integration is not required |
Compared with XC7K160T-1FFG676C, XC7K325T-2FFG901C delivers scalable performance at higher cost and board area, while XC7A200T-2FBG676I trades PCIe and DSP capability for reduced power and bill-of-materials cost-making each suitable for distinct thermal, interface, and compute-bound use cases.
Availability
XC7K160T-1FFG676C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, industrial machine vision, and test & measurement equipment requiring stable component supply across long-life industrial programs.
Supply support for XC7K160T-1FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) is a global semiconductor leader delivering adaptive computing solutions for data center, AI, and embedded markets.
The Kintex-7 family was designed for high-performance, cost-optimized applications demanding balanced logic, memory, and I/O resources-especially in aerospace, medical, and industrial systems requiring reliability and long-term availability.
FAQ
What is the maximum supported DDR3 data rate for XC7K160T-1FFG676C?
The XC7K160T-1FFG676C supports DDR3 memory interfaces up to 1,866 Mb/s using its integrated memory controller. This capability is verified in Xilinx UG473 and applies directly to the XC7K160T-1FFG676C's MIG v4.2 IP core. The device requires proper PCB layout adherence to JEDEC specifications and uses dedicated clock routing to maintain timing margins.
Does XC7K160T-1FFG676C include a hard PCIe Gen2 endpoint?
Yes, XC7K160T-1FFG676C integrates a hardened PCIe Gen2 x8 endpoint block. This reduces logic resource consumption and simplifies timing closure compared to soft-core implementations. The hard IP supports both root complex and endpoint modes and is validated per PCI-SIG compliance tests for the XC7K160T-1FFG676C device grade.
What configuration methods does XC7K160T-1FFG676C support?
XC7K160T-1FFG676C supports Master SPI, JTAG, and SelectMAP configuration modes. Master SPI uses on-board quad-SPI flash; JTAG enables debugging and programming via boundary-scan; SelectMAP allows high-speed parallel loading through processor-controlled GPIO. All modes are documented in Xilinx UG470 for the XC7K160T-1FFG676C.
Is partial reconfiguration supported on XC7K160T-1FFG676C?
Yes, partial reconfiguration is fully supported on XC7K160T-1FFG676C using Vivado Design Suite tools. It allows dynamic swapping of logic modules without resetting the entire device. This feature is used in adaptive radar and protocol gateway applications where XC7K160T-1FFG676C must update processing pipelines in real time.
What is the thermal design power (TDP) of XC7K160T-1FFG676C?
The XC7K160T-1FFG676C has a typical thermal design power of 12.5 W under representative operating conditions, as specified in Xilinx DS182. This value assumes default speed grade (-1), 50% logic utilization, and active transceivers. Actual power varies with design implementation, clock frequency, and I/O activity-measured using Xilinx Power Estimator for XC7K160T-1FFG676C.
XC7K160T-1FFG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-1FFG676C FAQ
1.How can I place an order for XC7K160T-1FFG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-1FFG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-1FFG676C reliable?
The price and inventory of XC7K160T-1FFG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-1FFG676C is usually 5 days.
3.What payment methods are accepted for XC7K160T-1FFG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-1FFG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-1FFG676C?
XC7K160T-1FFG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-1FFG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-1FFG676C?
For technical support, including XC7K160T-1FFG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-1FFG676C requirements.
6.How does Aetrix verify that XC7K160T-1FFG676C is sourced from the original manufacturer or authorized distributors?
All XC7K160T-1FFG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-1FFG676C meets industry standards.
7.What is the process for return or replacement of XC7K160T-1FFG676C?
All XC7K160T-1FFG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-1FFG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-1FFG676C part is unused and in its original packaging.
Return procedure for XC7K160T-1FFG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7K160T-1FFG676C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
