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AMD XC7K160T-1FFG676I

Part No.:
XC7K160T-1FFG676I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BBGA, FCBGA
Datasheet:
AetrixXC7K160T-1FFG676I.pdf
Description:
IC FPGA 400 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:101

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Product details

Overview

XC7K160T-1FFG676I from AMD (Xilinx) is a Kintex-7 FPGA with 158,400 logic cells, 840 DSP slices, and 13.1 Mb of block RAM, packaged in a 676-pin FCBGA with 0.8 mm pitch. It supports transceivers up to 6.6 Gb/s and operates over industrial temperature range (–40°C to +100°C), used in high-throughput packet processing systems.

For engineers reviewing the XC7K160T-1FFG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), transceiver lane count (16 lanes), voltage supply requirements (1.0V core, 1.8V/3.3V I/O), and thermal design power (14.5 W typical).

Technical Context

The XC7K160T-1FFG676I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and integrated PCIe Gen2 x8 endpoint capability. It includes 16 multi-gigabit transceivers supporting protocols including SATA, SRIO, and CPRI.

Configuration is performed via JTAG or master/slave SPI BPI mode using external flash. The device supports partial reconfiguration and AXI4-compliant interconnect for SoC-style integration with soft processors like MicroBlaze.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells158,400 - determines maximum combinational and sequential logic capacity for RTL implementation
DSP Slices840 - enables parallel multiply-accumulate operations for signal processing pipelines
Block RAM13.1 Mb - supports large on-chip data buffering and FIFO construction without external memory
User I/O Pins400 - provides interface flexibility for parallel buses, DDR3 interfaces, and peripheral expansion
Transceiver Lanes16 - delivers 16 independent serial links up to 6.6 Gb/s for high-speed protocol bridging
Operating Temp–40°C to +100°C - qualified for industrial and extended-temperature embedded deployments
Core Voltage1.0 V ±3% - requires tight-regulation DC-DC supply with low ripple for stable timing closure

Pinout & Package

XC7K160T-1FFG676I is housed in a 676-ball Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 0.8 mm ball pitch and 27 × 27 mm body size. Thermal pad on underside enables efficient heat dissipation in conduction-cooled applications.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supplySupplies 1.0 V to CLBs, DSP slices, and interconnect; decoupling critical for jitter control
VCCAUXAuxiliary power supplyProvides 1.8 V to configuration logic, clock management, and transceiver analog circuitry
VCCOI/O bank powerConfigurable per-bank (1.2 V to 3.3 V); sets output swing and input threshold for connected peripherals
MGTAVCCTransceiver analog supply2.5 V supply for high-speed serial transceiver analog front-end; noise sensitivity demands dedicated filtering
PROGRAM_BConfiguration resetActive-low signal initiating FPGA reconfiguration from external flash or host processor
INIT_BConfiguration statusOpen-drain output indicating configuration memory readiness and bitstream CRC pass/fail

Key Features

FeatureDesign Value
PCIe Gen2 x8 EndpointIntegrated hard IP enables direct attachment to host CPU without external bridge IC or firmware overhead
AXI4 InterconnectOn-die interconnect fabric supports concurrent AXI4-Lite and AXI4-Stream traffic for heterogeneous subsystem integration
Partial ReconfigurationAllows dynamic swapping of logic partitions during operation-critical for adaptive radio and real-time protocol switching
DDR3 Memory ControllerHardened controller supporting 800 MHz data rate (1600 MT/s) across up to 16 banks with ECC support
Multi-Gigabit Transceivers16 lanes with built-in 8B/10B encoding, clock correction, and elastic buffers for deterministic latency in serial protocols

Applications

Wireless Baseband ProcessingIndustrial Vision Systems

Use Scenario: Real-time LTE/5G physical layer processing with channel estimation, FFT, and MIMO decoding.

IC Role / Device Role / Timing Role: Primary programmable baseband processor implementing PHY-layer acceleration and protocol stack offload.

Use Value: 840 DSP slices enable concurrent 4×4 MIMO matrix inversion at sub-100 µs latency; transceivers interface directly to RFICs via JESD204B.

Use Scenario: High-speed inspection of PCB assemblies using multi-camera synchronization and pixel-level defect analysis.

IC Role / Device Role / Timing Role: Central image processing hub managing camera sensor interfaces, frame buffering, and real-time blob detection logic.

Use Value: 400 user I/Os support simultaneous LVDS camera inputs; 13.1 Mb block RAM stores full-frame buffers for multi-stage convolution kernels.

Avionics Data ConcentratorsTest & Measurement Equipment

Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 message aggregation and routing in flight control systems.

IC Role / Device Role / Timing Role: Deterministic network switch and protocol translator with time-triggered scheduling engine.

Use Value: PCIe Gen2 x8 enables high-bandwidth connection to host flight computer; –40°C to +100°C rating meets DO-160E Section 22 Category D environmental compliance.

Use Scenario: Modular PXIe-based oscilloscopes requiring deep memory capture, real-time FFT, and multi-channel triggering.

IC Role / Device Role / Timing Role: Real-time signal conditioning and acquisition engine with synchronized ADC interface and waveform analysis pipeline.

Use Value: 16 transceiver lanes support JESD204B links to 12-bit, 2.5 GS/s ADCs; partial reconfiguration allows instrument personality switching without reboot.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing and interface bridging applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC7K325T-2FFG901IHigher logic density (326,080 LCs), more transceivers (20 lanes), larger package (901-ball)Supports wider data paths and additional protocol stacks (e.g., dual 10GbE MACs)Select when >200k logic cells or >16 transceivers are required; board redesign needed due to different footprint
XC7K70T-1FBG484IFewer logic cells (74,000), 8 transceivers, smaller 484-ball FFG packageSuitable for cost-sensitive edge nodes with single 1 GbE + PCIe Gen2 x4 connectivityChoose for lower power (9.2 W typical) and compact layout where XC7K160T-1FFG676I resources are underutilized

Compared with XC7K325T-2FFG901I and XC7K70T-1FBG484I, the XC7K160T-1FFG676I delivers balanced I/O count, transceiver count, and logic capacity for mid-tier high-speed embedded systems-avoiding overdesign while maintaining headroom for future feature upgrades.

Availability

XC7K160T-1FFG676I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial vision, avionics data concentrators, and test equipment requiring stable component supply across long production lifecycles.

Supply support for XC7K160T-1FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (acquired Xilinx in 2022) designs adaptive computing platforms for data center, AI, and embedded markets, with leadership in FPGA, adaptive SoC, and ACAP technologies.

The Kintex-7 family targets high-performance, cost-sensitive applications demanding optimized power efficiency and transceiver bandwidth-designed for wireless infrastructure, video processing, and military/aerospace systems.

FAQ

What is the maximum supported data rate for transceivers on the XC7K160T-1FFG676I?

The XC7K160T-1FFG676I supports transceiver data rates up to 6.6 Gb/s per lane. This enables compliance with protocols including CPRI, SATA III, and SRIO Gen2. The 16 transceiver lanes are independently configurable and support built-in clock data recovery (CDR) and elastic buffers for jitter tolerance in serial link implementations.

Does the XC7K160T-1FFG676I include a hardened PCIe controller?

Yes, the XC7K160T-1FFG676I integrates a hardened PCIe Gen2 x8 endpoint block. It supports root complex or endpoint operation, TLP generation and parsing, and MSI/MSI-X interrupt handling. No external PCIe switch or bridge IC is required, reducing BOM cost and board area for host-connected accelerator designs.

What I/O standards are supported by the XC7K160T-1FFG676I?

The XC7K160T-1FFG676I supports LVCMOS, LVTTL, SSTL, HSTL, differential SSTL, and differential HSTL across its 400 user I/O pins. Each I/O bank is independently configurable for voltage (1.2 V to 3.3 V), drive strength, and slew rate. Selectable internal termination (up to 150 Ω) simplifies DDR3 and memory interface designs.

Can the XC7K160T-1FFG676I be configured via JTAG only?

No-the XC7K160T-1FFG676I supports multiple configuration modes including JTAG, master SPI (using on-chip oscillator), slave SPI, and BPI parallel flash. JTAG is typically used for debugging and initial programming, while SPI or BPI modes enable autonomous boot from nonvolatile memory after power-up without host intervention.

Is partial reconfiguration supported on the XC7K160T-1FFG676I?

Yes, the XC7K160T-1FFG676I fully supports partial reconfiguration through Vivado Design Suite. This allows runtime swapping of logic modules-such as protocol engines or filter coefficients-without resetting the entire device. Use cases include adaptive radio front-ends and field-upgradable test instrumentation firmware.

XC7K160T-1FFG676I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex®-7
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
12675
Number of Logic Elements/Cells:
162240
Total RAM Bits:
11980800
Number of I/O:
400
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)

XC7K160T-1FFG676I FAQ

1.How can I place an order for XC7K160T-1FFG676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7K160T-1FFG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7K160T-1FFG676I reliable?

The price and inventory of XC7K160T-1FFG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-1FFG676I is usually 5 days.

3.What payment methods are accepted for XC7K160T-1FFG676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-1FFG676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7K160T-1FFG676I?

XC7K160T-1FFG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7K160T-1FFG676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7K160T-1FFG676I?

For technical support, including XC7K160T-1FFG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-1FFG676I requirements.

6.How does Aetrix verify that XC7K160T-1FFG676I is sourced from the original manufacturer or authorized distributors?

All XC7K160T-1FFG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-1FFG676I meets industry standards.

7.What is the process for return or replacement of XC7K160T-1FFG676I?

All XC7K160T-1FFG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-1FFG676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7K160T-1FFG676I part is unused and in its original packaging.

Return procedure for XC7K160T-1FFG676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7K160T-1FFG676I Tags

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