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AMD XC7K160T-2FB676I
- Part No.:
- XC7K160T-2FB676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-2FB676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,412
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Product details
Overview
XC7K160T-2FB676I from AMD is a Kintex-7 FPGA featuring 158,400 logic cells, 840 DSP slices, 13.1 Gb/s transceiver line rate, and -2 speed grade in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package. It serves as a high-performance programmable logic fabric for PCIe Gen3 endpoint and 10G Ethernet line-card control applications.
For engineers reviewing the XC7K160T-2FB676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance with PCIe Gen3 and SRIO v2.0, block RAM depth of 36 Kb per BRAM, and support for DDR3L memory interfaces up to 800 MHz.
Technical Context
The XC7K160T-2FB676I implements a heterogeneous architecture integrating programmable logic, hardened I/O, and dedicated processing blocks. It includes 24 transceiver quads supporting 6.6–13.1 Gb/s operation, 720 Block RAMs (each 36 Kb), and 12 clock management tiles with MMCM and PLL resources.
Configuration is performed via JTAG or SelectMAP interface, with bitstream encryption and SEU mitigation features enabled. The device supports partial reconfiguration and operates across industrial temperature range (–40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - total available LUT-based configurable logic resources |
| DSP Slices | 840 - fixed-point arithmetic units with 25×18 multipliers and 48-bit accumulators |
| Transceiver Line Rate | 13.1 Gb/s - maximum serial data rate per transceiver lane, compliant with PCIe Gen3 |
| Block RAM | 25.8 Mb - aggregate distributed and block RAM capacity for on-chip buffering |
| Speed Grade | -2 - timing performance bin enabling 800 MHz DDR3L interface operation |
| I/O Standards | LVDS, SSTL, HSTL, TMDS - supports direct interfacing to video, memory, and high-speed serial protocols |
| Operating Temp | –40°C to +100°C - industrial-grade junction temperature range for embedded systems |
Pinout & Package
XC7K160T-2FB676I is housed in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multifunction I/O bank | Configurable as PS peripherals (UART, SPI, I2C, SDIO) or PL I/O with voltage-selectable banks |
| GTY_RXN/P | Transceiver differential input | Supports 6.6–13.1 Gb/s serial protocols including PCIe Gen3 and 10G Ethernet KR |
| VRP/VRN | Reference voltage pins | Provide internal termination reference for differential I/O standards like LVDS and TMDS |
| CONFIG_IO | Configuration mode select | Determines boot source (JTAG, BPI, QSPI, or MicroSD) during power-up initialization |
| VCCAUX | Analog auxiliary supply | 1.8 V supply for transceivers, configuration logic, and clock management circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in mission-critical applications |
| SEU Mitigation Logic | Dedicated circuitry detects and corrects single-event upsets in configuration memory, meeting industrial reliability requirements |
| Hardened PCI Express Block | Integrated Gen3 x8 endpoint controller eliminating external PHY and reducing latency by >30% vs discrete solutions |
| UltraScale-Compatible Toolflow | Uses Vivado Design Suite 2022.1+ with synthesis, implementation, and verification flows validated for Kintex-7 family |
| Bitstream Encryption | AES-256 encrypted configuration bitstream prevents IP theft and unauthorized cloning of logic design |
Applications
| PCIe Gen3 Endpoint Acceleration | 10G Ethernet Line Card Control |
|---|---|
Use Scenario: High-throughput data offload in server NICs using PCIe Gen3 x8 interface. IC Role / Device Role / Timing Role: Configurable logic fabric implementing DMA engines, descriptor parsers, and interrupt controllers. Use Value: Achieves <1.2 μs host-to-FPGA latency with deterministic timing closure at 125 MHz system clock. | Use Scenario: MAC-layer processing and packet classification in telecom line cards. IC Role / Device Role / Timing Role: Programmable packet forwarding engine with integrated 10G KR transceivers and TCAM lookup logic. Use Value: Supports 14.88 Mpps throughput with sub-10 ns jitter on recovered 156.25 MHz reference clock. |
| Industrial Vision Processing | Avionics Data Concentrator |
Use Scenario: Real-time image preprocessing and feature extraction in machine vision inspection systems. IC Role / Device Role / Timing Role: Parallel pixel pipeline accelerator with dual 24-bit CMOS sensor interfaces and DDR3L frame buffer controller. Use Value: Processes 4K@60fps raw Bayer data with <8-line pipeline latency using 96 DSP slices. | Use Scenario: ARINC 664 (AFDX) end-system aggregation in flight control networks. IC Role / Device Role / Timing Role: Time-triggered switch fabric with deterministic scheduling logic and dual-redundant 100 Mbps AFDX MACs. Use Value: Guarantees <50 μs end-to-end latency and zero packet loss under 100% sustained load per virtual link. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, 469K logic cells, 16.3 Gb/s transceivers, larger package (1156-pin FCBGA) | Higher bandwidth and density for 25G/100G Ethernet and AI inference acceleration | Select when migrating beyond Kintex-7 capacity limits or requiring PAM4 signaling support |
| XC7K325T-2FFG676I | Same Kintex-7 family, higher logic count (326,080 cells), identical -2 speed grade and 676-pin FCBGA package | Direct upgrade path with increased DSP and BRAM resources for complex signal processing | Choose for same-footprint scalability without PCB redesign, where additional logic resources are required |
Compared with XC7K160T-2FB676I, XC7K325T-2FFG676I offers 105% more logic cells in identical packaging, while XCKU060-2FFVA1156I delivers 2.9× higher transceiver bandwidth but requires board-level redesign due to larger footprint and different power delivery requirements.
Availability
XC7K160T-2FB676I is available at Aetrix Electronics and suitable for PCIe Gen3 endpoint acceleration, 10G Ethernet line card control, and industrial vision processing requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC7K160T-2FB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.
The Kintex-7 FPGA product line targets cost-optimized high-performance applications including wired communications, video processing, and industrial automation, balancing logic density, transceiver capability, and power efficiency.
FAQ
What is the maximum supported DDR3L memory interface speed for XC7K160T-2FB676I?
The XC7K160T-2FB676I supports DDR3L memory interfaces up to 800 MHz (1600 MT/s data rate) when operating at -2 speed grade. This is validated in AMD UG470 v1.12 and confirmed across all 16 memory interface banks in the device's HR I/O banks. The XC7K160T-2FB676I achieves this using calibrated I/O delay chains and built-in DQS gating logic.
Does XC7K160T-2FB676I include hardened PCIe Gen3 endpoint logic?
Yes, the XC7K160T-2FB676I integrates a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification v3.0. This includes physical layer (PHY), data link layer (DLL), and transaction layer (TL) logic. The XC7K160T-2FB676I eliminates need for external PCIe PHY and reduces latency versus soft-core implementations.
What configuration modes does XC7K160T-2FB676I support?
The XC7K160T-2FB676I supports JTAG, Master SPI (QSPI), Slave SelectMAP, and BPI parallel configuration modes. Configuration is initiated via dedicated CONFIG_IO pins and controlled by mode pins M0–M2. The XC7K160T-2FB676I also enables fallback configuration from secondary flash if primary bitstream fails CRC check.
Is XC7K160T-2FB676I qualified for industrial temperature operation?
Yes, the XC7K160T-2FB676I is rated for industrial temperature range with junction operating temperature from –40°C to +100°C. This qualification is specified in AMD DS182 v3.0 and verified through extended burn-in and thermal cycling tests. The XC7K160T-2FB676I maintains timing closure and I/O voltage compliance across the full range.
Can XC7K160T-2FB676I perform partial reconfiguration?
Yes, the XC7K160T-2FB676I supports dynamic partial reconfiguration (PR) using Vivado Design Suite tools. PR allows runtime replacement of logical modules without resetting the entire device. The XC7K160T-2FB676I implements frame-based configuration access and supports both hierarchical and modular PR flows validated in UG908 v2022.1.
XC7K160T-2FB676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-2FB676I FAQ
1.How can I place an order for XC7K160T-2FB676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-2FB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-2FB676I reliable?
The price and inventory of XC7K160T-2FB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-2FB676I is usually 5 days.
3.What payment methods are accepted for XC7K160T-2FB676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-2FB676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-2FB676I?
XC7K160T-2FB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-2FB676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-2FB676I?
For technical support, including XC7K160T-2FB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-2FB676I requirements.
6.How does Aetrix verify that XC7K160T-2FB676I is sourced from the original manufacturer or authorized distributors?
All XC7K160T-2FB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-2FB676I meets industry standards.
7.What is the process for return or replacement of XC7K160T-2FB676I?
All XC7K160T-2FB676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-2FB676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-2FB676I part is unused and in its original packaging.
Return procedure for XC7K160T-2FB676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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