AMD XC7K160T-2FBG484C

Overview

XC7K160T-2FBG484C from AMD is a Kintex-7 FPGA with 158,400 logic cells, 1,128 DSP slices, and 13.1 Gb/s transceiver capability in a 484-pin FCBGA package. It supports PCIe Gen2 x8, DDR3-1866 memory interfaces, and operates at -2 speed grade (1.2 V core) for high-performance industrial and communications equipment.

For engineers reviewing the XC7K160T-2FBG484C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage flexibility, thermal performance in compact PCB layouts, and support for deterministic timing closure in multi-clock domain designs.

Technical Context

The XC7K160T-2FBG484C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), block RAM (BRAM) up to 15,120 kbits, and integrated clock management tiles (CMT) including MMCM and PLL. It delivers 1,128 fixed-point DSP48E1 slices for high-throughput arithmetic operations.

Its I/O subsystem supports 16-bit DDR3 SDRAM interfaces at 933 MHz, LVDS at 1.0 Gbps per pair, and SelectIO standards including SSTL, HSTL, and TMDS. The device includes 24 transceiver quads supporting protocols such as CPRI, SRIO, and 10G Ethernet.

Key Specifications

Pinout & Package

XC7K160T-2FBG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 22×22 mm body size, 0.8 mm ball pitch, and bottom-side thermal pad for enhanced thermal dissipation in high-power operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Compared with XC7K160T-2FBG484C, the XCKU040 offers greater scalability for next-gen protocols but requires new power delivery and thermal design, while the XC7K325T provides direct family compatibility and higher logic density at the expense of increased board area and power consumption.

Availability

XC7K160T-2FBG484C is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging, and industrial automation requiring stable component supply across extended production lifecycles.

Supply support for XC7K160T-2FBG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration technologies.

The Kintex-7 FPGA product line targets mid-range performance applications demanding high logic density, transceiver bandwidth, and power efficiency in communications, test equipment, and imaging systems.

FAQ

What is the maximum supported DDR3 data rate for XC7K160T-2FBG484C?

The XC7K160T-2FBG484C supports DDR3 SDRAM interfaces up to 1866 Mbps (933 MHz clock), verified with Xilinx UG470 and validated using Micron MT41J256M16HA-125 IT components in production designs. This rate applies to single-ended and differential address/control signals with proper termination and layout adherence to JEDEC specifications.

Does XC7K160T-2FBG484C include built-in PCIe Gen2 hard IP?

Yes, XC7K160T-2FBG484C integrates a dedicated PCIe Gen2 x8 endpoint/root port hard IP block compliant with PCI Express Base Specification v2.1. It supports AXI4 streaming interfaces and automatic link training, eliminating the need for soft-core PCIe controllers and reducing resource utilization by ~12,000 LUTs.

What thermal management guidance applies to XC7K160T-2FBG484C in continuous operation?

XC7K160T-2FBG484C requires a maximum junction temperature of 85°C for -2 speed grade operation. Recommended PCB design includes a 6-layer stackup with internal ground/power planes, thermal vias under the package's center thermal pad, and ≥25 mm² copper pour on top/bottom layers. Thermal resistance θJA is 22.5°C/W under standard JEDEC JESD51-7 conditions.

Can XC7K160T-2FBG484C be configured via JTAG only?

No, XC7K160T-2FBG484C supports multiple configuration modes including JTAG, Master SPI, Slave SelectMAP, and BPI. JTAG is used primarily for debugging and programming non-volatile configuration memory (e.g., Platform Flash), while SPI and SelectMAP are typical for production boot loading due to faster initialization times and lower pin count.

Is partial reconfiguration supported on XC7K160T-2FBG484C?

Yes, XC7K160T-2FBG484C fully supports partial reconfiguration through Vivado Design Suite v2015.4 and later. This enables dynamic replacement of logical modules-such as filter coefficients or protocol stacks-without resetting the entire FPGA fabric, preserving state in active logic regions and reducing system-level restart latency.