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AMD XC7K160T-2FBG484I
- Part No.:
- XC7K160T-2FBG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7K160T-2FBG484I.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,380
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Product details
Overview
XC7K160T-2FBG484I from AMD is a Kintex-7 FPGA with 158,200 logic cells, 12.5 Gbps GT transceivers, and -2 speed grade operating over –40°C to +100°C industrial temperature range. It integrates 1,128 DSP slices, 14,400 Kb of block RAM, and supports PCI Express Gen2 x8 endpoint configuration in high-throughput data acquisition systems.
For engineers reviewing the XC7K160T-2FBG484I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O bank voltage flexibility (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), and support for DDR3-1866 memory interfaces.
Technical Context
The XC7K160T-2FBG484I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and integrated clock management tiles (CMT) containing MMCM and PLL blocks. It delivers deterministic timing closure for synchronous designs requiring sub-nanosecond jitter tolerance.
Its 484-pin FCBGA package supports 300 user I/Os distributed across 16 I/O banks, each independently configurable for LVCMOS, SSTL, HSTL, or differential standards including LVDS and TMDS. Configuration occurs via Master SPI, SelectMAP, or JTAG interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,200 - determines maximum combinational and sequential logic capacity for RTL implementation |
| Speed Grade | -2 - guarantees timing performance up to 1.25 GHz internal clock frequency under worst-case industrial conditions |
| Transceiver Speed | 12.5 Gbps - enables single-lane 10GBASE-KR or multi-lane CPRI/OBSAI protocols |
| Block RAM | 14,400 Kb - supports dual-port FIFOs, large lookup tables, or frame buffers without external memory |
| DSP Slices | 1,128 - provides fixed-point arithmetic throughput for real-time filtering or FFT acceleration |
| I/O Banks | 16 - allows mixed-voltage interface coexistence (e.g., 1.8V sensor interface + 3.3V legacy bus) |
| Operating Temp | –40°C to +100°C - qualified for deployment in sealed industrial enclosures without active cooling |
Pinout & Package
Package: 484-pin Fine-Pitch Column Grid Array (FCBGA), 23 mm × 23 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multifunction I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects directly to PS-side peripherals |
| HR Bank 0–15 | High-Range I/O Bank | Supports 1.2V–3.3V signaling; each bank has independent VCCO and VREF |
| GTX Quad (Q0–Q3) | Transceiver Quad | Each contains 4 GTX transceivers sharing reference clocks and power rails |
| CCLK, INIT_B, DONE | Configuration Pins | Control FPGA startup sequence and indicate configuration completion status |
| VCCAUX, VCCINT, VCCO | Power Supply Rails | VCCAUX = 1.8V auxiliary; VCCINT = 1.0V core; VCCO = bank-specific I/O voltage |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP enables plug-and-play host communication without soft-core overhead |
| DDR3-1866 Interface | Hard memory controller supports 16-bit/32-bit interfaces with on-die termination calibration |
| Partial Reconfiguration Support | Allows dynamic module swapping during operation-critical for adaptive radar waveform updates |
| AXI Interconnect Fabric | Provides low-latency, high-bandwidth connectivity between PS and PL, and among PL IP blocks |
| UltraScale-compatible Toolflow | Enables migration path to newer families using same Vivado design environment and constraints syntax |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; GTX transceivers stream ADC samples at 5 GSPS aggregate rate. Use Value: 1,128 DSP slices enable >200 GMAC/s compute density while maintaining deterministic latency under thermal stress. | Use Scenario: High-resolution ultrasound image reconstruction with parallel channel processing. IC Role / Device Role / Timing Role: Configurable logic implements custom FIR filters and scan-converter pipelines; DDR3-1866 interface buffers raw RF data. Use Value: 14,400 Kb block RAM eliminates need for external frame memory, reducing BOM cost and board area. |
| Industrial Ethernet Gateway | Test & Measurement Equipment |
Use Scenario: Protocol translation between PROFINET RT and Time-Sensitive Networking (TSN) networks. IC Role / Device Role / Timing Role: Hard PCIe endpoint connects to x86 host CPU; HR I/O banks interface with multiple PHYs supporting IEEE 802.1AS timestamping. Use Value: 300 user I/Os allow concurrent management of 4× 1000BASE-T ports plus diagnostics LEDs and safety relays. | Use Scenario: Modular oscilloscope digitizer with 12-bit, 1 GS/s sampling per channel. IC Role / Device Role / Timing Role: GTX transceivers transmit acquired waveforms to host PC; MMCM generates precise sample clocks with <150 fs RMS jitter. Use Value: -2 speed grade ensures setup/hold timing margins remain positive across full industrial temperature range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | Ultrascale architecture, higher logic density (375K LC), 16.3 Gbps transceivers, larger package (1156-pin) | Better suited for multi-channel 5G NR baseband processing where >200 Gbps serial bandwidth is required | Select when migrating to higher bandwidth or needing hardened 100G Ethernet MAC |
| XC7K325T-2FFG901I | Same Kintex-7 family, higher logic count (326K LC), 901-pin FFG package, more I/Os (500) | Preferred for complex video processing pipelines requiring multiple HD-SDI inputs and outputs | Choose when additional CLBs and I/Os justify larger PCB footprint and thermal management |
Compared with XC7K160T-2FBG484I, XC7K325T-2FFG901I offers nearly double logic resources and I/O count but requires board redesign; XCKU040-2FFVA1156I delivers superior transceiver performance and scalability but increases cost and power by ~40%.
Availability
XC7K160T-2FBG484I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, industrial Ethernet gateway, and test & measurement equipment requiring stable component supply across extended temperature ranges.
Supply support for XC7K160T-2FBG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Kintex-7 family targets high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources-optimized for wired communications, video processing, and industrial automation.
FAQ
What is the maximum supported DDR3 memory speed for XC7K160T-2FBG484I?
The XC7K160T-2FBG484I integrates a hard memory controller supporting DDR3-1866 (933 MHz) with 16-bit or 32-bit data bus widths. This capability is verified in UG473 and enables direct connection to standard SO-DIMM modules without external level shifters or glue logic. The XC7K160T-2FBG484I achieves this using calibrated on-die termination and phase-aligned clocking across all byte lanes.
Does XC7K160T-2FBG484I support partial reconfiguration?
Yes, XC7K160T-2FBG484I supports partial reconfiguration through Vivado Design Suite tools and associated bitstream generation flows. This feature allows runtime replacement of logic modules while keeping the rest of the design operational-a capability used in adaptive radar and software-defined radio applications. The XC7K160T-2FBG484I implements this using frame-based configuration access and dedicated ICAP interface routing.
What transceiver protocols are natively supported by XC7K160T-2FBG484I?
XC7K160T-2FBG484I GTX transceivers natively support PCIe Gen2, SATA, CPRI, and Aurora protocols via hard IP cores. They operate at 600 Mbps to 12.5 Gbps with built-in 8B/10B encoding and elastic buffers. The XC7K160T-2FBG484I does not include native support for USB 3.0 or HDMI TX/RX without external PHYs or soft IP.
What is the I/O voltage range supported by XC7K160T-2FBG484I HR banks?
XC7K160T-2FBG484I HR (High-Range) I/O banks support VCCO voltages from 1.2V to 3.3V, enabling interoperability with legacy 5V-tolerant peripherals (via series resistors), modern 1.8V sensors, and 3.3V industrial buses. Each of the 16 HR banks has independent VCCO and VREF supplies, allowing mixed-voltage operation on a single device. This flexibility is confirmed in DS182 for XC7K160T-2FBG484I.
Is XC7K160T-2FBG484I qualified for automotive applications?
No, XC7K160T-2FBG484I is specified for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While it operates reliably within automotive under-hood ambient limits, it lacks automotive-specific reliability testing, failure mode analysis, and traceability documentation required for Tier-1 automotive ECUs. For automotive use, AMD recommends the XA7K160T variant instead of XC7K160T-2FBG484I.
XC7K160T-2FBG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7K160T-2FBG484I FAQ
1.How can I place an order for XC7K160T-2FBG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-2FBG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-2FBG484I reliable?
The price and inventory of XC7K160T-2FBG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-2FBG484I is usually 5 days.
3.What payment methods are accepted for XC7K160T-2FBG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-2FBG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-2FBG484I?
XC7K160T-2FBG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-2FBG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-2FBG484I?
For technical support, including XC7K160T-2FBG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-2FBG484I requirements.
6.How does Aetrix verify that XC7K160T-2FBG484I is sourced from the original manufacturer or authorized distributors?
All XC7K160T-2FBG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-2FBG484I meets industry standards.
7.What is the process for return or replacement of XC7K160T-2FBG484I?
All XC7K160T-2FBG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-2FBG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-2FBG484I part is unused and in its original packaging.
Return procedure for XC7K160T-2FBG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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