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AMD XC7K160T-2FBG676C
- Part No.:
- XC7K160T-2FBG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-2FBG676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,758
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Product details
Overview
XC7K160T-2FBG676C from AMD (Xilinx) is a Kintex-7 FPGA featuring 158,400 logic cells, 840 DSP slices, 13.1 Gb/s transceiver capability, and 16.8 Mb of block RAM. It serves as a high-performance programmable logic fabric in PCIe Gen3 endpoint systems, high-throughput data acquisition, and real-time video processing pipelines.
For engineers reviewing the XC7K160T-2FBG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2–3.3 V), transceiver lane count (16 lanes), speed grade (-2), and thermal performance in FBG676 packaging for industrial temperature operation.
Technical Context
The XC7K160T-2FBG676C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated SelectIO resources supporting SSTL, HSTL, LVCMOS, and differential standards. Its transceivers comply with PCIe Gen3, SATA, and CPRI protocols.
It includes dual 32-bit AXI-4 interconnects, hardened memory controllers for DDR3/DDR2/LPDDR2, and clock management tiles with MMCM and PLL for jitter reduction. Configuration occurs via JTAG, SPIx4, or BPI parallel interfaces with AES encryption support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 840 - enables parallel multiply-accumulate operations at up to 450 MHz for signal processing workloads |
| Block RAM | 16.8 Mb - supports large on-chip buffering, FIFOs, and lookup tables without external memory |
| Transceiver Lanes | 16 × 13.1 Gb/s - provides native PCIe Gen3 x16 or multi-protocol serial connectivity |
| I/O Standards | SSTL-18/15, HSTL-I/II, LVCMOS 1.2–3.3 V - ensures interoperability with diverse memory and interface ICs |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequencies under industrial temperature conditions |
| Operating Temp | 0°C to 85°C (case) - validated for sustained operation in industrial control and embedded vision environments |
Pinout & Package
XC7K160T-2FBG676C is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 29 × 29 mm body size, 1.0 mm ball pitch, and thermal-enhanced construction for industrial thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O | Configurable as PS peripherals (UART, SPI, I2C, SDIO) or PL I/O with bank-specific voltage support |
| HR Bank Pins | High-Range I/O | Support 1.2–3.3 V signaling; used for DDR3 interfaces and high-speed parallel buses |
| HP Bank Pins | High-Performance I/O | Support 1.2–1.8 V; optimized for transceiver reference clocks and low-voltage differential signaling |
| GTX Quad RefClk | Transceiver Reference Clock | Provides low-jitter input to GTX transceiver quads for PCIe Gen3 or SATA link stability |
| CONFIG_MODE[0:2] | Configuration Mode Selection | Determines boot source: JTAG, SPIx4, or BPI parallel during power-up initialization |
Key Features
| Feature | Design Value |
|---|---|
| Hardened Memory Controller | Supports DDR3-1866, DDR2-800, LPDDR2-1066 with full calibration and error correction |
| PCIe Gen3 Endpoint Hard IP | Integrated root port logic enabling direct connection to host CPU without external bridge IC |
| AES-256 Bitstream Encryption | Prevents unauthorized configuration and intellectual property theft during field programming |
| Partial Reconfiguration Support | Allows dynamic logic module swapping without system reset-critical for adaptive radar and comms systems |
| AXI Interconnect Fabric | Dual 32-bit AXI4-Lite and AXI4-Stream interfaces simplify SoC-level integration with ARM Cortex-A9 PS |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 840 DSP slices and 13.1 Gb/s transceivers enable >10 GSPS data ingestion and sub-microsecond response. | Use Scenario: High-resolution ultrasound image reconstruction and DICOM compression pipeline. IC Role / Device Role / Timing Role: Accelerates 2D/3D FFT, interpolation, and JPEG2000 encoding while managing multiple sensor inputs. Use Value: 16.8 Mb block RAM buffers raw RF data streams; HR I/O drives DDR3 memory at 1866 Mbps. |
| Industrial Vision Control | 5G Baseband Prototyping |
Use Scenario: Multi-camera synchronization and real-time defect classification in automated optical inspection (AOI). IC Role / Device Role / Timing Role: Configurable logic handles pixel-level preprocessing, GigE Vision transport, and FPGA-to-CPU handoff. Use Value: 158,400 logic cells support concurrent CNN inference kernels and deterministic frame capture timing. | Use Scenario: Layer 1 PHY prototyping for massive MIMO and channel estimation in 5G NR base stations. IC Role / Device Role / Timing Role: GTX transceivers interface directly with RFICs; DSP slices perform real-time FFT and filtering. Use Value: 16-lane transceiver support enables full-bandwidth 5G FR1 signal generation and analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, 376K logic cells, higher transceiver bandwidth (16.3 Gb/s), larger package (1156-pin) | Better suited for 100G Ethernet and advanced radar with wider data paths | Select when migrating to higher throughput or requiring PCIe Gen4 support |
| XC7K325T-2FFG901C | Same Kintex-7 family, 326K logic cells, 28.8 Mb BRAM, 24 transceiver lanes, larger FBGA901 package | Enables more complex SoC designs with additional hard IP and memory bandwidth | Choose for scaling existing Kintex-7 designs where pin compatibility is not required |
Compared with XC7K160T-2FBG676C, the XCKU040 offers architectural advancement and bandwidth headroom but requires PCB redesign, while XC7K325T delivers immediate Kintex-7 scalability with no toolchain change but increases board area and cost.
Availability
XC7K160T-2FBG676C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and industrial vision control requiring stable component supply across extended product lifecycles.
Supply support for XC7K160T-2FBG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) is a global semiconductor leader delivering adaptive computing platforms for data center, AI, and embedded markets.
The Kintex-7 family was designed for cost-optimized high-performance applications including wired communications, video processing, and industrial automation with balanced logic, memory, and I/O resources.
FAQ
What is the maximum supported DDR3 data rate for XC7K160T-2FBG676C?
The XC7K160T-2FBG676C supports DDR3-1866 (933 MHz) using its hardened memory controller with full calibration and on-die termination. This capability is verified in Xilinx UG473 and applies specifically to the XC7K160T-2FBG676C's HR I/O banks configured for SSTL15. The -2 speed grade ensures timing margin for stable operation at this rate under industrial temperature conditions.
Does XC7K160T-2FBG676C include built-in PCIe Gen3 hard IP?
Yes, the XC7K160T-2FBG676C integrates a PCIe Gen3 x8 or x16 endpoint hard IP block compliant with PCI Express Base Specification v3.0. This eliminates the need for external protocol translation and reduces design complexity. The hard IP is accessible via AXI4-Stream and supports MSI/MSI-X interrupt delivery, as documented in Xilinx PG054 for Kintex-7 PCIe solutions.
What configuration modes does XC7K160T-2FBG676C support?
The XC7K160T-2FBG676C supports JTAG, master SPIx4, and master BPI parallel configuration modes. Mode selection is controlled by CONFIG_MODE[2:0] pins at power-up. SPIx4 is most common for compact, low-pin-count deployment; BPI is used for high-speed parallel loading from NOR flash. All modes support AES-256 bitstream encryption.
Is XC7K160T-2FBG676C qualified for industrial temperature operation?
Yes, the XC7K160T-2FBG676C is rated for 0°C to +85°C case temperature operation and is marked with suffix 'C' indicating industrial-grade qualification. Thermal performance is validated per Xilinx DS182, including junction temperature limits and thermal resistance values specific to the FBG676 package under defined airflow and PCB copper pour conditions.
How many GTX transceiver quads does XC7K160T-2FBG676C contain?
The XC7K160T-2FBG676C contains four GTX transceiver quads, totaling 16 transceiver lanes each capable of 13.1 Gb/s operation. Each quad shares reference clock inputs and power rails, and supports protocols including PCIe Gen3, SATA, and CPRI. Lane assignment and clocking are configured via Xilinx Vivado tools using the transceiver wizard.
XC7K160T-2FBG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-2FBG676C FAQ
1.How can I place an order for XC7K160T-2FBG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-2FBG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-2FBG676C reliable?
The price and inventory of XC7K160T-2FBG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-2FBG676C is usually 5 days.
3.What payment methods are accepted for XC7K160T-2FBG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-2FBG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-2FBG676C?
XC7K160T-2FBG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-2FBG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-2FBG676C?
For technical support, including XC7K160T-2FBG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-2FBG676C requirements.
6.How does Aetrix verify that XC7K160T-2FBG676C is sourced from the original manufacturer or authorized distributors?
All XC7K160T-2FBG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-2FBG676C meets industry standards.
7.What is the process for return or replacement of XC7K160T-2FBG676C?
All XC7K160T-2FBG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-2FBG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-2FBG676C part is unused and in its original packaging.
Return procedure for XC7K160T-2FBG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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