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AMD XC7K160T-2FBG676I
- Part No.:
- XC7K160T-2FBG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-2FBG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,417
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Product details
Overview
XC7K160T-2FBG676I from AMD (Xilinx) is a Kintex-7 FPGA featuring 158,400 logic cells, 840 DSP slices, 13.1 Gb/s transceiver capability, and -2 speed grade in a 676-pin FCBGA package; used in high-throughput data acquisition and real-time signal processing systems.
For engineers reviewing the XC7K160T-2FBG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), transceiver lane count (16 lanes), total block RAM (7,790 kbits), and thermal design power (14.5 W typical).
Technical Context
The XC7K160T-2FBG676I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated PCIe Gen2 x8 endpoint capability. It supports DDR3 memory interfaces up to 1,866 Mbps and includes 16 multi-gigabit transceivers operating at 6.6–13.1 Gb/s.
Configuration is performed via JTAG, SelectMAP, or SPI interface; configuration memory is external. The device includes hardened clock management tiles (CMTs) with MMCM and PLL blocks for low-jitter clock synthesis and phase alignment across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 840 - enables parallel fixed/floating-point computation for radar, motor control, or AI inference acceleration |
| Block RAM | 7,790 kbits - supports on-chip buffering for video frame storage, FIFOs, or coefficient tables |
| Transceivers | 16 lanes @ 6.6–13.1 Gb/s - provides SerDes connectivity for CPRI, JESD204B, or 10GbE interfaces |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, TMDS - enables direct interfacing with ADCs, DACs, memory, and display controllers |
| Speed Grade | -2 - guarantees timing closure at higher clock frequencies than -1 grade, with tighter setup/hold margins |
| TDP | 14.5 W typical - defines thermal envelope for heatsink sizing and airflow planning in enclosed enclosures |
Pinout & Package
XC7K160T-2FBG676I is housed in a 27×27 mm, 676-ball Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch and Pb-free, RoHS-compliant packaging. The package supports thermal dissipation via exposed thermal pad on underside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O bank | Configurable as PS peripherals (UART, SDIO, SPI) or PL I/O; shared between Processing System and Programmable Logic |
| PL_IO[0:499] | Programmable Logic I/O | Supports 1.2V–3.3V signaling; grouped into 16 banks with independent VCCO and VREF per bank |
| GTX_CLK0_M2C_P/N | Transceiver reference clock input | Differential pair driving GTX quad; required for 10+ Gb/s serial link operation |
| VCCAUX | Analog auxiliary supply | 1.8V supply for transceivers, configuration logic, and clock management circuitry |
| CONFIG_DONE | Configuration status output | Open-drain signal indicating successful bitstream loading and initialization completion |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Hard IP block enabling direct host CPU communication without external bridge IC or soft-core overhead |
| DDR3 Memory Controller | Integrated controller supporting 1–4 memory ranks, up to 1,866 Mbps, with calibration and error correction |
| AXI Interconnect Fabric | Scalable on-chip interconnect supporting AXI3/AXI4 protocols for high-bandwidth master-slave data routing |
| Partial Reconfiguration Support | Enables dynamic logic module swapping during operation-critical for adaptive radio or multi-mode protocol handling |
| UltraScale-compatible Toolflow | Vivado 2022.2+ supports migration path, constraint reuse, and IP integration continuity |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; transceivers interface with ADC/DACs sampling at 250+ MSPS. Use Value: 840 DSP slices enable concurrent 1024-point FFTs at 10 kHz update rate; 13.1 Gb/s transceivers sustain raw sensor data ingestion. | Use Scenario: High-resolution ultrasound image reconstruction and DICOM compression pipeline. IC Role / Device Role / Timing Role: Configurable logic manages echo digitization, beam summation, and GPU-offloaded rendering prep. Use Value: 7,790 kbits block RAM buffers full-frame RF data; PCIe Gen2 x8 enables 2 GB/s host transfer to workstation memory. |
| Industrial Machine Vision | 5G Wireless Test Equipment |
Use Scenario: Sub-millisecond latency inspection of PCB solder joints using multi-camera synchronized capture. IC Role / Device Role / Timing Role: Timing-critical I/O handles camera triggers and strobe signals; logic implements real-time blob detection and defect classification. Use Value: 158,400 logic cells accommodate dual-camera MIPI CSI-2 receivers + CNN accelerator; -2 speed grade ensures <8 ns path delay. | Use Scenario: Protocol-aware signal generation and analysis in 5G NR FR1 base station validation. IC Role / Device Role / Timing Role: Baseband processing unit generating/analyzing OFDM symbols; transceivers connect to RF front-end via JESD204B v1.1. Use Value: 16 transceiver lanes support dual 4×4 MIMO streams; DSP slices execute real-time channel estimation and PAPR reduction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K325T-2FFG901I | Higher logic density (326,080 LCs), more transceivers (24 lanes), larger package (901-ball FFG) | Required when >158K LCs or >16 transceivers needed; not pin-compatible | Select only if design requires additional DSP slices or memory bandwidth beyond XC7K160T-2FBG676I capacity |
| XC7A200T-2FBG676I | Artix-7 family; lower power (9.2 W TDP), fewer DSP slices (640), no PCIe hard IP | Suitable for cost-sensitive, lower-throughput embedded vision or motor control where PCIe is unnecessary | Choose for reduced BOM cost and thermal footprint when transceiver count and logic density requirements are relaxed |
Compared with XC7K325T-2FFG901I, the XC7K160T-2FBG676I offers optimized balance of transceiver count, logic resources, and thermal envelope for mid-range 5G test and radar systems; versus XC7A200T-2FBG676I, it delivers hardened PCIe and higher-speed SerDes essential for host-connected instrumentation.
Availability
XC7K160T-2FBG676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, industrial machine vision, and 5G wireless test equipment requiring stable component supply across long-lifecycle deployments.
Supply support for XC7K160T-2FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) designs adaptive computing platforms including FPGAs, adaptive SoCs, and ACAPs for high-performance, low-latency applications.
The Kintex-7 family targets high-throughput, cost-sensitive applications demanding advanced transceivers, DSP, and memory bandwidth-such as wireless infrastructure, test & measurement, and medical imaging.
FAQ
What is the maximum supported DDR3 data rate for XC7K160T-2FBG676I?
The XC7K160T-2FBG676I supports DDR3 memory interfaces up to 1,866 Mbps with built-in calibration and termination control. This rate is achievable using the integrated MIG (Memory Interface Generator) IP core in Vivado, provided board layout meets impedance and timing constraints specified in UG586. The XC7K160T-2FBG676I's I/O banks are configured for SSTL15 or SSTL135 standards to meet JEDEC DDR3 timing windows.
Does XC7K160T-2FBG676I include a hard PCIe controller?
Yes, the XC7K160T-2FBG676I integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification 2.1. This eliminates the need for soft-core implementations and reduces logic utilization. The XC7K160T-2FBG676I supports both root complex and endpoint modes via configuration pins and does not require external PHY components for standard PCIe slot interfacing.
What is the purpose of the MIO pins on XC7K160T-2FBG676I?
The MIO[0:53] pins on XC7K160T-2FBG676I serve as multiplexed I/O for the integrated Processing System (PS), providing direct access to peripherals such as UART, SDIO, SPI, I2C, CAN, and GPIO. These pins are fixed-function and cannot be reassigned to programmable logic. Their use is managed through the PS configuration in Vivado's Block Design, and they appear as dedicated ports in the XC7K160T-2FBG676I's Zynq-7000 compatible PS architecture.
Can XC7K160T-2FBG676I operate in industrial temperature range?
Yes, the XC7K160T-2FBG676I is rated for the industrial temperature range of –40°C to +100°C junction temperature (indicated by the 'I' suffix). This rating is verified per Xilinx DS182 and applies to all static and dynamic specifications in the device's data sheet. Thermal design must ensure the XC7K160T-2FBG676I's Tj remains within this limit under worst-case power and ambient conditions.
How many transceiver quads does XC7K160T-2FBG676I contain?
The XC7K160T-2FBG676I contains four GTX transceiver quads, each supporting four lanes, for a total of 16 transceiver lanes. Each GTX quad includes dedicated clocking resources (QPLL/CPLL), PRBS generators/checkers, and 8B/10B encoding blocks. All 16 lanes are fully functional and routable in the XC7K160T-2FBG676I's I/O banking structure per UG476.
XC7K160T-2FBG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-2FBG676I FAQ
1.How can I place an order for XC7K160T-2FBG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-2FBG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-2FBG676I reliable?
The price and inventory of XC7K160T-2FBG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-2FBG676I is usually 5 days.
3.What payment methods are accepted for XC7K160T-2FBG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-2FBG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-2FBG676I?
XC7K160T-2FBG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-2FBG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-2FBG676I?
For technical support, including XC7K160T-2FBG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-2FBG676I requirements.
6.How does Aetrix verify that XC7K160T-2FBG676I is sourced from the original manufacturer or authorized distributors?
All XC7K160T-2FBG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-2FBG676I meets industry standards.
7.What is the process for return or replacement of XC7K160T-2FBG676I?
All XC7K160T-2FBG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-2FBG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-2FBG676I part is unused and in its original packaging.
Return procedure for XC7K160T-2FBG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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