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AMD XC7K160T-2FF676C
- Part No.:
- XC7K160T-2FF676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-2FF676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,406
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Product details
Overview
XC7K160T-2FF676C from AMD (Xilinx) is a Kintex-7 FPGA with 158,400 logic cells, 840 DSP slices, 13.1 Gb/s transceiver capability, and 16.8 Mb of block RAM, deployed in high-performance wired communications and radar signal processing systems.
For engineers reviewing the XC7K160T-2FF676C datasheet, pinout, applications, or equivalent options, key selection factors include speed grade (-2), flip-chip fine-pitch BGA package (676-pin), I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), and transceiver compliance with PCIe Gen2, SATA, and CPRI standards.
Technical Context
The XC7K160T-2FF676C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), integrated 36 Kb block RAMs, and multi-gigabit transceivers supporting line rates from 600 Mb/s to 13.1 Gb/s. It includes clock management tiles with MMCM and PLL resources for jitter reduction and phase alignment.
It supports SelectIO interfaces with programmable drive strength, slew rate, and on-die termination across 16 banks, and integrates AXI-4 compliant interconnect infrastructure for SoC-style integration with soft or hard processors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - total available LUTs + flip-flops for combinational and sequential logic implementation |
| DSP Slices | 840 - dedicated 25×18 multiplier-accumulator units for high-throughput arithmetic |
| Block RAM | 16.8 Mb - distributed as 36 Kb BRAM primitives usable as memory, FIFO, or shift register |
| Transceiver Speed | 13.1 Gb/s - maximum line rate per GTPE2 channel, supporting PCIe Gen2 x8 and CPRI Option 7 |
| I/O Banks | 16 - independent voltage domains enabling mixed-voltage interface design (1.2V–3.3V) |
| Speed Grade | -2 - guaranteed timing performance at industrial temperature range (0°C to 85°C junction) |
| Package | FF676 - 676-pin flip-chip BGA, 27×27 mm, 1.0 mm pitch, RoHS-compliant |
Pinout & Package
XC7K160T-2FF676C uses a 676-pin flip-chip BGA (FF676) package with 16 I/O banks, power/ground redundancy, and dedicated configuration, JTAG, and transceiver reference clock pins. Thermal pad is exposed on underside for PCB-level heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration logic during master serial or slave parallel mode startup |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and device initialization |
| INIT_B | Configuration Initialization | Active-low input that resets configuration logic and clears internal state prior to reload |
| M0–M2 | Mode Selection | Three-pin bus setting boot source (e.g., SPIx4, BPI, JTAG) and configuration width |
| GTX_CLK0_M2L17 | Transceiver Reference Clock | Dedicated differential input for GTPE2 transceiver tile clocking at up to 800 MHz |
| VCCINT | Core Supply | 1.0V ±3% supply for FPGA fabric and CLB logic; requires low-noise regulation |
Key Features
| Feature | Design Value |
|---|---|
| High-speed transceivers | 20 GTPE2 channels supporting 600 Mb/s–13.1 Gb/s with built-in 8B/10B encoding and PRBS generation |
| Advanced clock management | 12 MMCMs and 4 PLLs enabling sub-100 fs jitter synthesis and dynamic phase shifting |
| SelectIO technology | Programmable I/O standards including LVDS, SSTL, HSTL, and MIPI D-PHY with calibrated input delay |
| AXI interconnect | Hardened AXI-4 compliant crossbar supporting up to 128-bit data width and 400 MHz operation |
| Partial reconfiguration support | Enables dynamic logic module swapping without full device reset or system interruption |
Applications
| Wireless Baseband Processing | Radar Signal Processing |
|---|---|
Use Scenario: Real-time FFT, beamforming, and digital predistortion in LTE-A and 5G NR macro base stations. IC Role / Device Role / Timing Role: Programmable logic fabric executing custom PHY-layer algorithms with deterministic latency. Use Value: 13.1 Gb/s transceivers interface directly with RFICs via CPRI or eCPRI, eliminating external serializer/deserializer chips. | Use Scenario: Pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: High-throughput data path accelerator synchronizing ADC/DAC streams and managing DMA transfers to DDR3 memory. Use Value: 840 DSP slices deliver >2.1 TMAC/s peak compute for real-time matched filtering and clutter suppression. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Ultrasound beamformer control and raw RF data preprocessing in portable diagnostic systems. IC Role / Device Role / Timing Role: Time-critical I/O controller aggregating 128-channel echo data with sub-ns channel-to-channel skew control. Use Value: 16 I/O banks enable simultaneous LVDS (for probe interface) and DDR3 (for frame buffering) signaling without level-shifting components. | Use Scenario: High-resolution oscilloscope front-end digitization and protocol analysis in 12+ GHz bandwidth instruments. IC Role / Device Role / Timing Role: Real-time pattern generator and error detector using deterministic transceiver loopback and PRBS checking. Use Value: Built-in GTPE2 PRBS generators and checkers validate signal integrity at 13.1 Gb/s without external test equipment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K325T-2FF900C | Higher logic capacity (326,080 LCs), more transceivers (24), larger package (900-pin) | Required when >158K LCs or >20 GT channels needed; higher power and board area cost | Select XC7K325T-2FF900C only if design exceeds XC7K160T-2FF676C resource limits |
| XC7K70T-2FBG484C | Fewer logic cells (74,000), no transceivers, smaller 484-pin BGA package | Suitable for cost-sensitive I/O expansion or glue logic where high-speed serial links are absent | Choose XC7K70T-2FBG484C when transceivers and DSP density are unnecessary |
Compared with XC7K325T-2FF900C and XC7K70T-2FBG484C, the XC7K160T-2FF676C delivers optimal balance of transceiver count, DSP density, and I/O flexibility for mid-range 5G and radar systems-avoiding overdesign while retaining upgrade headroom.
Availability
XC7K160T-2FF676C is available at Aetrix Electronics and suitable for wireless infrastructure, aerospace radar, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XC7K160T-2FF676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) designs adaptive computing platforms for data center, AI, and embedded applications with focus on heterogeneous acceleration.
The Kintex-7 family targets high-performance, cost-sensitive applications demanding transceiver bandwidth, DSP throughput, and logic density-optimized for wired communications, video processing, and defense electronics.
FAQ
What is the operating temperature range for XC7K160T-2FF676C?
The XC7K160T-2FF676C is rated for industrial temperature operation from 0°C to +85°C junction temperature. This rating applies specifically to the -2 speed grade and FF676 package combination, and thermal design must maintain junction temperature within this range under full static and dynamic load conditions. The XC7K160T-2FF676C does not support extended or military temperature grades.
Does XC7K160T-2FF676C support PCI Express Gen3?
No, the XC7K160T-2FF676C supports PCI Express Gen2 (5.0 GT/s) but not Gen3 (8.0 GT/s). Its GTPE2 transceivers have a maximum line rate of 13.1 Gb/s, which meets Gen2 x8 requirements but falls short of Gen3's 8.0 GT/s per lane. For PCIe Gen3, AMD recommends Virtex-7 or UltraScale families. The XC7K160T-2FF676C remains fully compatible with Gen2 root complexes and endpoints.
How many transceiver quads does XC7K160T-2FF676C contain?
The XC7K160T-2FF676C contains five GTPE2 transceiver quads, totaling 20 transceiver channels. Each quad includes two transmitter/receiver pairs plus shared clocking and reset circuitry. All 20 channels are fully functional and routable in the XC7K160T-2FF676C, with no channel masking or disablement in this specific speed-grade/package variant.
What configuration modes are supported by XC7K160T-2FF676C?
The XC7K160T-2FF676C supports master serial (SPI flash), slave selectMAP (parallel NOR/NAND), JTAG boundary-scan, and system ACE configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstreams can be loaded from single- or quad-SPI flash devices, and fallback mechanisms are implemented via INIT_B assertion. The XC7K160T-2FF676C does not support passive serial or BPI x16 modes.
Is partial reconfiguration supported on XC7K160T-2FF676C?
Yes, partial reconfiguration is fully supported on the XC7K160T-2FF676C using Vivado Design Suite tools and hardware flow. It enables dynamic replacement of logical modules (e.g., filter coefficients or protocol engines) without resetting the entire device or halting active I/O. This capability requires proper floorplanning, checkpointing, and bitstream generation-features validated and documented for the XC7K160T-2FF676C in UG908.
XC7K160T-2FF676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-2FF676C FAQ
1.How can I place an order for XC7K160T-2FF676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-2FF676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-2FF676C reliable?
The price and inventory of XC7K160T-2FF676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-2FF676C is usually 5 days.
3.What payment methods are accepted for XC7K160T-2FF676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-2FF676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-2FF676C?
XC7K160T-2FF676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-2FF676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-2FF676C?
For technical support, including XC7K160T-2FF676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-2FF676C requirements.
6.How does Aetrix verify that XC7K160T-2FF676C is sourced from the original manufacturer or authorized distributors?
All XC7K160T-2FF676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-2FF676C meets industry standards.
7.What is the process for return or replacement of XC7K160T-2FF676C?
All XC7K160T-2FF676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-2FF676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-2FF676C part is unused and in its original packaging.
Return procedure for XC7K160T-2FF676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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