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AMD XC7K160T-2FF676I
- Part No.:
- XC7K160T-2FF676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-2FF676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,586
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Product details
Overview
XC7K160T-2FF676I from AMD is a Kintex-7 FPGA featuring 158,400 logic cells, 1,128 DSP slices, and 13.1 Gb/s transceiver capability in a 676-pin Flip-Chip Fine-Pitch BGA package. It targets high-throughput data processing in radar signal conditioning and 10G Ethernet line cards.
For engineers reviewing the XC7K160T-2FF676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), -2 speed grade timing closure margin, and integrated PCIe Gen2 x8 endpoint functionality.
Technical Context
The XC7K160T-2FF676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), block RAM (BRAM) totaling 9,024 kbits, and 600 SelectIO™ pins supporting single-ended and differential standards. It integrates 24 transceivers operating up to 13.1 Gb/s with built-in PRBS generators and error detectors.
Configuration occurs via Master SPI or JTAG, with support for dual-boot fallback and bitstream encryption using AES-256. The device includes hardened IP blocks for PCIe Gen2 x8, Gigabit Ethernet MACs, and AXI interconnect infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 1,128 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 9,024 kbits - provides on-chip memory for buffering, FIFOs, and coefficient storage |
| Transceiver Speed | 13.1 Gb/s - supports 10GBASE-R, CPRI, and SRIO Gen2 protocols without external retimers |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, TMDS - allows direct interface to DDR3-1866, HDMI, and high-speed ADC/DACs |
| PCIe Integration | Gen2 x8 Endpoint - eliminates need for external PCIe switch or bridge in host-facing designs |
Pinout & Package
XC7K160T-2FF676I uses a 676-pin Flip-Chip Fine-Pitch BGA (FF676) with 0.8 mm pitch, thermal lid, and 27 × 27 mm body size. Pin assignment follows Xilinx UG475 v1.12 for Kintex-7 packaging.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% required for CLB and routing fabric operation |
| VCCAUX | Auxiliary power supply | 1.8V supplies configuration logic, PCIe block, and clock management tiles |
| M0–M2 | Mode pins | Set configuration mode at power-up (e.g., Master SPI, JTAG) |
| CCLK | Configuration clock | Drives internal configuration shift register during SPI programming |
| INIT_B | Configuration status | Active-low open-drain output indicating successful bitstream loading |
| GTREFCLK0_P/N | Transceiver reference clock | Differential input for PLL locking of GTY transceivers operating at 13.1 Gb/s |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2 x8 Endpoint | Reduces integration effort by embedding full protocol stack and PHY layer, eliminating external controller IC |
| Integrated Clock Management (CMT) | Combines MMCM and PLL resources to generate multiple phase-aligned clocks with < ±150 ps jitter (12 kHz–20 MHz) |
| AXI Interconnect Infrastructure | Provides configurable, pipelined crossbar supporting AXI3/AXI4 protocols for multi-master SoC subsystems |
| Bitstream Encryption (AES-256) | Protects intellectual property against reverse engineering and unauthorized cloning of programmed logic |
| Dual-Boot Configuration Support | Enables field-upgradable firmware with fail-safe fallback to known-good configuration image |
Applications
| Radar Signal Processing | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; transceivers interface to high-speed ADCs and DACs. Use Value: 13.1 Gb/s transceivers directly sample IF data at 2.5 GSPS per channel, avoiding external serializer/deserializer chips. | Use Scenario: Aggregation and packet forwarding in telecom central office line cards supporting 10GBASE-R and OTU2. IC Role / Device Role / Timing Role: Implements MAC, PCS, and FEC layers; PCIe Gen2 x8 connects to host CPU for control plane access. Use Value: Hardened PCIe endpoint reduces latency by 120 ns versus soft-core implementations and simplifies driver development. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: High-fidelity image reconstruction pipeline in MRI and CT scanners requiring deterministic latency and high throughput. IC Role / Device Role / Timing Role: Configurable logic processes raw sensor data; BRAM buffers multi-frame datasets before GPU transfer. Use Value: 9,024 kbits of block RAM enables double-buffered acquisition of 16-bit 4K×4K frames at 30 fps without external memory. | Use Scenario: Modular signal generation and analysis in PXIe-based automated test equipment. IC Role / Device Role / Timing Role: Generates precise stimulus waveforms via high-speed I/O; captures response data using transceiver-linked ADC interfaces. Use Value: LVDS and SSTL I/O support enables direct connection to 1.8V/3.3V instrument front-ends without level-shifting components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, 486,400 logic cells, 16.3 Gb/s transceivers, larger FFVA1156 package | Higher gate count and bandwidth suit 25G+ optical transport and AI inference acceleration | Select when >200k logic cells or >16 Gb/s serial I/O are required; requires PCB redesign |
| XC7K325T-2FFG900I | Same Kintex-7 family, 326,080 logic cells, 900-pin FFG900 package, higher I/O count (500) | Supports more parallel interfaces (e.g., dual DDR3 controllers + 10G Ethernet + PCIe) | Choose for designs needing greater I/O density or logic capacity while retaining Kintex-7 toolchain and IP compatibility |
Compared with XC7K160T-2FF676I, the XC7K325T-2FFG900I offers 2x logic resources and 84 additional user I/Os in a larger footprint, whereas the XCKU060-2FFVA1156I delivers 3x logic and faster transceivers but mandates new board layout and Vivado version upgrade.
Availability
XC7K160T-2FF676I is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet infrastructure, and medical imaging backend systems requiring stable component supply across extended production lifecycles.
Supply support for XC7K160T-2FF676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets.
The Kintex-7 FPGA product line targets cost-optimized high-performance applications including wired communications, video processing, and scientific instrumentation where balanced logic, I/O, and DSP resources are critical.
FAQ
What is the maximum supported transceiver data rate for XC7K160T-2FF676I?
The XC7K160T-2FF676I supports transceiver data rates up to 13.1 Gb/s per lane, validated per UG476 for GTY transceivers. This enables compliance with 10GBASE-R, CPRI Option 3, and SRIO Gen2 standards. Operation at this rate requires proper PCB stackup, controlled impedance routing, and GTREFCLK0_P/N signal integrity validation per Xilinx AR54082.
Does XC7K160T-2FF676I include built-in PCIe Gen2 support?
Yes, XC7K160T-2FF676I integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification 2.1. It supports both root port and endpoint configurations, includes TLP parsing/generation, and operates without external PHY. Configuration space is accessible via AXI-Lite interface within the FPGA fabric.
What I/O voltage standards does XC7K160T-2FF676I support?
XC7K160T-2FF676I supports LVCMOS (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), LVDS, BLVDS, RSDS, Differential SSTL, and Differential HSTL. Each bank is independently configurable for VCCO and VREF, enabling mixed-voltage interfaces such as DDR3-1866 (1.5V) alongside 3.3V legacy peripherals on the same device.
How many block RAM resources are available in XC7K160T-2FF676I?
XC7K160T-2FF676I contains 1,080 block RAM primitives, each 36 kbits, totaling 9,024 kbits of distributed on-chip memory. These can be configured as true dual-port RAM, shift registers, or ROM. Usage is reported in Vivado synthesis and implementation reports under "RAMB36E1" utilization.
Is XC7K160T-2FF676I qualified for industrial temperature operation?
Yes, the "I" suffix in XC7K160T-2FF676I denotes industrial temperature grade (-40°C to +100°C junction). Thermal design must maintain Tj ≤ 100°C under worst-case power conditions, as specified in Xilinx DS182. Power estimation should use XPE tool with actual toggle rates and I/O activity profiles.
XC7K160T-2FF676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-2FF676I FAQ
1.How can I place an order for XC7K160T-2FF676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-2FF676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-2FF676I reliable?
The price and inventory of XC7K160T-2FF676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-2FF676I is usually 5 days.
3.What payment methods are accepted for XC7K160T-2FF676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-2FF676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-2FF676I?
XC7K160T-2FF676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-2FF676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-2FF676I?
For technical support, including XC7K160T-2FF676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-2FF676I requirements.
6.How does Aetrix verify that XC7K160T-2FF676I is sourced from the original manufacturer or authorized distributors?
All XC7K160T-2FF676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-2FF676I meets industry standards.
7.What is the process for return or replacement of XC7K160T-2FF676I?
All XC7K160T-2FF676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-2FF676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-2FF676I part is unused and in its original packaging.
Return procedure for XC7K160T-2FF676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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