AMD XC7K160T-2FFG676C

Overview

XC7K160T-2FFG676C from AMD (formerly Xilinx) is a Kintex-7 FPGA featuring 158,400 logic cells, 745 DSP slices, 13.1 Mb of block RAM, and high-speed serial transceivers supporting up to 12.5 Gb/s. It is packaged in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) with 0.8 mm pitch and operates at -2 speed grade for balanced performance and power efficiency. This device serves as a reconfigurable system-on-chip in high-bandwidth data acquisition systems.

For engineers reviewing the XC7K160T-2FFG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (16 GTs), thermal design power (14.5 W typical), and configuration interface options (SPIx4, SelectMAP, JTAG).

Technical Context

The XC7K160T-2FFG676C implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated PCIe Gen2 x8 endpoint capability. It supports DDR3 memory interfaces up to 800 MHz (1600 MT/s) with hardware calibration and includes dual 10/100/1000 Ethernet MACs.

Configuration is performed via Master SPI or Slave SelectMAP mode using external flash or processor-controlled parallel interface. The device integrates hardened clock management tiles (CMT) with MMCM and PLL blocks for low-jitter clock synthesis and phase alignment across multiple domains.

Key Specifications

Pinout & Package

XC7K160T-2FFG676C is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 0.8 mm ball pitch, 27 × 27 mm body size, and RoHS-compliant lead-free finish. The package supports thermal dissipation via exposed thermal pad and requires controlled-impedance PCB routing for high-speed transceivers and memory interfaces.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable computing applications.

Compared with XC7K160T-2FFG676C, XC7K325T-2FFG900C offers scalable logic and transceiver resources for expanded system complexity, while XC7A200T-2FBG676C trades transceiver performance and DSP capacity for reduced power and cost-making it suitable for non-RF, deterministic control applications.

Availability

XC7K160T-2FFG676C is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging equipment, and industrial automation systems requiring stable component supply and long-term manufacturing continuity.

Supply support for XC7K160T-2FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, ACAPs, and AI accelerators for data center, edge, and embedded markets.

The Kintex-7 family targets high-performance, cost-sensitive applications demanding optimized logic density, transceiver bandwidth, and power efficiency-especially in communications, video, and test equipment.

FAQ

What is the maximum supported DDR3 data rate for XC7K160T-2FFG676C?

The XC7K160T-2FFG676C supports DDR3 memory interfaces up to 800 MHz clock frequency (1600 MT/s data rate) with integrated PHY and hardware-calibrated I/O. This capability is verified in Xilinx UG470 and validated using reference designs targeting Micron MT41J128M16JT-125K components under industrial temperature conditions.

Does XC7K160T-2FFG676C include a hard PCIe endpoint block?

Yes, XC7K160T-2FFG676C integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.1. This eliminates the need for soft IP implementation and reduces resource usage, enabling deterministic latency and simplified verification in host-connected systems.

What configuration modes does XC7K160T-2FFG676C support?

XC7K160T-2FFG676C supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Mode selection is determined by M0–M2 pin states at power-up, and all modes are documented in Xilinx UG470 with timing requirements and interface schematics for each method.

Is XC7K160T-2FFG676C qualified for automotive applications?

No, XC7K160T-2FFG676C is rated for commercial and industrial temperature ranges (0°C to +85°C and –40°C to +100°C for extended versions), but it is not AEC-Q100 qualified. For automotive use, AMD offers the XA7K160T variant with full AEC-Q100 Grade 3 qualification and automotive-specific documentation.

How many GT transceiver lanes are available on XC7K160T-2FFG676C?

XC7K160T-2FFG676C provides 16 GT (Gigabit Transceiver) lanes operating up to 12.5 Gb/s per lane. These are distributed across four GT banks and support protocols including PCIe Gen2, SATA, CPRI, and custom serial interfaces with programmable equalization and clock recovery.