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AMD XC7K160T-2FFG676I
- Part No.:
- XC7K160T-2FFG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-2FFG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,433
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Product details
Overview
XC7K160T-2FFG676I from AMD is a Kintex-7 FPGA with 158,400 logic cells, 840 DSP slices, and 13.1 Mb of block RAM, packaged in a 676-pin FCBGA with 0.8 mm pitch. It operates at -2 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) and targets high-throughput data processing in radar signal chains.
For engineers reviewing the XC7K160T-2FFG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), transceiver line rate (up to 6.6 Gb/s), and supported configuration modes (JTAG, Master SPI, Slave SelectMAP).
Technical Context
The XC7K160T-2FFG676I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen2 x8, Gigabit Ethernet MACs), and mixed-signal clock management (CMT with MMCM and PLL). It supports partial reconfiguration and AXI4 interconnect for system-on-chip integration.
Configuration is performed via external SPI flash or JTAG, with bitstream encryption and HMAC authentication enabled. The device includes dedicated clock routing networks and 36 I/O banks supporting LVDS, SSTL, HSTL, and TMDS signaling standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 840 - enables parallel multiply-accumulate operations up to 252 GMAC/s at 300 MHz |
| Block RAM | 13.1 Mb - supports large on-chip buffering for video frame stores or packet queues |
| User I/Os | 400 - provides interface flexibility across multiple high-speed protocols and voltage domains |
| Transceiver Max Rate | 6.6 Gb/s - meets CPRI v6.1 and JESD204B subclass 1 requirements for wireless infrastructure |
| Speed Grade | -2 - guarantees timing closure at 1.2 V core supply and industrial temperature range |
| Package | FFG676 - 27×27 mm FCBGA with 0.8 mm pitch, compatible with standard reflow profiles |
Pinout & Package
XC7K160T-2FFG676I is housed in a 676-ball Fine-Pitch Flip-Chip BGA (FFG) package with 27×27 mm body size, 0.8 mm ball pitch, and thermal pad exposed on underside. Pinout follows Xilinx/AMD Kintex-7 FFG676 mechanical and electrical specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G19 | VCCINT | 1.2 V core power supply input for logic fabric and CLBs |
| A18 | VCCAUX | 1.8 V auxiliary supply for configuration, clocking, and I/O banks |
| M20 | VCCO_34 | 1.8 V output supply for Bank 34 I/Os supporting SSTL-18 |
| P15 | INIT_B | Open-drain active-low configuration status indicator |
| R14 | CCLK | Configuration clock input/output for Master SPI mode |
| T13 | DONE | Open-drain active-high signal indicating successful configuration completion |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Hard IP | Reduces latency and resource usage vs. soft-core implementations; supports root complex and endpoint roles |
| AXI4 Interconnect Support | Enables scalable, pipelined, out-of-order transaction routing between multiple masters and slaves |
| Partial Reconfiguration | Allows dynamic logic module swapping without full device reset-critical for adaptive radio systems |
| Bitstream Encryption | Prevents IP theft via AES-256 decryption with HMAC authentication during configuration |
| Multi-Voltage I/O Banks | Supports concurrent operation of LVDS (2.5 V), SSTL-18 (1.8 V), and HSTL (1.5 V) interfaces on same device |
Applications
| Wireless Baseband Processing | Radar Signal Processing |
|---|---|
Use Scenario: Real-time FFT, beamforming, and digital predistortion in 5G massive MIMO base stations. IC Role / Device Role / Timing Role: Primary data-path accelerator implementing configurable PHY layer functions with deterministic latency. Use Value: 840 DSP slices deliver >200 GMAC/s throughput while maintaining sub-100 ns control loop timing. | Use Scenario: Pulse-Doppler processing and CFAR detection in airborne SAR and AEW&C systems. IC Role / Device Role / Timing Role: High-reliability signal processor handling ADC sample ingestion, matched filtering, and Doppler FFT. Use Value: 13.1 Mb block RAM enables full-frame coherent integration without external memory access latency. |
| Test & Measurement Equipment | High-Speed Data Acquisition |
Use Scenario: Multi-channel oscilloscopes and protocol analyzers requiring real-time pattern matching and deep memory buffering. IC Role / Device Role / Timing Role: Real-time trigger engine and on-the-fly data compression unit synchronized to 10 GS/s sampling clocks. Use Value: 400 user I/Os support parallel LVDS capture from 32+ channels while maintaining setup/hold margins. | Use Scenario: Digitizers for particle physics experiments capturing transient waveforms at 5+ GS/s with nanosecond timestamping. IC Role / Device Role / Timing Role: Time-to-digital converter (TDC) controller and histogram accumulator with sub-10 ps resolution. Use Value: CMT with MMCM achieves <50 fs integrated jitter for precise timebase generation across 16 TDC channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, 462,720 logic cells, higher transceiver rate (16.3 Gb/s), larger package (1156-pin) | Better suited for multi-antenna 5G NR FR2 and optical transport where bandwidth exceeds Kintex-7 limits | Select when >6.6 Gb/s serial I/O or >200k logic cells are required; requires PCB redesign |
| XC7K325T-2FFG901I | Same Kintex-7 family, 326,080 logic cells, 901-pin FFG package, higher I/O count (500) | Preferred for designs needing more logic resources and I/Os while retaining identical toolchain and IP compatibility | Drop-in upgrade path within same family if additional resources are needed; same Vivado version support |
Compared with XC7K160T-2FFG676I, the XC7K325T-2FFG901I offers 2x logic capacity and 25% more I/Os with no toolchain change, while the XCKU060-2FFVA1156I delivers 3x transceiver bandwidth and advanced routing but requires new board layout and IP migration.
Availability
XC7K160T-2FFG676I is available at Aetrix Electronics and suitable for wireless infrastructure, radar systems, and high-speed test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC7K160T-2FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family was designed for cost-optimized high-performance applications such as wireless communications, video processing, and medical imaging where balanced logic, DSP, and I/O resources are critical.
FAQ
What is the maximum transceiver line rate supported by the XC7K160T-2FFG676I?
The XC7K160T-2FFG676I supports a maximum transceiver line rate of 6.6 Gb/s per channel. This capability enables compliance with JESD204B subclass 1 and CPRI v6.1 standards. The transceivers are built into the device's GTP/GTX architecture and require proper reference clock conditioning and PCB impedance control to achieve rated performance. XC7K160T-2FFG676I transceiver performance is validated per UG476 specifications under industrial temperature conditions.
Does the XC7K160T-2FFG676I support partial reconfiguration?
Yes, the XC7K160T-2FFG676I fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logic modules without resetting the entire device. Use cases include runtime adaptation in cognitive radio and protocol switching in test equipment. XC7K160T-2FFG676I requires specific floorplanning and checkpoint-based bitstream generation, as documented in UG904.
What configuration modes are available for the XC7K160T-2FFG676I?
The XC7K160T-2FFG676I supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Master SPI is most common for compact, low-pin-count boot from serial flash. JTAG is used for debugging and programming during development. XC7K160T-2FFG676I configuration behavior is controlled by mode pins M[2:0] and is detailed in Table 1-2 of DS182.
What is the industrial temperature range for the XC7K160T-2FFG676I?
The XC7K160T-2FFG676I is rated for operation from -40°C to +100°C ambient temperature. This industrial-grade rating applies to all speed grades marked with suffix 'I'. Thermal design must account for junction-to-case resistance and airflow constraints to maintain reliability. XC7K160T-2FFG676I thermal characteristics are specified in Xilinx AR55970 and UG475.
How many block RAM resources does the XC7K160T-2FFG676I provide?
The XC7K160T-2FFG676I contains 13.1 Mb of total block RAM, implemented as 720 BRAM primitives (each 36 Kb). These can be configured as true dual-port RAM, FIFO, or shift register. Block RAM is distributed across the fabric to minimize routing congestion. XC7K160T-2FFG676I BRAM utilization directly impacts achievable memory bandwidth in streaming applications like video frame buffering.
XC7K160T-2FFG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-2FFG676I FAQ
1.How can I place an order for XC7K160T-2FFG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-2FFG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-2FFG676I reliable?
The price and inventory of XC7K160T-2FFG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-2FFG676I is usually 5 days.
3.What payment methods are accepted for XC7K160T-2FFG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-2FFG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-2FFG676I?
XC7K160T-2FFG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-2FFG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-2FFG676I?
For technical support, including XC7K160T-2FFG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-2FFG676I requirements.
6.How does Aetrix verify that XC7K160T-2FFG676I is sourced from the original manufacturer or authorized distributors?
All XC7K160T-2FFG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-2FFG676I meets industry standards.
7.What is the process for return or replacement of XC7K160T-2FFG676I?
All XC7K160T-2FFG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-2FFG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-2FFG676I part is unused and in its original packaging.
Return procedure for XC7K160T-2FFG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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