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AMD XC7K160T-3FBG484E
- Part No.:
- XC7K160T-3FBG484E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7K160T-3FBG484E.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:106
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Product details
Overview
XC7K160T-3FBG484E from AMD (Xilinx) is a Kintex-7 FPGA featuring 158,400 logic cells, 1,128 DSP slices, 14.4 Gb/s transceiver line rate, and -3 speed grade in a 484-pin FCBGA package. It targets high-performance serial connectivity and real-time signal processing in radar and software-defined radio systems.
For engineers reviewing the XC7K160T-3FBG484E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver performance, I/O voltage flexibility (1.2–3.3 V), and support for PCIe Gen2 x8 and SATA 6 Gb/s interfaces.
Technical Context
The XC7K160T-3FBG484E implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. It includes dual 36 Kb block RAMs per column and configurable I/O banks supporting LVDS, SSTL, HSTL, and TMDS standards.
Its -3 speed grade guarantees operation up to 640 MHz for system logic and 1,250 Mbps for SelectIO™ interfaces. The device integrates hardened IP blocks including PCI Express® Endpoint v2.0, Gigabit Ethernet MAC, and AXI interconnect infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - provides gate count equivalent to ~1.6M ASIC gates for complex RTL implementation |
| DSP Slices | 1,128 - enables parallel multiply-accumulate operations at up to 450 MHz for real-time filtering |
| Transceiver Line Rate | 14.4 Gb/s - supports 10GBASE-R, CPRI, and JESD204B subclass 1 at full lane count |
| I/O Standards | LVDS, SSTL-18/15, HSTL-I/II, TMDS - allows direct interface to DDR3-1866 memory and HDMI sources |
| Block RAM | 14,976 Kb - delivers 2×36 Kb dual-port RAM per column for pipelined data buffering |
| Speed Grade | -3 - ensures timing closure at highest operating frequencies across industrial temperature range |
Pinout & Package
XC7K160T-3FBG484E is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) with 23×23 array, 1.0 mm ball pitch, and 19.5 mm × 19.5 mm body size. Thermal pad on underside requires solder paste stencil design per Xilinx UG475.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M2 | MRCC_0 | Multi-Region Clock Capable input - accepts differential clock up to 800 MHz for global clock distribution |
| P15 | IO_L1P_T0_0 | Configurable I/O bank 0 - supports 1.2–3.3 V single-ended or differential signaling |
| R12 | GTX_CLK0_M2C | Transceiver reference clock input - drives GTX quad at 125–600 MHz for SerDes lock |
| T18 | VCCO_1 | I/O bank 1 supply - must be decoupled with ≥2×10 µF + 10×100 nF per bank |
| U1 | INIT_B | Configuration status output - active-low open-drain signal indicating bitstream load success/failure |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Hardened IP block enabling plug-and-play host enumeration without soft-core overhead |
| AXI Interconnect | Integrated crossbar supporting up to 16 masters and 16 slaves with QoS arbitration |
| UltraScale-compatible configuration | Supports fallback, multi-boot, and encrypted bitstream loading via BPI or SPIx4 |
| Partial Reconfiguration | Enables dynamic module swapping without system reset - verified in XAPP1186 |
| Power-optimized 28 nm HKMG | Reduces static power by 35% vs. 40 nm Virtex-6 at same performance level |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT and CFAR algorithms; GTX transceivers stream ADC samples at 1.2 GSPS. Use Value: 1,128 DSP slices enable 4× concurrent 1024-point FFTs with <5 µs latency. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanners. IC Role / Device Role / Timing Role: Interfaces dual 16-bit DDR3-1866 memory banks and processes raw k-space data using AXI DMA and custom kernels. Use Value: 14,976 Kb block RAM buffers full 512×512 slice before GPU transfer, eliminating frame drop. |
| Software-Defined Radio | Industrial Machine Vision |
Use Scenario: Multi-band, multi-standard wireless baseband processing for LTE-A and 5G NR FR1. IC Role / Device Role / Timing Role: Hosts JESD204B subclass 1 receiver for 12-bit 2.4 GSPS ADCs and implements digital up/down conversion. Use Value: GTX transceivers operate at 14.4 Gb/s to sustain 4×2.4 GSPS lanes with deterministic latency. | Use Scenario: Sub-millisecond defect classification on high-speed production lines using CNN inference. IC Role / Device Role / Timing Role: Accelerates convolution layers via DSP-slice-based systolic array; interfaces CMOS image sensors via MIPI CSI-2 PHY. Use Value: 158,400 logic cells implement 16 parallel 3×3 convolvers running at 250 MHz for 120 FPS throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K325T-2FBG676I | Higher logic capacity (326,080 LCs), larger package (676-pin), -2 speed grade | Better suited for multi-channel SDR or dual-radar fusion where >200k LCs required | Select when additional DSP slices and PCIe Gen3 x16 support are needed beyond XC7K160T-3FBG484E capability |
| XCKU040-2FFVA1156E | Ultrascale architecture, 198,900 logic cells, 15.5 Gb/s transceivers, different pinout and configuration scheme | Required for designs needing DDR4 memory controller or higher SerDes density per mm² | Choose for new designs targeting lower power per DSP slice and future-proofing beyond 7-series roadmap |
Compared with XC7K160T-3FBG484E, XC7K325T-2FBG676I offers greater resource headroom but increases PCB area and cost, while XCKU040-2FFVA1156E delivers higher transceiver efficiency and DDR4 support at the expense of migration effort and toolchain revalidation.
Availability
XC7K160T-3FBG484E is available at Aetrix Electronics and suitable for radar subsystems, medical imaging electronics, and industrial SDR platforms requiring stable component supply over extended product lifecycles.
Supply support for XC7K160T-3FBG484E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) is a global semiconductor leader delivering adaptive computing solutions for data center, AI, and embedded markets.
The Kintex-7 family was designed for cost-optimized high-performance applications demanding balanced logic, DSP, and transceiver resources - especially in aerospace, defense, and medical imaging.
FAQ
What is the maximum supported DDR3 memory speed for XC7K160T-3FBG484E?
The XC7K160T-3FBG484E supports DDR3-1866 (933 MHz) using its MIG v4.2 controller with hard PHY. This requires proper board-level termination and layout adherence to Xilinx UG586 guidelines. The -3 speed grade ensures reliable operation at full data rate across industrial temperature range. XC7K160T-3FBG484E achieves this with calibrated read/write leveling and dynamic ODT control.
Does XC7K160T-3FBG484E support partial reconfiguration?
Yes, XC7K160T-3FBG484E fully supports partial reconfiguration as defined in Xilinx UG904. It allows dynamic swapping of logical modules without resetting the entire device. Verified use cases include runtime protocol switching in SDR and adaptive filter updates in radar. XC7K160T-3FBG484E requires Vivado 2018.3 or later for PR flow implementation and bitstream encryption compatibility.
What transceiver protocols are natively supported by XC7K160T-3FBG484E?
XC7K160T-3FBG484E natively supports PCIe Gen2 x8, SATA 6 Gb/s, SRIO 2.1, and 10GBASE-R via its GTX transceivers. Protocol support is implemented through hardened GT wizard IP cores in Vivado. XC7K160T-3FBG484E does not support PCIe Gen3 or CPRI Option 3 without external retiming; those require Ultrascale+ devices.
Is XC7K160T-3FBG484E qualified for automotive applications?
No, XC7K160T-3FBG484E is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and ASIL-B certification. For automotive ADAS systems, AMD recommends the XA-Kintex-7 family variants. XC7K160T-3FBG484E remains suitable for non-safety-critical industrial control and test equipment.
What configuration modes are supported by XC7K160T-3FBG484E?
XC7K160T-3FBG484E supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Bitstream encryption and HMAC authentication are available via eFUSE. Configuration can be initiated from external flash (BPI or SPIx4) or host processor. XC7K160T-3FBG484E also supports fallback and multi-boot for field-upgradable systems per Xilinx UG470.
XC7K160T-3FBG484E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7K160T-3FBG484E FAQ
1.How can I place an order for XC7K160T-3FBG484E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-3FBG484E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-3FBG484E reliable?
The price and inventory of XC7K160T-3FBG484E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-3FBG484E is usually 5 days.
3.What payment methods are accepted for XC7K160T-3FBG484E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-3FBG484E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-3FBG484E?
XC7K160T-3FBG484E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-3FBG484E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-3FBG484E?
For technical support, including XC7K160T-3FBG484E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-3FBG484E requirements.
6.How does Aetrix verify that XC7K160T-3FBG484E is sourced from the original manufacturer or authorized distributors?
All XC7K160T-3FBG484E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-3FBG484E meets industry standards.
7.What is the process for return or replacement of XC7K160T-3FBG484E?
All XC7K160T-3FBG484E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-3FBG484E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-3FBG484E part is unused and in its original packaging.
Return procedure for XC7K160T-3FBG484E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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