AMD XC7K160T-3FBG676E

Overview

XC7K160T-3FBG676E from AMD is a Kintex-7 FPGA with 158,400 logic cells, 1,128 DSP slices, and 13.1 Gb/s transceiver capability in a 676-pin FCBGA package. It supports PCIe Gen2 x8, DDR3-1866 memory interfaces, and operates at -3 speed grade for high-performance industrial and test equipment applications.

For engineers reviewing the XC7K160T-3FBG676E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O bank voltage flexibility, configuration interface options (e.g., SelectMAP, JTAG), and thermal performance under sustained logic utilization.

Technical Context

The XC7K160T-3FBG676E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), block RAM (2,860 × 36 Kb), and integrated clock management (CMT) featuring MMCM and PLL blocks. It supports multi-voltage I/O banks (1.2 V to 3.3 V) and includes hardened IP for PCIe, Ethernet MAC, and memory controllers.

Configuration is performed via Master SPI, Slave SelectMAP, or JTAG; bitstream encryption and HMAC authentication are supported for secure boot. The -3 speed grade guarantees timing closure up to 640 MHz on internal logic paths and 1,250 Mbps on LVDS I/Os.

Key Specifications

Pinout & Package

XC7K160T-3FBG676E uses a 676-ball flip-chip BGA (FCBGA) package with 400 user I/Os distributed across 24 I/O banks. Power delivery includes dedicated VCCINT, VCCAUX, VCCO, and VRP/VRN pins per bank. Configuration and JTAG pins are fixed per UG470 specification.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC7K160T-3FBG676E, the XC7K325T-2FBG676I offers more logic resources in the same footprint but trades off speed grade; the XCKU060-2FFVA1156I delivers higher serial bandwidth and logic density but requires PCB redesign and increased thermal management.

Availability

XC7K160T-3FBG676E is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and industrial machine vision applications requiring stable component supply and long-term lifecycle support.

Supply support for XC7K160T-3FBG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.

The Kintex-7 family targets high-performance, cost-optimized applications including wired communications, video processing, and test & measurement, balancing logic density, transceiver bandwidth, and power efficiency.

FAQ

What is the maximum supported DDR3 memory speed for XC7K160T-3FBG676E?

The XC7K160T-3FBG676E supports DDR3-1866 (933 MHz clock) using its integrated memory controller. This capability is verified in UG470 and enables direct connection to standard DDR3 SDRAM components without external PHY. The controller supports x8/x16/x32 data widths, 1–8 bank configurations, and programmable read/write leveling. XC7K160T-3FBG676E achieves this performance within its -3 speed grade timing constraints and 1.5 V VCCO I/O supply setting.

Does XC7K160T-3FBG676E support partial reconfiguration?

Yes, XC7K160T-3FBG676E supports partial reconfiguration through Vivado Design Suite tools and hardware features including frame-based bitstream loading and hierarchical design partitioning. This allows runtime swapping of logic modules without resetting the entire device. XC7K160T-3FBG676E requires specific configuration mode settings (e.g., ICAP access enabled) and adheres to timing isolation rules defined in UG909. Use cases include protocol adaptation and dynamic function loading in field-upgradable systems.

What configuration modes are supported by XC7K160T-3FBG676E?

XC7K160T-3FBG676E supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Master SPI uses on-board flash memory; Slave SelectMAP enables microprocessor-controlled loading; JTAG is used for debugging and programming. All modes are electrically compatible with the 676-ball FCBGA package layout. XC7K160T-3FBG676E's configuration logic validates bitstream CRC and supports dual-boot fallback via dedicated M[2:0] pins per UG470.

Is XC7K160T-3FBG676E qualified for industrial temperature operation?

Yes, XC7K160T-3FBG676E is rated for industrial temperature range (–40°C to +100°C case temperature) and carries the 'I' suffix in its ordering part number. This qualification includes thermal validation of all I/O standards, transceiver jitter performance, and configuration reliability across the full range. XC7K160T-3FBG676E meets JEDEC JESD22-A104 and JESD22-A108 standards for temperature cycling and humidity testing.

What security features does XC7K160T-3FBG676E provide?

XC7K160T-3FBG676E includes AES-256 bitstream encryption and HMAC-SHA256 authentication for secure configuration. These features prevent unauthorized access to design IP and ensure only signed bitstreams execute. Key storage uses battery-backed RAM or eFUSE options. XC7K160T-3FBG676E implements these protections in hardware, independent of external controllers, and complies with Xilinx/AMD Secure Boot requirements documented in UG470 and UG909.