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AMD XC7K160T-3FFG676E
- Part No.:
- XC7K160T-3FFG676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-3FFG676E.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,243
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Product details
Overview
XC7K160T-3FFG676E from AMD (Xilinx) is a Kintex-7 FPGA featuring 158,400 logic cells, 1,128 DSP slices, 14,400 Kb of block RAM, and high-speed serial transceivers supporting up to 13.1 Gb/s. It is packaged in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) with 0.8 mm pitch and operates at -3 speed grade for high-performance signal processing in radar and medical imaging systems.
For engineers reviewing the XC7K160T-3FFG676E datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (16 GTs), thermal design power (21.5 W typical), and configuration interface (SPIx4/JTAG).
Technical Context
The XC7K160T-3FFG676E implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 36 Kb BRAM primitives, and integrated PCIe Gen2 x8 endpoint capability. It supports SelectIO standards including LVDS, SSTL, HSTL, and MIPI D-PHY at programmable I/O banks.
Its transceiver subsystem includes dedicated clocking, gearbox logic, and built-in PRBS generators for serial link validation. Configuration is performed via Master SPI or JTAG, with bitstream encryption and HMAC authentication enabled for secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - total available LUT-based combinational + sequential resources |
| DSP Slices | 1,128 - fixed-point multiply-accumulate units with 25×18-bit pre-adders |
| Block RAM | 14,400 Kb - distributed as 36 Kb dual-port RAM primitives |
| GT Transceivers | 16 lanes - each supports 600 Mb/s to 13.1 Gb/s with embedded 8b/10b and 64b/66b encoders |
| I/O Standards | LVDS, SSTL-18/25, HSTL-I/II, MIPI D-PHY - per-bank voltage programmability (1.2–3.3 V) |
| Speed Grade | -3 - highest performance grade in Kintex-7 family, enabling 640 MHz system clock in CLBs |
| TDP | 21.5 W typical - defines thermal solution requirements under worst-case switching activity |
Pinout & Package
XC7K160T-3FFG676E is housed in a 676-ball FC-FBGA package (19×19 mm, 0.8 mm pitch) with 468 user I/O pins distributed across 14 configurable I/O banks. Power delivery includes dedicated VCCINT, VCCAUX, VCCO, and VREF pins per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core logic supply (1.0 V); must be filtered within 1 cm of ball |
| M20 | VCCAUX | Auxiliary supply (1.8 V) for configuration, clocking, and transceivers |
| R15 | VCCO_0 | I/O bank 0 output supply (1.2–3.3 V); sets voltage for all outputs in bank |
| H19 | PROGRAM_B | Active-low asynchronous reset; initiates reconfiguration on falling edge |
| E20 | INIT_B | Open-drain status indicator; asserted low during configuration |
| P17 | CCLK | Configuration clock input; driven by external source or internal oscillator |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP block eliminating need for external controller or soft-core implementation |
| Transceiver Built-in Self-Test | PRBS7/15/23/31 pattern generation and error detection without host CPU involvement |
| Secure Boot with HMAC | Authenticated bitstream loading prevents unauthorized firmware execution |
| Partial Reconfiguration Support | Dynamic module swapping enables runtime hardware function updates without full reconfiguration |
| UltraScale-compatible Toolflow | Design migration path to UltraScale+ devices using same Vivado tools and constraints |
Applications
| Radar Signal Processing | Medical Ultrasound Imaging |
|---|---|
Use Scenario: Real-time beamforming and Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute fabric handling parallel FFTs, CFAR detection, and pulse compression. Use Value: 1,128 DSP slices enable simultaneous 128-channel beamformer with sub-microsecond latency. | Use Scenario: High-frame-rate B-mode and color Doppler image reconstruction in portable ultrasound. IC Role / Device Role / Timing Role: Real-time echo data preprocessing, scan conversion, and video pipeline control. Use Value: 16 GT transceivers interface directly to 16-channel ADC front-ends at 100 MSPS per channel. |
| Avionics Data Concentrators | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 protocol bridging in flight control systems. IC Role / Device Role / Timing Role: Deterministic packet routing engine with time-triggered scheduling. Use Value: Dual 10/100/1000 Ethernet MACs and 14,400 Kb BRAM support 2 ms deterministic frame buffering. | Use Scenario: Automated test equipment requiring synchronized multi-channel waveform capture and analysis. IC Role / Device Role / Timing Role: Time-aligned acquisition controller with jitter-free sampling clock distribution. Use Value: -3 speed grade ensures <15 ps cycle-to-cycle jitter on 300 MHz sampling clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K325T-2FFG900I | Higher logic density (326,080 LCs), more GT lanes (20), larger package (900-ball) | Required for >200-channel radar or dual-10G Ethernet aggregation | Select when XC7K160T-3FFG676E resource utilization exceeds 85% in critical paths |
| XCKU040-2FFVA1156E | Kintex UltraScale architecture; 220K logic cells, 20 GTY transceivers (16.3 Gb/s), lower static power | Targeted for next-gen 5G fronthaul and AI inference acceleration | Choose for new designs needing higher bandwidth, lower power, or migration path to UltraScale+ |
Compared with XC7K325T-2FFG900I and XCKU040-2FFVA1156E, the XC7K160T-3FFG676E delivers optimal cost-performance balance for mid-scale real-time processing where 158K logic cells and 16 GT lanes meet throughput targets without over-provisioning.
Availability
XC7K160T-3FFG676E is available at Aetrix Electronics and suitable for radar signal processing, medical ultrasound imaging, avionics data concentrators, and high-speed test equipment requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC7K160T-3FFG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) is a global semiconductor leader focused on adaptive computing, AI, and high-performance processing solutions.
The Kintex-7 family was designed for cost-optimized high-performance applications including wired communications, video processing, and aerospace systems where balanced logic, memory, and I/O resources are critical.
FAQ
What is the maximum transceiver data rate supported by XC7K160T-3FFG676E?
The XC7K160T-3FFG676E supports transceiver data rates from 600 Mb/s up to 13.1 Gb/s per GT lane. This range is validated across process corners and temperature ranges per DS182 v2.20, enabling use in 10G Ethernet, CPRI, and JESD204B interfaces. The XC7K160T-3FFG676E achieves this using dedicated PLLs and adaptive equalization circuitry within each transceiver quad.
Does XC7K160T-3FFG676E support partial reconfiguration?
Yes, the XC7K160T-3FFG676E fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of functional modules-such as filter coefficients or protocol engines-without resetting the entire device. The XC7K160T-3FFG676E implements this using frame-based bitstream addressing and CRC-protected configuration frames.
What configuration modes are available for XC7K160T-3FFG676E?
The XC7K160T-3FFG676E supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Master SPI is most common for compact flash-based boot, while JTAG is used for debugging and programming during development. The XC7K160T-3FFG676E requires no external configuration PROM when using JTAG, but needs one for autonomous startup.
Is XC7K160T-3FFG676E qualified for automotive applications?
No, the XC7K160T-3FFG676E is not AEC-Q100 qualified. It is rated for industrial temperature range (–40°C to +100°C case temperature) and intended for aerospace, defense, and industrial systems-not automotive safety-critical ECUs. For automotive use, AMD offers Zynq-7000 SoC variants with AEC-Q100 Grade 2 qualification, but the XC7K160T-3FFG676E is not among them.
What is the I/O voltage range supported per bank on XC7K160T-3FFG676E?
The XC7K160T-3FFG676E supports per-bank I/O voltages from 1.2 V to 3.3 V, with independent VCCO assignment for each of its 14 I/O banks. This enables mixed-voltage interfacing-for example, 1.8 V MIPI D-PHY with 3.3 V GPIO-provided VREF is set correctly and signaling standards are compatible. The XC7K160T-3FFG676E does not support 1.0 V I/O.
XC7K160T-3FFG676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-3FFG676E FAQ
1.How can I place an order for XC7K160T-3FFG676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-3FFG676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-3FFG676E reliable?
The price and inventory of XC7K160T-3FFG676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-3FFG676E is usually 5 days.
3.What payment methods are accepted for XC7K160T-3FFG676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-3FFG676E transactions.
Note: Certain payment methods may incur a processing fee.
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XC7K160T-3FFG676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-3FFG676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-3FFG676E?
For technical support, including XC7K160T-3FFG676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-3FFG676E requirements.
6.How does Aetrix verify that XC7K160T-3FFG676E is sourced from the original manufacturer or authorized distributors?
All XC7K160T-3FFG676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-3FFG676E meets industry standards.
7.What is the process for return or replacement of XC7K160T-3FFG676E?
All XC7K160T-3FFG676E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-3FFG676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-3FFG676E part is unused and in its original packaging.
Return procedure for XC7K160T-3FFG676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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