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AMD XC7K160T-L2FBG484I

Part No.:
XC7K160T-L2FBG484I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA, FCBGA
Datasheet:
AetrixXC7K160T-L2FBG484I.pdf
Description:
IC FPGA 285 I/O 484FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,538

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Product details

Overview

XC7K160T-L2FBG484I from AMD is a Kintex-7 FPGA with 158,400 logic cells, 1,128 DSP slices, and 13.1 Gb/s transceiver capability in a 484-pin FCBGA package. It supports PCIe Gen2 x8, DDR3-1866 memory interfaces, and operates across industrial temperature range (–40°C to +100°C). Used in high-throughput packet processing systems requiring deterministic latency and multi-protocol I/O.

For engineers reviewing the XC7K160T-L2FBG484I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, configuration security options, and thermal performance under sustained 2.5W dynamic power.

Technical Context

The XC7K160T-L2FBG484I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen2 Endpoint/Root Port, and dual 12-bit 1MSPS ADCs. It supports SelectIO standards from 1.2V to 3.3V across 16 I/O banks, with dedicated clock routing and internal clock management tiles (CMT) containing MMCM and PLL.

Configuration occurs via Master SPI, Slave Serial, or JTAG; bitstream encryption uses AES-256 with HMAC authentication. The -L2 speed grade guarantees timing closure at 710 MHz for internal logic and 1,250 Mbps for LVDS I/O.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells158,400 - determines maximum combinational and sequential logic capacity for RTL implementation
DSP Slices1,128 - enables parallel multiply-accumulate operations for filtering, FFT, and math-intensive algorithms
Transceiver Max Rate13.1 Gb/s - supports 10G Ethernet KR/KR4, CPRI, and Interlaken protocols without gearbox
Block RAM12,840 kbit - provides on-chip memory for FIFOs, buffers, and lookup tables with true dual-port access
I/O Banks16 - allows independent voltage assignment per bank for mixed-voltage interface coexistence (e.g., 1.8V MIPI + 3.3V GPIO)
Speed Grade-L2 - guarantees timing closure at 710 MHz logic frequency and 1,250 Mbps LVDS data rate
Operating Temp–40°C to +100°C - qualified for industrial environments without derating or forced cooling

Pinout & Package

XC7K160T-L2FBG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) with 23×23 array, 1.0 mm pitch, and 19.5 mm × 19.5 mm body size. Package supports reflow soldering per IPC/JEDEC J-STD-020D and includes thermal pad for enhanced heat dissipation.

Pin/TerminalCircuit RoleDesign Meaning
M0–M2Configuration Mode SelectDetermines boot source (SPI, BPI, JTAG) and configuration width (x1/x2/x4/x8)
CCLKConfiguration ClockDrives internal configuration logic; can be internally generated or externally supplied up to 100 MHz
INIT_BConfiguration StatusActive-low open-drain signal indicating configuration status and error detection
PROGRAM_BConfiguration ResetActive-low signal that clears configuration memory and initiates reconfiguration sequence
GTX_CLK0_M2C_P/NTransceiver Reference ClockDifferential input for GTX transceivers; supports 100–600 MHz frequencies with sub-100 fs jitter tolerance
VCCINTCore Power Supply1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling

Key Features

FeatureDesign Value
PCIe Gen2 Hard IPIntegrated endpoint/root port supporting x1/x2/x4/x8 lane widths with AXI4 streaming interface
AES-256 Bitstream EncryptionPrevents reverse engineering and unauthorized cloning via on-chip decryption engine and HMAC verification
SelectIO TechnologySupports 21 I/O standards including LVDS, SSTL, HSTL, MIPI D-PHY, and single-ended CMOS
Internal ADCDual 12-bit 1MSPS analog-to-digital converters for on-board monitoring of VCCINT, VCCAUX, and external sensors
UltraScale-Compatible ToolflowDesign migration path to UltraScale+ devices using same Vivado design suite and constraint methodology

Applications

Wireless Baseband ProcessingIndustrial Vision System

Use Scenario: Real-time OFDM symbol processing and MIMO channel estimation in LTE-A eNodeB units.

IC Role / Device Role / Timing Role: Programmable baseband accelerator handling layer-1 PHY functions with deterministic sub-100 ns latency.

Use Value: 1,128 DSP slices enable concurrent 4×4 MIMO matrix inversion; transceivers interface directly to RFICs via JESD204B v1.1 at 6.4 Gbps.

Use Scenario: High-speed inspection of PCB assemblies using multi-camera synchronized capture and real-time defect classification.

IC Role / Device Role / Timing Role: Image preprocessing hub managing camera sensor I/O, frame buffering, and feature extraction before CPU offload.

Use Value: 16 I/O banks support simultaneous MIPI CSI-2 (1.2V) and GigE Vision (3.3V) interfaces; block RAM enables 1080p@60fps line-scan buffering.

Medical Imaging BackendTest & Measurement Equipment

Use Scenario: Digital beamforming and echo processing in portable ultrasound systems with multi-channel phased arrays.

IC Role / Device Role / Timing Role: Time-critical signal processor performing FIR filtering, envelope detection, and scan conversion in pipeline stages.

Use Value: -L2 speed grade ensures 710 MHz logic timing for 128-channel parallel processing; internal ADC monitors power rail stability during burst-mode operation.

Use Scenario: Modular PXI Express instruments requiring high-fidelity waveform generation and acquisition with sub-nanosecond trigger alignment.

IC Role / Device Role / Timing Role: Timing and pattern generator core synchronizing DAC/ADC sampling clocks and digital I/O stimulus sequences.

Use Value: GTX transceivers deliver 13.1 Gb/s backplane links to chassis controller; MMCM provides <50 fs RMS jitter for 1 GS/s sampling clock synthesis.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU035-2FFVA676IUltraScale architecture, 215K logic cells, 15.3 Gb/s transceivers, no integrated ADCBetter for higher-bandwidth protocols (PCIe Gen3, 25G Ethernet); lacks on-die analog monitoringChoose when migrating to newer toolflow and requiring >13 Gb/s serial I/O; not pin-compatible with XC7K160T-L2FBG484I
XC7K325T-2FFG676ISame Kintex-7 family, 326K logic cells, identical I/O and transceiver specs, larger packageHigher gate count for complex control-plane logic; same industrial temp rating and security featuresChoose when additional logic resources are needed without changing board layout or firmware; shares same Vivado IP catalog and constraints

Compared with XC7K160T-L2FBG484I, XCKU035 offers higher serial bandwidth but requires new PCB design and toolchain upgrade, while XC7K325T delivers scalable logic density within identical ecosystem support and thermal profile.

Availability

XC7K160T-L2FBG484I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial vision, medical imaging, and test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC7K160T-L2FBG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, AI acceleration, and CPU/GPU architectures.

The Kintex-7 family targets cost-optimized high-performance applications such as communications infrastructure, video processing, and industrial automation where balanced logic, I/O, and DSP resources are critical.

FAQ

What is the maximum supported DDR3 memory interface speed for XC7K160T-L2FBG484I?

The XC7K160T-L2FBG484I supports DDR3-1866 (933 MHz clock) with 16-bit or 32-bit data bus widths using dedicated memory interface logic. This capability is validated in the Kintex-7 Memory Interface Solutions User Guide UG586, and requires proper PCB layout adherence to fly-by topology and termination rules. XC7K160T-L2FBG484I achieves this speed using its -L2 speed grade and calibrated I/O delay elements.

Does XC7K160T-L2FBG484I include built-in security features for bitstream protection?

Yes, XC7K160T-L2FBG484I integrates AES-256 bitstream encryption with HMAC authentication, enabled via eFUSE or BBRAM keys. Configuration bitstream is decrypted on-chip during load, preventing external readback or cloning. This security model is documented in UG470 and applies specifically to XC7K160T-L2FBG484I when configured with appropriate key programming and mode pin settings.

Can XC7K160T-L2FBG484I operate in industrial temperature conditions without derating?

Yes, XC7K160T-L2FBG484I is rated for –40°C to +100°C junction temperature and qualified per industrial standards. Its thermal design allows full-speed operation across this range when mounted on a 4-layer PCB with 2 oz copper and standard thermal vias. No frequency or voltage derating is required for XC7K160T-L2FBG484I under these conditions per DS182 specification.

How many transceiver quads does XC7K160T-L2FBG484I contain, and what protocols do they support?

XC7K160T-L2FBG484I contains 12 GTX transceiver quads (48 total transceivers), each supporting data rates from 600 Mbps to 13.1 Gb/s. Protocols include PCIe Gen2, SATA, CPRI, SRIO, and 10G Ethernet KR/KR4. These capabilities are fixed per hardware and confirmed in the Kintex-7 Data Sheet DS182 for the XC7K160T device variant.

Is XC7K160T-L2FBG484I compatible with Xilinx Vivado Design Suite?

Yes, XC7K160T-L2FBG484I is fully supported in Xilinx Vivado Design Suite 2018.3 through 2023.2 for synthesis, implementation, and debugging. Device-specific IP cores, timing constraints, and bitstream generation workflows are validated for XC7K160T-L2FBG484I in all supported versions, with no known limitations in the official release notes.

XC7K160T-L2FBG484I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex®-7
Package/Case:
484-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
12675
Number of Logic Elements/Cells:
162240
Total RAM Bits:
11980800
Number of I/O:
285
Number of Gates:
-
Voltage - Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FCBGA (23x23)

XC7K160T-L2FBG484I FAQ

1.How can I place an order for XC7K160T-L2FBG484I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7K160T-L2FBG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7K160T-L2FBG484I reliable?

The price and inventory of XC7K160T-L2FBG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-L2FBG484I is usually 5 days.

3.What payment methods are accepted for XC7K160T-L2FBG484I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-L2FBG484I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7K160T-L2FBG484I?

XC7K160T-L2FBG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7K160T-L2FBG484I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7K160T-L2FBG484I?

For technical support, including XC7K160T-L2FBG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-L2FBG484I requirements.

6.How does Aetrix verify that XC7K160T-L2FBG484I is sourced from the original manufacturer or authorized distributors?

All XC7K160T-L2FBG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-L2FBG484I meets industry standards.

7.What is the process for return or replacement of XC7K160T-L2FBG484I?

All XC7K160T-L2FBG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-L2FBG484I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7K160T-L2FBG484I part is unused and in its original packaging.

Return procedure for XC7K160T-L2FBG484I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7K160T-L2FBG484I Tags

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