AMD XC7K160T-L2FBG484I
- Part No.:
- XC7K160T-L2FBG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7K160T-L2FBG484I.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,538
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7K160T-L2FBG484I from AMD is a Kintex-7 FPGA with 158,400 logic cells, 1,128 DSP slices, and 13.1 Gb/s transceiver capability in a 484-pin FCBGA package. It supports PCIe Gen2 x8, DDR3-1866 memory interfaces, and operates across industrial temperature range (–40°C to +100°C). Used in high-throughput packet processing systems requiring deterministic latency and multi-protocol I/O.
For engineers reviewing the XC7K160T-L2FBG484I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, configuration security options, and thermal performance under sustained 2.5W dynamic power.
Technical Context
The XC7K160T-L2FBG484I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen2 Endpoint/Root Port, and dual 12-bit 1MSPS ADCs. It supports SelectIO standards from 1.2V to 3.3V across 16 I/O banks, with dedicated clock routing and internal clock management tiles (CMT) containing MMCM and PLL.
Configuration occurs via Master SPI, Slave Serial, or JTAG; bitstream encryption uses AES-256 with HMAC authentication. The -L2 speed grade guarantees timing closure at 710 MHz for internal logic and 1,250 Mbps for LVDS I/O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 1,128 - enables parallel multiply-accumulate operations for filtering, FFT, and math-intensive algorithms |
| Transceiver Max Rate | 13.1 Gb/s - supports 10G Ethernet KR/KR4, CPRI, and Interlaken protocols without gearbox |
| Block RAM | 12,840 kbit - provides on-chip memory for FIFOs, buffers, and lookup tables with true dual-port access |
| I/O Banks | 16 - allows independent voltage assignment per bank for mixed-voltage interface coexistence (e.g., 1.8V MIPI + 3.3V GPIO) |
| Speed Grade | -L2 - guarantees timing closure at 710 MHz logic frequency and 1,250 Mbps LVDS data rate |
| Operating Temp | –40°C to +100°C - qualified for industrial environments without derating or forced cooling |
Pinout & Package
XC7K160T-L2FBG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) with 23×23 array, 1.0 mm pitch, and 19.5 mm × 19.5 mm body size. Package supports reflow soldering per IPC/JEDEC J-STD-020D and includes thermal pad for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI, BPI, JTAG) and configuration width (x1/x2/x4/x8) |
| CCLK | Configuration Clock | Drives internal configuration logic; can be internally generated or externally supplied up to 100 MHz |
| INIT_B | Configuration Status | Active-low open-drain signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock | Differential input for GTX transceivers; supports 100–600 MHz frequencies with sub-100 fs jitter tolerance |
| VCCINT | Core Power Supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Hard IP | Integrated endpoint/root port supporting x1/x2/x4/x8 lane widths with AXI4 streaming interface |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning via on-chip decryption engine and HMAC verification |
| SelectIO Technology | Supports 21 I/O standards including LVDS, SSTL, HSTL, MIPI D-PHY, and single-ended CMOS |
| Internal ADC | Dual 12-bit 1MSPS analog-to-digital converters for on-board monitoring of VCCINT, VCCAUX, and external sensors |
| UltraScale-Compatible Toolflow | Design migration path to UltraScale+ devices using same Vivado design suite and constraint methodology |
Applications
| Wireless Baseband Processing | Industrial Vision System |
|---|---|
Use Scenario: Real-time OFDM symbol processing and MIMO channel estimation in LTE-A eNodeB units. IC Role / Device Role / Timing Role: Programmable baseband accelerator handling layer-1 PHY functions with deterministic sub-100 ns latency. Use Value: 1,128 DSP slices enable concurrent 4×4 MIMO matrix inversion; transceivers interface directly to RFICs via JESD204B v1.1 at 6.4 Gbps. | Use Scenario: High-speed inspection of PCB assemblies using multi-camera synchronized capture and real-time defect classification. IC Role / Device Role / Timing Role: Image preprocessing hub managing camera sensor I/O, frame buffering, and feature extraction before CPU offload. Use Value: 16 I/O banks support simultaneous MIPI CSI-2 (1.2V) and GigE Vision (3.3V) interfaces; block RAM enables 1080p@60fps line-scan buffering. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Digital beamforming and echo processing in portable ultrasound systems with multi-channel phased arrays. IC Role / Device Role / Timing Role: Time-critical signal processor performing FIR filtering, envelope detection, and scan conversion in pipeline stages. Use Value: -L2 speed grade ensures 710 MHz logic timing for 128-channel parallel processing; internal ADC monitors power rail stability during burst-mode operation. | Use Scenario: Modular PXI Express instruments requiring high-fidelity waveform generation and acquisition with sub-nanosecond trigger alignment. IC Role / Device Role / Timing Role: Timing and pattern generator core synchronizing DAC/ADC sampling clocks and digital I/O stimulus sequences. Use Value: GTX transceivers deliver 13.1 Gb/s backplane links to chassis controller; MMCM provides <50 fs RMS jitter for 1 GS/s sampling clock synthesis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676I | UltraScale architecture, 215K logic cells, 15.3 Gb/s transceivers, no integrated ADC | Better for higher-bandwidth protocols (PCIe Gen3, 25G Ethernet); lacks on-die analog monitoring | Choose when migrating to newer toolflow and requiring >13 Gb/s serial I/O; not pin-compatible with XC7K160T-L2FBG484I |
| XC7K325T-2FFG676I | Same Kintex-7 family, 326K logic cells, identical I/O and transceiver specs, larger package | Higher gate count for complex control-plane logic; same industrial temp rating and security features | Choose when additional logic resources are needed without changing board layout or firmware; shares same Vivado IP catalog and constraints |
Compared with XC7K160T-L2FBG484I, XCKU035 offers higher serial bandwidth but requires new PCB design and toolchain upgrade, while XC7K325T delivers scalable logic density within identical ecosystem support and thermal profile.
Availability
XC7K160T-L2FBG484I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial vision, medical imaging, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7K160T-L2FBG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, AI acceleration, and CPU/GPU architectures.
The Kintex-7 family targets cost-optimized high-performance applications such as communications infrastructure, video processing, and industrial automation where balanced logic, I/O, and DSP resources are critical.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7K160T-L2FBG484I?
The XC7K160T-L2FBG484I supports DDR3-1866 (933 MHz clock) with 16-bit or 32-bit data bus widths using dedicated memory interface logic. This capability is validated in the Kintex-7 Memory Interface Solutions User Guide UG586, and requires proper PCB layout adherence to fly-by topology and termination rules. XC7K160T-L2FBG484I achieves this speed using its -L2 speed grade and calibrated I/O delay elements.
Does XC7K160T-L2FBG484I include built-in security features for bitstream protection?
Yes, XC7K160T-L2FBG484I integrates AES-256 bitstream encryption with HMAC authentication, enabled via eFUSE or BBRAM keys. Configuration bitstream is decrypted on-chip during load, preventing external readback or cloning. This security model is documented in UG470 and applies specifically to XC7K160T-L2FBG484I when configured with appropriate key programming and mode pin settings.
Can XC7K160T-L2FBG484I operate in industrial temperature conditions without derating?
Yes, XC7K160T-L2FBG484I is rated for –40°C to +100°C junction temperature and qualified per industrial standards. Its thermal design allows full-speed operation across this range when mounted on a 4-layer PCB with 2 oz copper and standard thermal vias. No frequency or voltage derating is required for XC7K160T-L2FBG484I under these conditions per DS182 specification.
How many transceiver quads does XC7K160T-L2FBG484I contain, and what protocols do they support?
XC7K160T-L2FBG484I contains 12 GTX transceiver quads (48 total transceivers), each supporting data rates from 600 Mbps to 13.1 Gb/s. Protocols include PCIe Gen2, SATA, CPRI, SRIO, and 10G Ethernet KR/KR4. These capabilities are fixed per hardware and confirmed in the Kintex-7 Data Sheet DS182 for the XC7K160T device variant.
Is XC7K160T-L2FBG484I compatible with Xilinx Vivado Design Suite?
Yes, XC7K160T-L2FBG484I is fully supported in Xilinx Vivado Design Suite 2018.3 through 2023.2 for synthesis, implementation, and debugging. Device-specific IP cores, timing constraints, and bitstream generation workflows are validated for XC7K160T-L2FBG484I in all supported versions, with no known limitations in the official release notes.
XC7K160T-L2FBG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.87V ~ 0.93V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7K160T-L2FBG484I FAQ
1.How can I place an order for XC7K160T-L2FBG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-L2FBG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-L2FBG484I reliable?
The price and inventory of XC7K160T-L2FBG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-L2FBG484I is usually 5 days.
3.What payment methods are accepted for XC7K160T-L2FBG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-L2FBG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-L2FBG484I?
XC7K160T-L2FBG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-L2FBG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-L2FBG484I?
For technical support, including XC7K160T-L2FBG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-L2FBG484I requirements.
6.How does Aetrix verify that XC7K160T-L2FBG484I is sourced from the original manufacturer or authorized distributors?
All XC7K160T-L2FBG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-L2FBG484I meets industry standards.
7.What is the process for return or replacement of XC7K160T-L2FBG484I?
All XC7K160T-L2FBG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-L2FBG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-L2FBG484I part is unused and in its original packaging.
Return procedure for XC7K160T-L2FBG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7K160T-L2FBG484I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

