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AMD XC7K160T-L2FBG676E
- Part No.:
- XC7K160T-L2FBG676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-L2FBG676E.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,388
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Product details
Overview
XC7K160T-L2FBG676E from AMD is a Kintex-7 FPGA with 158,400 logic cells, 1,200 DSP slices, and 13.1 Gb/s transceiver capability in a 676-pin Flip-Chip BGA package. It targets high-throughput data processing in radar signal conditioning and 10G Ethernet line cards.
For engineers reviewing the XC7K160T-L2FBG676E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (16 GTs), and thermal design power (14.5 W at typical operation).
Technical Context
The XC7K160T-L2FBG676E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), block RAM (3,328 × 36 Kb), and integrated PCIe Gen2 x8 endpoint. Its transceivers support protocols including CPRI, SRIO, and 10GBASE-R.
It includes dual 32-bit AXI4 interconnects, hardened memory controllers for DDR3/DDR3L up to 800 MHz, and clock management tiles with MMCM and PLL for jitter < 150 fs RMS (12 kHz–20 MHz).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 1,200 - enables parallel multiply-accumulate operations for FIR filtering and FFT acceleration |
| Transceivers | 16 GT lanes @ 13.1 Gb/s - supports multi-lane serial protocols without external retimers |
| Block RAM | 3,328 × 36 Kb - provides on-chip memory for buffering, FIFOs, and coefficient storage |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - allows direct interfacing to ADCs, DACs, memory, and FPGAs |
| TDP | 14.5 W - defines thermal solution requirements for sustained 100% utilization at junction temp ≤ 100°C |
Pinout & Package
XC7K160T-L2FBG676E is housed in a 27 × 27 mm, 676-pin Flip-Chip Ball Grid Array (FCBGA) with 1.0 mm pitch and Pb-free finish. Thermal pad is exposed on underside for heatsink attachment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M19 | MRCC_0 | Main reference clock input for bank 0, supports single-ended or differential signaling |
| P20 | SRN | Global asynchronous reset active-low, synchronous deassertion via internal clock domain |
| R18 | CLKOUT | Output of MMCM-generated clock, routed to dedicated global clock network |
| V17 | HP_IO_L1P | High-performance I/O in bank 1, supports 1.8 V LVDS and 1.2 V HSTL |
| Y16 | GTX_RXN | Negative differential input of GT transceiver lane 0, matched to 100 Ω PCB trace impedance |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Hard IP block reduces RTL integration effort and guarantees compliance with PCIe 2.1 electrical and protocol layers |
| DDR3 Memory Controller | Supports dual-rank, 64-bit wide DDR3/DDR3L at 800 MHz (1600 MT/s), with built-in calibration and error correction |
| AXI4 Interconnect | Dual 32-bit AXI4 master/slave interfaces enable scalable on-chip communication between processor subsystems and peripherals |
| Transceiver Jitter | 150 fs RMS (12 kHz–20 MHz) ensures reliable 10.3125 Gb/s CPRI and 10GBASE-R link establishment over 10 m backplane |
Applications
| Radar Signal Processing | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT and CFAR algorithms; GT transceivers interface with ADC/DAC FMC modules. Use Value: 1,200 DSP slices deliver >25 GMAC/s throughput; 16 GT lanes route digitized RF samples at 1.2 GSPS per channel. | Use Scenario: Aggregation and packet forwarding in telecom central office line cards supporting 10GBASE-R and OTU2. IC Role / Device Role / Timing Role: Implements MAC, PCS, and FEC logic; GT transceivers terminate 10G optical PHY signals. Use Value: Hardened PCIe Gen2 x8 enables host CPU offload; 13.1 Gb/s GT rate meets IEEE 802.3ae and ITU-T G.709 requirements. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: Raw data preprocessing and image reconstruction pipeline in MRI and CT scanners. IC Role / Device Role / Timing Role: Configurable logic handles parallel pixel stream alignment and compression; block RAM buffers multi-frame datasets. Use Value: 3,328 × 36 Kb block RAM supports 4K×4K frame buffering at 30 fps; DDR3 controller drives 12.8 GB/s memory bandwidth. | Use Scenario: High-speed digital pattern generation and real-time protocol analysis in automated test equipment. IC Role / Device Role / Timing Role: Generates synchronized multi-channel stimulus waveforms; GT transceivers capture and decode serial bus traffic (CPRI, SRIO). Use Value: 158,400 logic cells implement deep state machines for protocol emulation; 16 GT lanes enable concurrent multi-protocol capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, 469,200 logic cells, 24 GTY transceivers @ 32.75 Gb/s, higher static power | Targets 25G+ coherent optics and AI inference acceleration where XC7K160T-L2FBG676E lacks sufficient bandwidth | Select when >16 GT lanes or >13.1 Gb/s per lane required; requires new PCB layout and thermal redesign |
| XC7K325T-2FFG901I | Same Kintex-7 family, 326,080 logic cells, identical GT specs and I/O voltage range, larger 901-pin FCBGA | Used in multi-FPGA systems requiring higher logic density while retaining same transceiver and memory controller compatibility | Drop-in replacement for logic-upgrade path; same pinout not supported-requires board revision due to different package size and ball map |
Compared with XCKU060-2FFVA1156I, XC7K160T-L2FBG676E offers lower power and proven 10G infrastructure compatibility; compared with XC7K325T-2FFG901I, it provides cost-optimized logic density for mid-scale radar and telecom edge applications without over-provisioning.
Availability
XC7K160T-L2FBG676E is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet line cards, and medical imaging backend systems requiring stable component supply across extended product lifecycles.
Supply support for XC7K160T-L2FBG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Kintex-7 FPGA family was designed for high-performance, cost-sensitive applications in wired communications, video processing, and aerospace systems where balanced logic, I/O, and transceiver resources are critical.
FAQ
What is the maximum supported DDR3 data rate for XC7K160T-L2FBG676E?
The XC7K160T-L2FBG676E integrates a hardened DDR3/DDR3L memory controller supporting up to 800 MHz clock frequency (1600 MT/s data rate) across 64-bit wide dual-rank configurations. This specification is validated per UG473 v1.12 and applies to all Kintex-7 devices with the -2 speed grade, including the XC7K160T-L2FBG676E. Board-level signal integrity and termination must meet JEDEC specifications for reliable operation.
Does XC7K160T-L2FBG676E support PCIe Gen3?
No, XC7K160T-L2FBG676E does not support PCIe Gen3. It includes a hard PCIe Gen2 x8 endpoint compliant with PCI Express Base Specification Revision 2.1. The transceivers operate up to 13.1 Gb/s but lack the Gen3-specific equalization and encoding features. For PCIe Gen3 designs, AMD recommends UltraScale or Versal families. The XC7K160T-L2FBG676E remains widely deployed in Gen2-compliant systems such as legacy server add-in cards and industrial controllers.
What is the operating temperature range for XC7K160T-L2FBG676E?
XC7K160T-L2FBG676E is specified for industrial temperature operation from –40°C to +100°C junction temperature. The "E" suffix denotes extended temperature grade, validated per Xilinx DS182 v2.10. This rating applies under continuous operation with proper thermal management-maximum case temperature must not exceed 95°C when using recommended heatsink and airflow per UG475. The XC7K160T-L2FBG676E is commonly used in outdoor base stations and avionics enclosures where ambient extremes occur.
Can XC7K160T-L2FBG676E be configured via JTAG only?
Yes, XC7K160T-L2FBG676E supports JTAG configuration through TCK/TMS/TDI/TDO pins for boundary-scan testing and initial programming. However, for production deployment, it also supports master SPI, slave SelectMAP, and BPI modes using dedicated configuration pins. The XC7K160T-L2FBG676E's configuration interface selection is controlled by mode pins (M[2:0]) at power-up, and all methods are documented in UG470 v1.11. JTAG alone is sufficient for debug and firmware updates.
Is there a migration path from XC7K160T-L2FBG676E to newer AMD FPGA families?
AMD provides documented migration guidance from Kintex-7 to Kintex UltraScale (e.g., XCKU060) and Versal ACAP families, covering I/O voltage mapping, transceiver lane reassignment, and clocking topology adaptation. While no pin-compatible upgrade exists, XC7K160T-L2FBG676E designs can be ported using Vivado IP integrator and constraint migration tools. Key differences include GTY vs GTX transceivers and hardened AI engines in Versal. Migration support is available through AMD's official FPGA migration advisory service.
XC7K160T-L2FBG676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.87V ~ 0.93V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-L2FBG676E FAQ
1.How can I place an order for XC7K160T-L2FBG676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-L2FBG676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-L2FBG676E reliable?
The price and inventory of XC7K160T-L2FBG676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-L2FBG676E is usually 5 days.
3.What payment methods are accepted for XC7K160T-L2FBG676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-L2FBG676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-L2FBG676E?
XC7K160T-L2FBG676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-L2FBG676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-L2FBG676E?
For technical support, including XC7K160T-L2FBG676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-L2FBG676E requirements.
6.How does Aetrix verify that XC7K160T-L2FBG676E is sourced from the original manufacturer or authorized distributors?
All XC7K160T-L2FBG676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-L2FBG676E meets industry standards.
7.What is the process for return or replacement of XC7K160T-L2FBG676E?
All XC7K160T-L2FBG676E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-L2FBG676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-L2FBG676E part is unused and in its original packaging.
Return procedure for XC7K160T-L2FBG676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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