AMD XC7K160T-L2FBG676I

Overview

XC7K160T-L2FBG676I from AMD (Xilinx) is a Kintex-7 FPGA featuring 158,400 logic cells, 1,128 DSP slices, 13.1 Gb/s transceiver speed, and -2L speed grade in a 676-pin Flip-Chip BGA package. It serves as a high-performance programmable logic fabric for PCIe Gen3 endpoint designs in industrial imaging systems.

For engineers reviewing the XC7K160T-L2FBG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage support (1.2–3.3 V), transceiver reference clock jitter tolerance (0.35 ps RMS), and configuration interface compatibility with SPIx4 and SelectMAP.

Technical Context

The XC7K160T-L2FBG676I implements a heterogeneous architecture with CLBs, Block RAM, UltraScale+ compatible I/O banks, and integrated 13.1 Gb/s GTY transceivers. It supports JTAG, Master SPI, and Slave SelectMAP configuration modes with AES-256 bitstream encryption and HMAC authentication.

Its -2L speed grade guarantees timing closure at 640 MHz for register-to-register paths in worst-case industrial temperature conditions (–40°C to +100°C), with I/O standards including LVDS, SSTL, HSTL, and MIPI D-PHY v1.2 compliant receivers.

Key Specifications

Pinout & Package

XC7K160T-L2FBG676I is housed in a 27×27 mm, 676-pin Flip-Chip Ball Grid Array (FCBGA) with 1.0 mm pitch and thermal lid. The package supports reflow soldering per IPC/JEDEC J-STD-020D and includes dedicated configuration, JTAG, and multiple I/O bank power/ground pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC7K160T-L2FBG676I, XCKU060-2FFVA1156I offers higher performance but demands new PCB layout and thermal management, while XC7K325T-2FBG676I provides scalable logic density within identical mechanical and electrical constraints.

Availability

XC7K160T-L2FBG676I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging subsystems, and PCIe Gen3 frame grabbers requiring stable component supply across extended product lifecycles.

Supply support for XC7K160T-L2FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (acquired Xilinx in 2022) is a global semiconductor leader focused on adaptive computing, AI acceleration, and high-performance programmable logic solutions.

The Kintex-7 family was designed for cost-optimized high-performance applications including wired communications, video processing, and industrial automation where balanced logic, DSP, and I/O resources are critical.

FAQ

What is the maximum supported transceiver data rate for XC7K160T-L2FBG676I?

The XC7K160T-L2FBG676I supports a maximum transceiver line rate of 13.1 Gb/s using its GTY transceivers. This enables compliance with PCIe Gen3, 10GBASE-R, and CPRI Option 3 protocols. The -2L speed grade ensures this rate is maintainable under industrial temperature conditions (–40°C to +100°C) with specified reference clock jitter.

Does XC7K160T-L2FBG676I support configuration via SPIx4 interface?

Yes, XC7K160T-L2FBG676I supports Master SPI configuration mode with x4 data width, allowing fast bitstream loading from standard SPI flash devices. Configuration occurs automatically on power-up when M0–M2 pins are set to 001, and the device validates the bitstream using HMAC authentication before initialization.

What I/O standards are supported by XC7K160T-L2FBG676I's banks?

XC7K160T-L2FBG676I supports LVDS, SSTL-15/18, HSTL-I/II, MIPI D-PHY v1.2 receivers, and single-ended standards including LVCMOS 1.2–3.3 V. Each of the 16 I/O banks has independent VCCO, enabling mixed-voltage operation-e.g., DDR3 memory interfacing alongside 2.5 V camera sensors-without external level shifters.

Is XC7K160T-L2FBG676I qualified for industrial temperature operation?

Yes, XC7K160T-L2FBG676I is rated for industrial temperature operation from –40°C to +100°C junction temperature. Its -2L speed grade is characterized and guaranteed across this range, with timing models validated for worst-case voltage and temperature corners, making it suitable for fanless factory automation and outdoor imaging equipment.

How many block RAM resources does XC7K160T-L2FBG676I provide?

XC7K160T-L2FBG676I provides 7,920 kbit of total block RAM, implemented as 36 Kb dual-port RAM primitives. These are distributed across the fabric to support large FIFOs, frame buffers, and coefficient storage in real-time vision pipelines-e.g., buffering two full 12-bit 2048×2048 frames simultaneously in a medical imaging subsystem.