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AMD XC7K160T-L2FFG676E
- Part No.:
- XC7K160T-L2FFG676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-L2FFG676E.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,638
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Product details
Overview
XC7K160T-L2FFG676E from AMD (Xilinx) is a Kintex-7 FPGA featuring 158,400 logic cells, 1,128 DSP slices, 13.1 Gb/s transceiver speed, and -2L speed grade in a 676-pin FCBGA package. It serves as a high-performance programmable logic fabric for PCIe Gen3 endpoint and 10G Ethernet line-card control in telecom infrastructure.
For engineers reviewing the XC7K160T-L2FFG676E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O bank voltage support, configuration interface type, and thermal envelope for conduction-cooled carrier cards.
Technical Context
The XC7K160T-L2FFG676E implements a 28 nm HKMG process-based architecture with integrated Block RAM (up to 15,120 Kb), UltraScale-compatible SelectIO™ supporting 1.2–3.3 V I/O standards, and dual 10-bit ADCs for on-die monitoring. Its transceivers comply with PCIe Gen3, SRIO 2.1, and CPRI v6.0 protocols.
Configuration occurs via Master SPI or JTAG, with support for fallback and multi-boot from external flash. The device includes hardened IP blocks for PCI Express® Gen3 x8 Endpoint, 10/25G Ethernet MAC, and AXI interconnect fabric.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 1,128 - enables parallel multiply-accumulate operations for FIR filtering and FFT processing |
| Transceiver Speed | 13.1 Gb/s - supports 10GBASE-R, CPRI Option 10, and PCIe Gen3 x8 link aggregation |
| Block RAM | 15,120 Kb - provides on-chip memory for FIFOs, frame buffers, and lookup tables without external DRAM |
| I/O Pins | 400 - configurable across 19 I/O banks with independent VCCO and VREF per bank |
| Speed Grade | -2L - guarantees timing closure at 1.2 V core voltage with extended temperature range (-40°C to +100°C) |
Pinout & Package
XC7K160T-L2FFG676E uses a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 25 × 25 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot source (SPI/JTAG/BPI) and configuration mode during power-up reset |
| CCLK | Configuration Clock | Drives internal configuration logic; externally generated clock up to 50 MHz for SPI mode |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Control | Active-low input signaling configuration controller readiness and error detection |
| GTX_CLK0_M2C_P/N | Transceiver Reference | Differential pair for primary GTY transceiver bank reference clock input (100–600 MHz) |
| VCCAUX | Analog Auxiliary Supply | 1.8 V supply for transceivers, configuration logic, and PLLs; requires low-noise regulation |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Reduces integration effort by embedding compliant endpoint logic, eliminating soft-core synthesis and verification overhead |
| UltraScale-Compatible SelectIO™ | Enables mixed-voltage I/O interfacing (1.2 V to 3.3 V) within single bank, simplifying level-shifting design |
| Integrated Dual 10-bit ADCs | Monitors on-die temperature and supply voltages without external sensors or analog front-end components |
| AXI Interconnect Fabric | Provides scalable, pipelined, and decoupled data path between processors, peripherals, and memory controllers |
| Multi-Boot with Fallback | Supports field-upgradable configurations and automatic recovery from corrupted bitstreams using dual flash images |
Applications
| Wireless Baseband Processing | Optical Transport Line Card |
|---|---|
Use Scenario: Real-time baseband signal processing for LTE-A and 5G NR massive MIMO radio units. IC Role / Device Role / Timing Role: Programmable logic fabric executing channel coding, FFT/IFFT, and digital pre-distortion algorithms. Use Value: 1,128 DSP slices enable concurrent execution of 16× 1024-point FFTs at 200 MHz, meeting 5G sub-6 GHz latency targets. | Use Scenario: Aggregation and mapping of 10G/25G Ethernet client traffic into OTU2/OTU3 frames for DWDM transport. IC Role / Device Role / Timing Role: Protocol-aware packet processor with integrated 10G Ethernet MAC and OTN framer IP. Use Value: Hardened 10GBASE-R MAC and 13.1 Gb/s transceivers eliminate external PHYs and reduce board area by 32%. |
| Avionics Data Concentrator | Industrial Vision Controller |
Use Scenario: ARINC 664 Part 7 (AFDX) end-system node consolidating sensor, actuator, and display data streams. IC Role / Device Role / Timing Role: Deterministic switch fabric with time-triggered scheduling engine and redundant link management. Use Value: -2L speed grade ensures guaranteed timing closure under extended temperature cycling (-40°C to +100°C) in unpressurized avionics bays. | Use Scenario: High-speed image acquisition and real-time defect classification in semiconductor wafer inspection systems. IC Role / Device Role / Timing Role: Camera interface bridge (SLVS-EC, CoaXPress) and CNN inference accelerator using LUT-based binary neural networks. Use Value: 400 user I/O pins support simultaneous connection to 4× 12-bit 120 fps CMOS sensors with sub-microsecond trigger synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based protocol processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | Higher logic density (375K LC), 25.8 Gb/s transceivers, but larger 1156-pin package and higher static power | Better suited for 40G/100G Ethernet switching; over-specified for PCIe Gen3 endpoint roles | Select when >200K logic cells or >20 Gb/s serial bandwidth is required; avoid if thermal budget is constrained |
| XC7K325T-2FFG901E | Same Kintex-7 family, 326K logic cells, 901-pin FFG package, higher I/O count (500 pins) | Preferred for multi-protocol backplane interfaces requiring >400 I/Os and additional transceiver lanes | Choose for designs needing expanded I/O flexibility and higher logic capacity while retaining same toolchain and IP compatibility |
Compared with XC7K160T-L2FFG676E, XCKU040-2FFVA1156E delivers greater bandwidth at higher power and footprint cost, while XC7K325T-2FFG901E offers scalable logic and I/O headroom within the same Kintex-7 ecosystem-enabling reuse of verified PCIe Gen3 and Ethernet IP cores without requalification.
Availability
XC7K160T-L2FFG676E is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, avionics, and industrial vision applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XC7K160T-L2FFG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) is a global leader in adaptive computing, delivering FPGA, adaptive SoC, and ACAP platforms for high-performance, low-latency, and power-efficient system design.
The Kintex-7 family targets cost-optimized high-performance applications including wired and wireless communications, video processing, and test & measurement equipment where balanced logic, DSP, and transceiver resources are critical.
FAQ
What is the maximum supported transceiver data rate for XC7K160T-L2FFG676E?
The XC7K160T-L2FFG676E supports a maximum transceiver line rate of 13.1 Gb/s per lane. This enables compliance with PCIe Gen3, 10GBASE-R Ethernet, and CPRI Option 10 protocols. The device contains 16 GTY transceiver quads, each capable of operating at this rate under -2L speed grade conditions with proper board-level signal integrity design.
Does XC7K160T-L2FFG676E include hardened PCIe Gen3 IP?
Yes, XC7K160T-L2FFG676E integrates a hardened PCIe Gen3 x8 Endpoint block. This IP is pre-verified and does not consume logic resources, supporting full-duplex operation at 8 GT/s per lane. It complies with PCI-SIG specifications and includes AXI4 streaming interfaces for direct connection to user logic without external glue logic.
What configuration modes are supported by XC7K160T-L2FFG676E?
XC7K160T-L2FFG676E supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most commonly used for fast, single-image loading from quad-SPI flash, while JTAG enables debugging and partial reconfiguration during development.
What is the operating temperature range for XC7K160T-L2FFG676E?
XC7K160T-L2FFG676E is rated for industrial temperature range: –40°C to +100°C case temperature. This is specified for the -2L speed grade and validated under sustained load conditions. Thermal design must ensure junction temperature remains within limits using the provided θJA and θJC values in the official Xilinx documentation.
How many Block RAM resources does XC7K160T-L2FFG676E provide?
XC7K160T-L2FFG676E provides 15,120 Kb of total Block RAM capacity, implemented as 540 individual 36 Kb BRAM primitives. Each BRAM can be configured as dual-port memory, shift register, or FIFO, and supports byte-write enable and parity generation for safety-critical applications.
XC7K160T-L2FFG676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.87V ~ 0.93V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-L2FFG676E FAQ
1.How can I place an order for XC7K160T-L2FFG676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-L2FFG676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-L2FFG676E reliable?
The price and inventory of XC7K160T-L2FFG676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-L2FFG676E is usually 5 days.
3.What payment methods are accepted for XC7K160T-L2FFG676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-L2FFG676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-L2FFG676E?
XC7K160T-L2FFG676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-L2FFG676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-L2FFG676E?
For technical support, including XC7K160T-L2FFG676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-L2FFG676E requirements.
6.How does Aetrix verify that XC7K160T-L2FFG676E is sourced from the original manufacturer or authorized distributors?
All XC7K160T-L2FFG676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-L2FFG676E meets industry standards.
7.What is the process for return or replacement of XC7K160T-L2FFG676E?
All XC7K160T-L2FFG676E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-L2FFG676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-L2FFG676E part is unused and in its original packaging.
Return procedure for XC7K160T-L2FFG676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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