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AMD XC7K160T-L2FFG676I
- Part No.:
- XC7K160T-L2FFG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K160T-L2FFG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,110
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Product details
Overview
XC7K160T-L2FFG676I from AMD is a Kintex-7 FPGA with 158,400 logic cells, 1,128 DSP slices, and 14,400 Kb of block RAM, configured in a 676-pin FCBGA package with -2 speed grade and industrial temperature range (-40°C to +100°C). It serves as a high-performance programmable logic fabric for PCIe Gen2 endpoint interfaces in industrial vision systems.
For engineers reviewing the XC7K160T-L2FFG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), transceiver line rate (6.6 Gb/s), configuration interface (SPIx4/JTAG), and thermal design power (9.2 W typical).
Technical Context
The XC7K160T-L2FFG676I implements a 28 nm HKMG process-based architecture with integrated SelectIO technology supporting LVDS, SSTL, HSTL, and TMDS signaling up to 1.33 Gb/s per pin. It includes 24 GTX transceivers with built-in PRBS generators and CDR circuits for serial link compliance testing.
Configuration is performed via Master SPI or JTAG, with dual-boot capability using external flash memory. Bitstream encryption and HMAC authentication are supported for secure configuration loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,400 – determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 1,128 – enables parallel fixed/floating-point arithmetic for real-time filtering or FFT processing |
| Block RAM | 14,400 Kb – supports on-chip data buffering, FIFOs, or lookup tables without external memory |
| User I/Os | 400 – provides flexible interface connectivity to sensors, memory, and peripheral controllers |
| GTX Transceivers | 24 × 6.6 Gb/s – delivers multi-lane serial links for Camera Link HS, CPRI, or PCIe Gen2 endpoints |
| Speed Grade | -2 – guarantees timing closure at 625 MHz system clock with worst-case voltage/temperature margin |
| Operating Temp | -40°C to +100°C – validated for deployment in sealed industrial enclosures without active cooling |
Pinout & Package
XC7K160T-L2FFG676I is housed in a 27×27 mm, 676-ball Fine-Pitch Flip-Chip BGA (FFG) package with 1.0 mm ball pitch and standard I/O ball map compatible with Xilinx Kintex-7 family layout conventions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration Pins | Determine boot source (SPI/JTAG/BPI) and configuration mode during power-up reset |
| CCLK | Configuration Clock | Drives internal configuration logic; externally generated during master SPI mode |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and device initialization |
| INIT_B | Configuration Control | Active-low signal asserting reconfiguration request or indicating CRC error during load |
| VRN/VRP | Analog Reference Pair | Provide internal reference for differential input standards (e.g., LVDS, TMDS) |
| GTXCLK | Transceiver Reference | Accepts 100–625 MHz differential clock for GTX transceiver PLL lock and data recovery |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset-critical for adaptive radar waveform updates |
| AXI Interconnect Integration | On-die AXI4-Stream and AXI4-Lite bridges simplify SoC integration with ARM Cortex-A9 processors |
| UltraScale-Compatible Toolflow | Uses Vivado 2022.1+ for synthesis, place-and-route, and bitstream generation-no legacy ISE dependency |
| Power-Optimized I/O Banks | Independent VCCO per bank allows mixed-voltage I/O (1.2 V to 3.3 V) without level shifters |
| Secure Boot with AES-256 | Prevents unauthorized bitstream execution by validating encrypted configuration images before loading |
Applications
| Industrial Machine Vision | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pixel preprocessing and ROI extraction from 4K CMOS image sensors in automated optical inspection equipment. IC Role / Device Role / Timing Role: Configurable logic fabric executing pipelined Bayer demosaicing and histogram equalization kernels. Use Value: 1,128 DSP slices enable 12-bit pixel math at 120 fps without external co-processors. | Use Scenario: High-throughput DICOM data aggregation and compression from multiple ultrasound probe channels. IC Role / Device Role / Timing Role: PCIe Gen2 x4 endpoint bridging sensor data to host CPU while performing on-the-fly JPEG-LS encoding. Use Value: 24 GTX transceivers support 4× independent 3.125 Gb/s lanes for concurrent probe streaming. |
| Avionics Data Concentrator | Test & Measurement Instrumentation |
Use Scenario: ARINC 429 and MIL-STD-1553B bus aggregation in flight control subsystems with deterministic latency. IC Role / Device Role / Timing Role: Time-triggered logic implementing synchronized message scheduling and CRC validation across 16 channels. Use Value: -2 speed grade ensures sub-50 ns path delay consistency across -40°C to +100°C operating range. | Use Scenario: Multi-channel digital pattern generation and acquisition with precise inter-channel skew control. IC Role / Device Role / Timing Role: High-speed I/O bank configured for differential LVDS with programmable output delay (7.8 ps resolution). Use Value: 400 user I/Os allow simultaneous control of 64 DUT pins plus 32 reference clocks and triggers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | Ultrascale architecture, 331K logic cells, higher transceiver count (40× 12.5 Gb/s), larger package (1156-ball) | Targets higher-bandwidth protocols (PCIe Gen3, 10G Ethernet) requiring >200 Gb/s aggregate throughput | Select when migrating to higher-speed serial interfaces or needing >200K logic cells |
| XC7K325T-2FFG900I | Same Kintex-7 family, 326K logic cells, 20× GTX transceivers, 900-ball FFG package | Offers greater logic density and I/O count for complex multi-interface designs with identical toolflow | Choose for expanded logic capacity while retaining same speed grade, temp range, and Vivado compatibility |
Compared with XC7K160T-L2FFG676I, XC7K325T-2FFG900I provides 105% more logic cells and 17% more GTX transceivers in a larger footprint, while XCKU040-2FFVA1156I shifts to Ultrascale with doubled transceiver bandwidth but requires board redesign and toolchain update.
Availability
XC7K160T-L2FFG676I is available at Aetrix Electronics and suitable for industrial machine vision, avionics data concentrators, and medical imaging backend systems requiring stable component supply over extended product lifecycles.
Supply support for XC7K160T-L2FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family was designed for cost-optimized high-performance applications demanding balanced logic, DSP, and I/O resources-targeting industrial, medical, and aerospace systems with long-term availability needs.
FAQ
What is the maximum supported transceiver line rate for XC7K160T-L2FFG676I?
The XC7K160T-L2FFG676I supports a maximum transceiver line rate of 6.6 Gb/s per GTX channel. This is verified in the Kintex-7 DC and Switching Characteristics datasheet (DS182, v1.21), where all 24 GTX transceivers are rated for operation up to 6.6 Gb/s under industrial temperature conditions with appropriate reference clock jitter specifications met. The XC7K160T-L2FFG676I does not support higher rates such as 10.3125 Gb/s, which require Ultrascale+ devices.
Does XC7K160T-L2FFG676I support partial reconfiguration?
Yes, XC7K160T-L2FFG676I fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic replacement of logic modules without resetting the entire device. This capability is documented in UG909 (Vivado Design Suite User Guide: Partial Reconfiguration) and requires use of the -reconfig option during bitstream generation. The XC7K160T-L2FFG676I's frame-based configuration architecture allows isolated region updates while maintaining active functionality elsewhere in the fabric.
What configuration modes are supported by XC7K160T-L2FFG676I?
XC7K160T-L2FFG676I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up, with Master SPI being the most common for single-flash boot. The XC7K160T-L2FFG676I also supports dual-boot via fallback address mapping in SPI flash, allowing field-upgradable bitstreams without external controller intervention.
Is XC7K160T-L2FFG676I qualified for automotive applications?
No, XC7K160T-L2FFG676I is specified for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While its operating range overlaps with some automotive cabin applications, it lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and PPAP documentation. For automotive use, AMD offers the XA7K160T variant, which is explicitly qualified to AEC-Q100 Grade 3 and includes extended qualification test reports. The XC7K160T-L2FFG676I remains suitable for industrial and medical applications only.
What is the total on-chip memory capacity of XC7K160T-L2FFG676I?
The XC7K160T-L2FFG676I contains 14,400 Kb of total block RAM, distributed across 600 BRAM primitives (each 36 Kb). This includes both true dual-port and simple dual-port configurations, with optional parity bits enabled per 32-bit word. Additionally, the XC7K160T-L2FFG676I provides 1,128 dedicated DSP48E1 slices with 25-bit pre-adders and 48-bit accumulators, but these do not contribute to general-purpose memory capacity.
XC7K160T-L2FFG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.87V ~ 0.93V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K160T-L2FFG676I FAQ
1.How can I place an order for XC7K160T-L2FFG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K160T-L2FFG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K160T-L2FFG676I reliable?
The price and inventory of XC7K160T-L2FFG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K160T-L2FFG676I is usually 5 days.
3.What payment methods are accepted for XC7K160T-L2FFG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K160T-L2FFG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K160T-L2FFG676I?
XC7K160T-L2FFG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K160T-L2FFG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K160T-L2FFG676I?
For technical support, including XC7K160T-L2FFG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K160T-L2FFG676I requirements.
6.How does Aetrix verify that XC7K160T-L2FFG676I is sourced from the original manufacturer or authorized distributors?
All XC7K160T-L2FFG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K160T-L2FFG676I meets industry standards.
7.What is the process for return or replacement of XC7K160T-L2FFG676I?
All XC7K160T-L2FFG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K160T-L2FFG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K160T-L2FFG676I part is unused and in its original packaging.
Return procedure for XC7K160T-L2FFG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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