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AMD XC7K325T-1FB676C
- Part No.:
- XC7K325T-1FB676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FB676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,847
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Product details
Overview
XC7K325T-1FB676C from AMD is a Kintex-7 FPGA featuring 326,080 logic cells, 1,460 DSP slices, 16.3 Mb of block RAM, 600 I/O pins, and operates at -1 speed grade (1.0 ns CLB delay) in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package. It is deployed in high-throughput packet processing systems requiring deterministic latency and multi-gigabit serial connectivity.
For engineers reviewing the XC7K325T-1FB676C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (24 GTP/GTX), I/O voltage support (1.2–3.3 V), configuration interface (SPIx4/JTAG), and thermal design power (14.5 W typical).
Technical Context
The XC7K325T-1FB676C implements a heterogeneous architecture with programmable logic fabric, hardened transceivers supporting 6.6 Gb/s line rates, and integrated PCIe Gen2 x8 endpoint/switch blocks. It includes dual 32-bit AXI interconnects and supports partial reconfiguration for dynamic function swapping.
Configuration is performed via Master SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device uses SelectIO technology with support for LVDS, SSTL, HSTL, and MIPI D-PHY standards across its 600 user I/O pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 1,460 - enables parallel multiply-accumulate operations for signal processing pipelines |
| Block RAM | 16.3 Mb - provides on-chip memory for FIFOs, buffers, and lookup tables without external DRAM |
| Transceivers | 24 × GTX - supports 24 independent 6.6 Gb/s serial links for SFP+, CPRI, or JESD204B interfaces |
| I/O Pins | 600 - delivers high pin count for parallel bus interfacing, memory controllers, and multi-protocol expansion |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns CLB propagation delay under industrial temperature conditions |
| TDP | 14.5 W typical - defines thermal envelope for heatsink sizing and airflow planning in enclosed chassis |
Pinout & Package
XC7K325T-1FB676C is housed in a 27×27 mm, 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 36 power/ground balls per side and dedicated configuration, clock, and transceiver banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot source (SPI/JTAG/BPI) and configuration mode during power-up |
| CCLK | Configuration Clock | Drives internal configuration logic; frequency up to 50 MHz in Master SPI mode |
| DIN | Serial Data Input | Receives configuration bitstream in Master SPI mode; tied high in JTAG mode |
| INIT_B | Configuration Status | Active-low open-drain output indicating configuration progress and CRC error detection |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and restarts boot sequence |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock | Differential input for GTX transceiver bank 0; supports 100–660 MHz frequencies |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Hard IP block enabling direct host CPU attachment without soft-core overhead or timing closure risk |
| Partial Reconfiguration | Allows runtime swap of logic partitions while maintaining system operation-critical for adaptive radio and protocol gateways |
| AXI Interconnect | Dual 32-bit AXI4-Lite/AXI4-Stream bridges simplify SoC integration with ARM processors and DMA engines |
| Bitstream Encryption | 256-bit AES key protection prevents IP theft during field programming and bitstream storage |
| SelectIO Technology | Supports 20+ I/O standards including MIPI D-PHY v1.2 and LPDDR3 at 1066 Mbps-enables direct sensor/memory interfacing |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time modulation/demodulation of LTE-A and 5G NR waveforms in macrocell and small-cell radios. IC Role / Device Role / Timing Role: Primary baseband processor executing PHY-layer algorithms with deterministic sub-microsecond latency. Use Value: 24 GTX transceivers enable simultaneous CPRI/OBSAI fronthaul + backhaul interfaces; 1,460 DSP slices sustain 2×2 MIMO FFT/IFFT throughput. | Use Scenario: Multi-channel digital pattern generation and acquisition in automated test systems for ASIC validation. IC Role / Device Role / Timing Role: Programmable stimulus engine synchronizing 600 I/O pins at 200 MHz with <100 ps skew across banks. Use Value: 326,080 logic cells implement custom state machines and deep pattern memory; block RAM supports 128k-word deep capture buffers. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: Real-time image reconstruction pipeline for CT and MRI scanners using iterative algorithms and GPU offload coordination. IC Role / Device Role / Timing Role: Co-processor managing raw detector data ingestion, preprocessing, and AXI-based handoff to host GPU subsystems. Use Value: Dual AXI interconnects isolate imaging data flow from control traffic; 16.3 Mb block RAM stores projection kernels and calibration LUTs. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers with deterministic jitter <50 ns. IC Role / Device Role / Timing Role: Deterministic switch fabric routing time-triggered Ethernet and legacy avionics buses with hardware timestamping. Use Value: -1 speed grade ensures worst-case path timing closure at -55°C to +105°C; hardened PCIe Gen2 x8 enables direct VPX backplane attachment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-1FBVA676E | UltraScale architecture; 504,000 logic cells; 24 GTY transceivers (16.3 Gb/s); higher static power | Targets higher-bandwidth protocols (PCIe Gen3, 100G Ethernet) and larger algorithm footprints | Choose when >10 Gb/s serial I/O or >400K logic cells are required; requires new PCB layout and power delivery redesign |
| XC7K160T-1FBG484C | Same Kintex-7 family; 162,240 logic cells; 12 GTX transceivers; 484-pin FCBGA; lower TDP (9.2 W) | Suitable for cost-sensitive, lower-complexity embedded vision or motor control systems | Choose when full XC7K325T resources are unused; maintains same toolchain and partial reconfiguration flow |
Compared with XC7K325T-1FB676C, XCKU040 offers higher bandwidth but demands greater power and layout effort, while XC7K160T reduces cost and thermal load at the expense of transceiver count and logic density-both require distinct board designs and do not share pin compatibility.
Availability
XC7K325T-1FB676C is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging equipment, and avionics systems requiring stable component supply across extended product lifecycles.
Supply support for XC7K325T-1FB676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, AI acceleration, and CPU/GPU architectures.
The Kintex-7 family targets high-performance, cost-optimized applications demanding balanced logic, DSP, memory, and I/O resources-designed for wireless infrastructure, video processing, and industrial automation.
FAQ
What is the maximum supported transceiver line rate for XC7K325T-1FB676C?
The XC7K325T-1FB676C integrates GTX transceivers rated for a maximum line rate of 6.6 Gb/s. This is validated across all 24 transceiver quads in the device and supports protocols including SFP+, CPRI, and JESD204B subclass 0/1. Operation at this rate requires proper PCB stackup, controlled impedance routing, and compliance with AMD's IBIS-AMI models for signal integrity analysis. The XC7K325T-1FB676C does not support GTY or GTH transceivers.
Does XC7K325T-1FB676C support partial reconfiguration?
Yes, XC7K325T-1FB676C fully supports partial reconfiguration through Vivado Design Suite. This capability allows dynamic replacement of logic modules-such as modulator/demodulator blocks in wireless systems-without resetting the entire device. The XC7K325T-1FB676C implements frame-based PR with dedicated configuration port arbitration and built-in CRC checking for reconfigured regions.
What configuration modes are supported by XC7K325T-1FB676C?
XC7K325T-1FB676C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is determined by the M[2:0] pin states at power-on. Master SPI is most common for compact, single-flash deployments; JTAG is used for debugging and field updates. The XC7K325T-1FB676C does not support BPI or NAND flash boot without external controller logic.
Is XC7K325T-1FB676C qualified for automotive applications?
No, XC7K325T-1FB676C is specified for commercial (0°C to +85°C) and industrial (-40°C to +100°C) temperature ranges only. It lacks AEC-Q100 qualification, automotive-grade screening, or ASIL-B/D functional safety certification. For automotive use cases, AMD recommends the XA series derivatives such as XA7K325T, which undergo additional reliability testing and documentation aligned with ISO 26262 requirements.
What is the total block RAM capacity in XC7K325T-1FB676C?
The XC7K325T-1FB676C provides 16.3 Mb (2,086,400 bits) of total block RAM distributed across 720 BRAM primitives, each configurable as 36 Kb dual-port RAM or 18 Kb single-port RAM. This capacity supports large on-chip buffers, FIR filter coefficient storage, and real-time histogram accumulation without external memory access-reducing latency and power in XC7K325T-1FB676C-based systems.
XC7K325T-1FB676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K325T-1FB676C FAQ
1.How can I place an order for XC7K325T-1FB676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FB676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FB676C reliable?
The price and inventory of XC7K325T-1FB676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FB676C is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FB676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FB676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-1FB676C?
XC7K325T-1FB676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-1FB676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FB676C?
For technical support, including XC7K325T-1FB676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FB676C requirements.
6.How does Aetrix verify that XC7K325T-1FB676C is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FB676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FB676C meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FB676C?
All XC7K325T-1FB676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FB676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FB676C part is unused and in its original packaging.
Return procedure for XC7K325T-1FB676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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