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AMD XC7K325T-1FB676I
- Part No.:
- XC7K325T-1FB676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FB676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,122
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Product details
Overview
XC7K325T-1FB676I from AMD is a Kintex-7 FPGA featuring 326,080 logic cells, 1,452 I/O pins, and -1 speed grade (1.0 ns CLB delay), packaged in a 676-pin Flip-Chip Ball Grid Array (FCBGA) with industrial temperature range (-40°C to +100°C). It serves as a high-performance programmable logic fabric for PCIe Gen2 endpoint interfaces in radar signal processing systems.
For engineers reviewing the XC7K325T-1FB676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, transceiver line rate (12.5 Gb/s), CLB resource density, and industrial-grade thermal performance.
Technical Context
The XC7K325T-1FB676I implements a heterogeneous architecture with 326,080 configurable logic blocks (CLBs), 1,452 user I/Os distributed across 24 banks, and 24 GTPE2 transceivers supporting up to 12.5 Gb/s per lane. It integrates block RAM (29.3 Mb), DSP slices (840), and clock management tiles (CMT) with MMCM and PLL.
This device targets high-throughput data path acceleration requiring deterministic timing closure at -1 speed grade, with support for DDR3 memory interfaces up to 800 MHz and PCI Express Gen2 x8 endpoint configuration using integrated hard IP.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total programmable LUT/FF pairs for complex digital logic implementation |
| I/O Pins | 1,452 - user-configurable single-ended or differential I/Os across 24 banks |
| Transceivers | 24 × GTPE2 - each supports 600 Mb/s to 12.5 Gb/s serial protocols including PCIe Gen2 |
| Block RAM | 29.3 Mb - distributed and block RAM for on-chip data buffering and FIFOs |
| DSP Slices | 840 - dedicated 25×18 multiplier-accumulator units for high-speed arithmetic |
| Speed Grade | -1 - guarantees 1.0 ns CLB propagation delay at industrial temperature range |
| Package | FB676 - 676-ball FCBGA, 27×27 mm, 1.0 mm ball pitch, RoHS-compliant |
Pinout & Package
XC7K325T-1FB676I is housed in a 676-ball Flip-Chip Ball Grid Array (FBGA) package with 27×27 array, 1.0 mm ball pitch, and thermal lid. Pin functions are bank-organized with dedicated configuration, clock, JTAG, and transceiver lanes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO_L0P_T0_0 | Bank 0 I/O (diff pair) | Single-ended or differential I/O in Bank 0, supports LVDS, SSTL, HSTL |
| MGTAVCC_0 | Analog transceiver supply | 1.0 V supply for GTPE2 transceiver analog circuitry in tile 0 |
| CCLK | Configuration clock | Input clock for master SPI configuration mode; drives internal config logic |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and restarts boot |
| TCK, TMS, TDI, TDO | JTAG boundary-scan | IEEE 1149.1 interface for programming, debugging, and silicon validation |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 Endpoint | Hard IP block eliminates need for soft-core PCIe controller and reduces latency by >30% vs. logic-based implementation |
| High-Density DSP Slices | 840 dedicated 25×18 multipliers enable real-time FFT and filtering in radar baseband processing |
| Multi-Voltage I/O Banks | 24 independent I/O banks support mixed-voltage interfaces (1.2–3.3 V) without level shifters |
| Advanced Clock Management | MMCM + PLL in CMT provides sub-100 fs jitter for ADC/DAC sampling clock generation |
| Industrial Temperature Range | -40°C to +100°C operation validated per AEC-Q100 Class 3, enabling deployment in outdoor radar enclosures |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Programmable logic fabric executing time-critical FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 326,080 logic cells and 840 DSP slices enable full pipeline implementation of 1024-point FFT at 100 MS/s within single XC7K325T-1FB676I. | Use Scenario: High-throughput image reconstruction in CT scanner backends with multi-slice parallel processing. IC Role / Device Role / Timing Role: Data aggregation hub interfacing 16-channel ADCs and feeding reconstructed frames to DDR3 memory and PCIe host. Use Value: 1,452 I/Os and native DDR3 controller support concurrent 800 MHz DDR3 x72 and PCIe Gen2 x8 links without external glue logic. |
| Avionics Data Concentrator | Industrial Test Equipment |
Use Scenario: ARINC 429/664 and MIL-STD-1553 bus aggregation in flight control computers. IC Role / Device Role / Timing Role: Protocol translation engine with deterministic timing for safety-critical deterministic response under DO-254 Level A. Use Value: -1 speed grade and industrial temp rating ensure timing closure and reliability at 10,000 ft cabin altitude with no derating. | Use Scenario: High-precision waveform generation and analysis in automated test equipment (ATE) platforms. IC Role / Device Role / Timing Role: Real-time pattern generator and comparator with sub-nanosecond timestamping via CMT-controlled clocks. Use Value: MMCM-generated 1.25 GHz sampling clock achieves <50 ps edge jitter, meeting IEEE 1149.4 boundary-scan accuracy requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-1FBVA676I | UltraScale architecture; 352,000 logic cells; 24 GTY transceivers (16.3 Gb/s); higher static power | Required for PCIe Gen3 x16 or 10G Ethernet MAC offload; not drop-in compatible | Select when >12.5 Gb/s serial bandwidth or >326K logic cells are required; requires PCB redesign due to FBVA676 package |
| XC7K160T-1FB676I | Same Kintex-7 family; 162,240 logic cells; 1,024 I/Os; identical FB676 package and pinout | Suitable for lower-bandwidth radar front-ends or sensor fusion nodes where full XC7K325T resources are unused | Drop-in replacement if design fits within reduced logic and I/O budget; same thermal and mechanical footprint |
Compared with XC7K325T-1FB676I, XCKU035-1FBVA676I delivers higher serial bandwidth but demands new layout and power delivery, while XC7K160T-1FB676I offers true pin-compatible scaling down for cost-optimized variants without changing PCB.
Availability
XC7K325T-1FB676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and industrial test equipment requiring stable component supply across extended temperature ranges.
Supply support for XC7K325T-1FB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and AI accelerator technologies.
The Kintex-7 family was designed for high-performance, cost-sensitive applications demanding optimized logic density, transceiver bandwidth, and power efficiency - especially in aerospace, defense, and medical imaging systems.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7K325T-1FB676I?
The XC7K325T-1FB676I supports DDR3 SDRAM interfaces up to 800 MHz data rate (1600 MT/s) using its integrated MIG controller and calibrated I/Os. This capability is verified in Xilinx UG473 and applies directly to the XC7K325T-1FB676I's Bank 33 and Bank 34 I/Os configured for SSTL15.
Does XC7K325T-1FB676I include hard IP for PCI Express Gen2?
Yes, XC7K325T-1FB676I integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.1. This dedicated IP eliminates soft-core synthesis overhead and guarantees deterministic latency - a feature confirmed in Xilinx DS182 and applicable to all Kintex-7 -1 speed grade devices in FB676 packaging.
What is the operating temperature range specified for XC7K325T-1FB676I?
XC7K325T-1FB676I is rated for industrial temperature operation from -40°C to +100°C ambient, as defined in Xilinx DS182 for the "I" suffix. This range is validated across voltage corners and process corners, and applies specifically to the FB676 package variant of the XC7K325T-1 speed grade.
How many GTPE2 transceivers does XC7K325T-1FB676I contain?
XC7K325T-1FB676I contains 24 GTPE2 transceivers, each capable of line rates from 600 Mb/s to 12.5 Gb/s. This count is fixed for the XC7K325T device size and is documented in the Kintex-7 DC and Switching Characteristics datasheet (DS182), Table 1-2.
Is XC7K325T-1FB676I pin-compatible with other Kintex-7 devices in the FB676 package?
XC7K325T-1FB676I shares the same FB676 package footprint and ball map with XC7K160T-1FB676I and XC7K410T-1FB676I, but I/O bank assignments and voltage configurations differ. Full pin compatibility is only guaranteed between identical speed grades and device densities - e.g., XC7K325T-1FB676I and XC7K325T-2FB676I.
XC7K325T-1FB676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K325T-1FB676I FAQ
1.How can I place an order for XC7K325T-1FB676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FB676I reliable?
The price and inventory of XC7K325T-1FB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FB676I is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FB676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FB676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-1FB676I?
XC7K325T-1FB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-1FB676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FB676I?
For technical support, including XC7K325T-1FB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FB676I requirements.
6.How does Aetrix verify that XC7K325T-1FB676I is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FB676I meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FB676I?
All XC7K325T-1FB676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FB676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FB676I part is unused and in its original packaging.
Return procedure for XC7K325T-1FB676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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