AMD XC7K325T-1FB900C

Overview

XC7K325T-1FB900C from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,460 I/O pins, and 1,350 DSP slices, operating at -1 speed grade (1.0 ns CLB delay) in a 900-pin Flip-Chip Ball Grid Array (FCBGA) package. It targets high-throughput data processing in wired communications infrastructure and radar signal conditioning.

For engineers reviewing the XC7K325T-1FB900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 12.5 Gb/s, and integrated block RAM capacity of 15,360 kbits.

Technical Context

The XC7K325T-1FB900C implements a heterogeneous architecture with configurable logic blocks (CLBs), 36-kbit block RAMs, and 25×18-bit DSP48E1 slices optimized for fixed-point arithmetic. It integrates 24 GTX transceivers supporting PCIe Gen2, SRIO, and CPRI protocols.

Configuration occurs via Master SelectMAP or JTAG, with bitstream encryption and SEU mitigation features enabled. The device supports partial reconfiguration and operates across commercial temperature range (0°C to 85°C).

Key Specifications

Pinout & Package

XC7K325T-1FB900C is housed in a 900-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for industrial-grade thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Compared with XCKU040-1FBVA676C and XC7K410T-1FB900C, the XC7K325T-1FB900C offers optimal balance of DSP density, I/O count, and cost for mid-tier 10G–25G signal processing, avoiding over-provisioning while maintaining compatibility with existing Kintex-7 toolchains and reference designs.

Availability

XC7K325T-1FB900C is available at Aetrix Electronics and suitable for wireless infrastructure, radar systems, and high-speed test equipment requiring stable component supply across multi-year production cycles.

Supply support for XC7K325T-1FB900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and AI accelerator technologies.

The Kintex-7 family was designed for cost-optimized high-performance applications demanding balanced logic, memory, and serial I/O resources - particularly in communications, video, and military/aerospace systems.

FAQ

What is the maximum supported transceiver data rate for XC7K325T-1FB900C?

The XC7K325T-1FB900C integrates 24 GTX transceivers rated for operation from 600 Mb/s up to 12.5 Gb/s. This supports protocols including PCIe Gen2, CPRI, and SRIO. The actual achievable rate depends on board layout, reference clock stability, and signal integrity margins - all verified per UG476 v1.13.

Does XC7K325T-1FB900C support partial reconfiguration?

Yes, XC7K325T-1FB900C fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logic modules while the rest of the design remains operational - critical for adaptive radio and real-time protocol switching. Configuration frames are isolated per reconfigurable partition.

What I/O standards are supported by XC7K325T-1FB900C?

XC7K325T-1FB900C supports LVCMOS, LVDS, TMDS, RSDS, HSTL, SSTL, and differential signaling standards across its 1,460 I/O pins. Each of the 34 I/O banks can be independently configured for voltage levels from 1.2 V to 3.3 V, enabling mixed-standard interface integration.

Is XC7K325T-1FB900C compatible with Xilinx Vivado tools?

Yes, XC7K325T-1FB900C is fully supported in Xilinx Vivado Design Suite versions 2015.4 through 2023.1. Synthesis, implementation, and bitstream generation workflows are validated per UG908 and AR# 61221. Legacy ISE support ended after 14.7.

What thermal management guidance applies to XC7K325T-1FB900C?

XC7K325T-1FB900C requires a thermal solution capable of dissipating up to 15.5 W typical power under worst-case switching activity. AMD recommends a 4-layer PCB with internal copper planes, thermal vias under the package, and a heatsink rated for ≤15°C/W junction-to-ambient resistance per UG475.