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AMD XC7K325T-1FB900I
- Part No.:
- XC7K325T-1FB900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FB900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,896
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Product details
Overview
XC7K325T-1FB900I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 I/O pins, and 1,452 configurable logic blocks (CLBs), operating at -1 speed grade with industrial temperature range (-40°C to +100°C). It integrates 24 transceivers supporting up to 12.5 Gb/s, 1,080 DSP slices, and 16.3 Mb of block RAM, deployed in high-throughput data acquisition and real-time signal processing systems.
For engineers reviewing the XC7K325T-1FB900I datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count and speed, CLB density, I/O voltage support (1.2 V to 3.3 V), thermal performance under sustained 2.5 W dynamic power, and compatibility with Vivado Design Suite 2023.2+ for bitstream generation.
Technical Context
The XC7K325T-1FB900I implements a 28 nm HKMG process architecture with dual-register LUT6 logic, dedicated carry chains, and integrated clock management tiles (CMT) containing PLLs and MMCMs. It supports multi-gigabit serial I/O with built-in PRBS generators, 8B/10B encoders, and elastic buffers.
Configuration occurs via Master SPI, Slave SelectMAP, or JTAG interfaces; configuration memory is loaded from external flash or through ICAP. The device includes hardened PCIe Gen2 x8 endpoint logic and AXI-Stream interconnect fabric for high-bandwidth data movement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total programmable resources for combinational and sequential logic implementation |
| I/O Pins | 1,452 - user-configurable single-ended or differential I/O supporting LVCMOS, LVDS, SSTL, HSTL |
| Transceivers | 24 × 12.5 Gb/s - serial lanes with built-in encoding, clock recovery, and alignment logic |
| DSP Slices | 1,080 - 25×18-bit multiplier-accumulator units optimized for filtering and FFT operations |
| Block RAM | 16.3 Mb - distributed and block RAM for on-chip data buffering and FIFO implementation |
| Speed Grade | -1 - timing specification guaranteeing operation up to 640 MHz system clock in worst-case industrial conditions |
| Temperature Range | -40°C to +100°C - qualified for industrial environments without derating |
Pinout & Package
XC7K325T-1FB900I is housed in a 900-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-271AC footprint. Thermal pad is exposed on underside for heatsink attachment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O | Configurable as PS I/O or PL interface; supports 1.8 V/2.5 V/3.3 V banks with slew rate control |
| HR Bank 0–15 | High-Range I/O | Supports 1.2 V to 3.3 V signaling; includes differential standards like LVDS and TMDS |
| HP Bank 0–12 | High-Performance I/O | Optimized for 1.2 V/1.5 V/1.8 V; enables DDR3/DDR4 memory interfaces up to 1,866 Mbps |
| GTX/GTH RefCLK | Transceiver Reference Clock | Dedicated differential inputs for transceiver PLLs; requires <1.5 ps RMS jitter for 12.5 Gb/s operation |
| CONFIG_MODE[2:0] | Configuration Mode Select | Defines boot source: SPI, BPI, or JTAG; must be set before power-on reset |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2 Endpoint | Integrated x8 root complex logic eliminating need for external bridge IC and reducing latency by ~12 ns |
| AXI-Stream Interconnect | On-die 64-bit wide streaming fabric enabling zero-cycle handshaking between IP blocks and DMA engines |
| Dynamic Reconfiguration | Partial reconfiguration capability allows runtime logic updates without system reset or interrupting active I/O paths |
| UltraScale-Compatible Toolflow | Fully supported in Vivado 2023.2+ with timing closure, power estimation, and bitstream encryption features |
| Industrial Temp Qualification | 100% tested across -40°C to +100°C with guaranteed timing margins per Xilinx DS182 v2.11 |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and CFAR detection; GTX transceivers stream ADC samples at 5 GSPS from 32-channel RF front-end. Use Value: 1,080 DSP slices enable 2,160 MAC operations/cycle; deterministic latency under 85 ns meets STANAG 4676 timing constraints. | Use Scenario: High-resolution CT image reconstruction pipeline with multi-slice backprojection. IC Role / Device Role / Timing Role: XC7K325T-1FB900I hosts custom backprojection engine and manages 16-channel LVDS camera sensor interface. Use Value: 1,452 I/O pins support simultaneous connection to 4× 4-lane LVDS sensors and DDR3 memory controller; 16.3 Mb block RAM buffers full sinogram data. |
| 5G Baseband Unit | Industrial Machine Vision Controller |
Use Scenario: Layer 1 PHY processing for massive MIMO base stations with 64 antenna elements. IC Role / Device Role / Timing Role: Implements channel estimation, precoding, and OFDM modulation using hardened DSP slices and AXI-Stream interconnect. Use Value: 24 × 12.5 Gb/s transceivers handle fronthaul CPRI/eCPRI links; -1 speed grade ensures timing closure at 400 MHz FFT clock. | Use Scenario: Real-time defect classification on PCB assembly lines using CNN inference at 120 fps. IC Role / Device Role / Timing Role: Configured as vision processor with MIPI CSI-2 receiver, image preprocessor, and lightweight CNN accelerator. Use Value: HR I/O banks interface directly to 4K CMOS sensors; 326,080 logic cells implement quantized INT8 convolution kernels with sub-200 ns inference latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | Ultrascale architecture; 384,000 logic cells; 32 GTY transceivers @ 32.75 Gb/s; higher static power | Better suited for 400G Ethernet and AI inference acceleration; requires updated toolchain (Vivado 2022.1+) | Select when >12.5 Gb/s serial bandwidth or >326K logic cells are required; not pin-compatible |
| XC7K160T-2FB676I | Same Kintex-7 family; 162,240 logic cells; 16 transceivers; -2 speed grade; lower I/O count (600 pins) | Targeted at cost-sensitive embedded vision and motor control; insufficient for full 5G BBU PHY layer | Choose for reduced BOM cost where logic density and transceiver count allow functional partitioning |
Compared with XC7K325T-1FB900I, XCKU040-2FFVA1156I delivers higher serial bandwidth and logic capacity but increases power and toolchain complexity, while XC7K160T-2FB676I offers lower cost and power at the expense of transceiver count and DSP resources needed for full radar or 5G PHY implementations.
Availability
XC7K325T-1FB900I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and 5G baseband unit applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC7K325T-1FB900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family targets high-performance, cost-optimized applications such as wireless infrastructure, video processing, and test equipment, balancing logic density, transceiver bandwidth, and power efficiency.
FAQ
What is the maximum supported transceiver data rate for XC7K325T-1FB900I?
The XC7K325T-1FB900I supports 24 transceivers each capable of 12.5 Gb/s operation. This rate is validated under industrial temperature conditions with reference clock jitter below 1.5 ps RMS and proper PCB layout per UG476. The XC7K325T-1FB900I does not support rates above 12.5 Gb/s, even with external equalization or retiming.
Does XC7K325T-1FB900I include hardened PCIe Gen3 logic?
No, XC7K325T-1FB900I includes only hardened PCIe Gen2 x8 endpoint logic. It lacks native Gen3 protocol support, transaction layer enhancements, or 8 GT/s encoding. For PCIe Gen3, designers must use UltraScale devices such as XCKU040 or implement soft IP, which consumes significant logic resources and increases latency.
What configuration modes are supported by XC7K325T-1FB900I?
XC7K325T-1FB900I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. CONFIG_MODE[2:0] pins determine the mode at power-on reset. The XC7K325T-1FB900I does not support BPI or QSPI XIP modes; external flash must be interfaced via SPI controller or MicroBlaze soft processor.
Is XC7K325T-1FB900I qualified for automotive AEC-Q100?
No, XC7K325T-1FB900I is qualified for industrial temperature range (-40°C to +100°C) per Xilinx DS182, but it is not AEC-Q100 certified. It lacks automotive-specific reliability testing, failure rate reporting, and qualification documentation required for automotive ECUs or ADAS modules.
What is the block RAM capacity of XC7K325T-1FB900I in usable bits?
The XC7K325T-1FB900I provides 16.3 Mb of total block RAM, composed of 720 BRAM primitives each configurable as 36 Kb dual-port RAM or 18 Kb single-port RAM. Usable capacity depends on configuration: 16,320 kbits (2,040 KB) in true dual-port mode with independent read/write clocks and addresses.
XC7K325T-1FB900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-1FB900I FAQ
1.How can I place an order for XC7K325T-1FB900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FB900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FB900I reliable?
The price and inventory of XC7K325T-1FB900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FB900I is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FB900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FB900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-1FB900I?
XC7K325T-1FB900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-1FB900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FB900I?
For technical support, including XC7K325T-1FB900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FB900I requirements.
6.How does Aetrix verify that XC7K325T-1FB900I is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FB900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FB900I meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FB900I?
All XC7K325T-1FB900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FB900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FB900I part is unused and in its original packaging.
Return procedure for XC7K325T-1FB900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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