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AMD XC7K325T-1FBG676C
- Part No.:
- XC7K325T-1FBG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FBG676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,039
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Product details
Overview
XC7K325T-1FBG676C from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 DSP slices, 16.3 Mb of block RAM, and 600 I/O pins in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package. It operates at -1 speed grade and supports transceivers up to 6.6 Gb/s for high-speed serial connectivity in reconfigurable computing systems.
For engineers reviewing the XC7K325T-1FBG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, transceiver lane count and rate, I/O voltage support (1.2 V to 3.3 V), and thermal performance in compact PCB layouts.
Technical Context
The XC7K325T-1FBG676C implements a fully programmable architecture based on 28 nm HKMG process technology, featuring SelectIO™ technology with support for LVDS, SSTL, HSTL, and TMDS signaling standards. It integrates 24 multi-gigabit GTs (GTP/GTX transceivers) with built-in PRBS generators/checkers and elastic buffers.
Configuration is performed via JTAG, Master SPI, or Slave SelectMAP interfaces, and it supports partial reconfiguration. The device includes hardened IP blocks for PCIe Gen2 x8, Gigabit Ethernet MAC, and AXI interconnect infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - determines maximum combinational/sequential logic density for custom RTL implementation |
| DSP Slices | 1,452 - enables high-throughput arithmetic operations for signal processing and math-intensive algorithms |
| Block RAM | 16.3 Mb - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory latency |
| Transceivers | 24 × 6.6 Gb/s GT - supports protocols including PCIe Gen2, SATA, and CPRI with embedded clock data recovery |
| I/O Pins | 600 - configurable across 18 banks with independent VCCO per bank for mixed-voltage interface design |
| Speed Grade | -1 - specifies maximum operating frequency and timing closure margin for synthesis and place-and-route |
Pinout & Package
XC7K325T-1FBG676C is housed in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration logic, SelectIO banks, and transceiver analog circuitry |
| VCCO | I/O bank supply | Configurable per bank (1.2–3.3 V) to match interfaced peripherals' voltage levels |
| M0–M2 | Mode pins | Set configuration mode at power-up (e.g., Master SPI, JTAG, or Slave SelectMAP) |
| INIT_B | Status indicator | Open-drain output signaling configuration status; pulled high during valid bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in mission-critical applications |
| PCIe Gen2 x8 Hard IP | Reduces RTL integration effort and ensures compliance with PCIe electrical and protocol specifications |
| SelectIO™ Technology | Allows simultaneous use of multiple I/O standards (LVDS, SSTL, HSTL) across different banks for heterogeneous interface consolidation |
| AXI Interconnect Infrastructure | Provides scalable, pipelined, and configurable on-chip bus architecture for SoC-style subsystem integration |
Applications
| Wireless Baseband Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding in LTE/5G remote radio units. IC Role / Device Role / Timing Role: Programmable baseband processor implementing PHY-layer functions with deterministic latency control. Use Value: 24 GT transceivers enable direct CPRI/eCPRI links to RF front-ends; 1,452 DSP slices accelerate FFT and filtering operations. | Use Scenario: Multi-channel oscilloscopes and spectrum analyzers requiring synchronized sampling at >1 GS/s. IC Role / Device Role / Timing Role: Timing controller and real-time data preprocessor managing ADC interfaces and buffer management. Use Value: 600 I/O pins support parallel LVDS ADC inputs; block RAM enables deep sample buffering before host transfer. |
| Industrial Machine Vision | Avionics Data Concentrators |
Use Scenario: High-resolution image stitching and defect detection on automated production lines. IC Role / Device Role / Timing Role: Image pipeline accelerator handling Bayer demosaicing, color correction, and edge detection in hardware. Use Value: Logic cell count supports concurrent multi-camera sensor processing; SelectIO™ supports MIPI CSI-2 and SLVS-EC interfaces. | Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 message aggregation in flight control systems. IC Role / Device Role / Timing Role: Protocol-aware bridge and scheduler managing time-triggered communication across avionics networks. Use Value: Hardened PCIe and Ethernet MAC blocks simplify certification-compliant network interface design; -1 speed grade ensures timing margin under temperature variation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K410T-1FBG676C | Higher logic capacity (407,200 LCs), same package and speed grade | Better suited for larger designs requiring additional LUTs and DSP slices without changing PCB layout | Select when design growth headroom or future scalability is required beyond XC7K325T-1FBG676C capacity |
| XCKU035-1FBVA676C | Kintex UltraScale architecture; higher transceiver count (40 × 12.5 Gb/s), different pinout and power delivery requirements | Targeted at next-generation protocols (PCIe Gen3, 10G Ethernet) where bandwidth exceeds XC7K325T-1FBG676C limits | Choose for new designs needing higher serial bandwidth and lower power per Gb/s, accepting board redesign effort |
Compared with XC7K325T-1FBG676C, XC7K410T-1FBG676C offers identical footprint and timing but greater logic headroom, while XCKU035-1FBVA676C delivers higher transceiver performance at the cost of incompatible packaging and revised power architecture.
Availability
XC7K325T-1FBG676C is available at Aetrix Electronics and suitable for wireless infrastructure, test & measurement equipment, and industrial vision systems requiring stable component supply across long product lifecycles.
Supply support for XC7K325T-1FBG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and AI acceleration.
The Kintex-7 family was designed for cost-optimized, high-bandwidth applications such as communications infrastructure, video processing, and scientific instrumentation where balanced logic, I/O, and transceiver resources are critical.
FAQ
What is the maximum transceiver data rate supported by XC7K325T-1FBG676C?
The XC7K325T-1FBG676C supports a maximum transceiver data rate of 6.6 Gb/s per GT lane. This enables compliance with PCIe Gen2, SATA III, and CPRI protocols. All 24 GT transceivers in the XC7K325T-1FBG676C operate within this specification under recommended thermal and voltage conditions.
Does XC7K325T-1FBG676C support partial reconfiguration?
Yes, XC7K325T-1FBG676C supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic replacement of logic modules while the rest of the design remains operational. The feature is implemented in hardware and verified for use in aerospace and telecom applications where continuous operation is required.
What I/O standards are supported by XC7K325T-1FBG676C?
XC7K325T-1FBG676C supports LVDS, SSTL, HSTL, TMDS, and differential signaling standards via its SelectIO™ technology. Each of the 18 I/O banks can be independently configured for voltage levels from 1.2 V to 3.3 V, enabling mixed-standard interface design without level-shifting components.
What configuration modes does XC7K325T-1FBG676C support?
XC7K325T-1FBG676C supports JTAG, Master SPI, and Slave SelectMAP configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstreams can be stored in external SPI flash and loaded automatically, or streamed via PCIe or other host interfaces using custom logic.
Is XC7K325T-1FBG676C qualified for industrial temperature operation?
Yes, the "C" suffix in XC7K325T-1FBG676C indicates commercial temperature range (0 °C to +85 °C ambient). For extended industrial operation (-40 °C to +100 °C), the "I" variant (XC7K325T-1FBG676I) is specified and qualified per AMD's industrial reliability standards.
XC7K325T-1FBG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K325T-1FBG676C FAQ
1.How can I place an order for XC7K325T-1FBG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FBG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FBG676C reliable?
The price and inventory of XC7K325T-1FBG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FBG676C is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FBG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FBG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-1FBG676C?
XC7K325T-1FBG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-1FBG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FBG676C?
For technical support, including XC7K325T-1FBG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FBG676C requirements.
6.How does Aetrix verify that XC7K325T-1FBG676C is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FBG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FBG676C meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FBG676C?
All XC7K325T-1FBG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FBG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FBG676C part is unused and in its original packaging.
Return procedure for XC7K325T-1FBG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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