AMD XC7K325T-1FBG676I

Overview

XC7K325T-1FBG676I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,460 DSP slices, and 16.4 Mb of block RAM, packaged in a 676-pin FCBGA with 0.8 mm pitch. It operates at -1 speed grade (1.0 ns CLB delay) and supports transceivers up to 13.1 Gb/s for high-speed serial interface applications in radar signal processing.

For engineers reviewing the XC7K325T-1FBG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), transceiver lane count (16 GTs), voltage supply requirements (1.0V core, 1.8V/2.5V I/O), and thermal design power (14.5 W typical).

Technical Context

The XC7K325T-1FBG676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and integrated PCI Express Gen2 x8 endpoint capability. It includes 16 multi-gigabit transceivers supporting protocols including CPRI, SRIO, and 10GBASE-R.

Configuration is performed via JTAG or master/slave SPI/BPI modes, with support for partial reconfiguration and bitstream encryption using AES-256. The device integrates hardened clock management tiles (CMTs) with MMCM and PLL blocks for low-jitter clock synthesis and phase alignment.

Key Specifications

Pinout & Package

XC7K325T-1FBG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm ball pitch, 27 × 27 mm body size, and edge-aligned I/O banks supporting multiple voltage standards (1.2V–3.3V).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Compared with XC7K325T-1FBG676I, XCKU040 offers higher bandwidth and scalability for next-gen infrastructure, while XC7K160T provides pin-compatible resource reduction for legacy Kintex-7 designs-both retain identical I/O voltage flexibility and configuration security features.

Availability

XC7K325T-1FBG676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, 5G wireless baseband, and industrial machine vision applications requiring stable component supply across long-lifecycle programs.

Supply support for XC7K325T-1FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for datacenter, aerospace, and industrial markets.

The Kintex-7 family was designed for balanced performance, power, and cost in high-throughput signal processing and communication infrastructure applications.

FAQ

What is the maximum transceiver data rate supported by XC7K325T-1FBG676I?

The XC7K325T-1FBG676I supports multi-gigabit transceivers with a maximum line rate of 13.1 Gb/s per GT lane. This enables compliance with CPRI Option 10, 10GBASE-R, and SRIO Gen2 protocols. The transceiver architecture includes built-in clock data recovery (CDR) and elastic buffers to maintain signal integrity across PCB traces and connectors.

Does XC7K325T-1FBG676I support partial reconfiguration?

Yes, XC7K325T-1FBG676I fully supports partial reconfiguration through Vivado Design Suite. This allows runtime modification of specific logic regions without resetting the entire device. Use cases include protocol adaptation in test equipment or algorithm updates in deployed radar systems-all while maintaining continuous I/O and memory operation.

What configuration modes are available for XC7K325T-1FBG676I?

XC7K325T-1FBG676I supports JTAG, master SPI, slave SPI, master BPI, and slave BPI configuration modes. Configuration bitstreams can be loaded from external flash (e.g., Micron MT25QL) or streamed from a microcontroller. The device also supports fallback configuration and dual-boot for field-upgradable reliability.

Is XC7K325T-1FBG676I qualified for industrial temperature operation?

Yes, the "I" suffix in XC7K325T-1FBG676I denotes industrial temperature grade (-40°C to +100°C junction). Thermal design must account for 14.5 W typical power dissipation using appropriate heatsinking and airflow. The device meets JEDEC JESD22-A104 reliability testing for extended temperature cycling.

What clock management resources does XC7K325T-1FBG676I include?

XC7K325T-1FBG676I integrates eight Clock Management Tiles (CMTs), each containing one MMCM and one PLL. These provide fine-grained clock synthesis, phase shifting, duty-cycle correction, and jitter filtering. They support output frequencies from 10 MHz to 810 MHz and enable precise timing alignment across high-speed I/O and transceiver domains.