AMD XC7K325T-1FBG900I

Overview

XC7K325T-1FBG900I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 DSP slices, and 16.3 Mb of block RAM, configured in a 900-pin Flip-Chip Ball Grid Array (FCBGA) package for high-speed serial interface and embedded vision applications.

For engineers reviewing the XC7K325T-1FBG900I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), transceiver line rates up to 12.5 Gb/s, and -1 speed grade timing performance at industrial temperature range (-40°C to +100°C).

Technical Context

The XC7K325T-1FBG900I implements a 28 nm HKMG process-based architecture with SelectIO technology supporting single-ended and differential standards including LVDS, TMDS, and HSTL. It integrates 24 GTX transceivers with built-in PRBS generators and checkers for serial link validation.

Configuration is performed via Master SPI or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device supports partial reconfiguration and includes hardened PCIe Gen2 x8 endpoint and root port blocks.

Key Specifications

Pinout & Package

XC7K325T-1FBG900I is housed in a 900-pin Flip-Chip BGA (FCBGA) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-density PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based high-performance logic acceleration applications.

Compared with XC7K325T-1FBG900I, the XCKU040 offers higher transceiver speed and logic density but requires toolchain migration and lacks integrated PCIe blocks; the XC7K160T provides identical architecture and tool compatibility at lower capacity and cost, enabling scalable design reuse.

Availability

XC7K325T-1FBG900I is available at Aetrix Electronics and suitable for medical imaging systems, 5G wireless infrastructure, and industrial machine vision applications requiring stable component supply across long product lifecycles.

Supply support for XC7K325T-1FBG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through high-performance FPGAs, adaptive SoCs, and software-defined platforms.

The Kintex-7 family was engineered for balanced performance, power efficiency, and cost in high-throughput signal processing and communications applications, targeting systems needing robust serial connectivity and deterministic logic execution.

FAQ

What is the maximum supported transceiver line rate for XC7K325T-1FBG900I?

The XC7K325T-1FBG900I supports GTX transceivers with a maximum line rate of 12.5 Gb/s. This capability enables compliance with JESD204B, CPRI, and 10GBASE-R protocols. Each GTX channel includes built-in clock correction and elastic buffer functionality. The -1 speed grade ensures reliable operation at this rate within the industrial temperature range.

Does XC7K325T-1FBG900I include hardened PCIe Gen2 support?

Yes, XC7K325T-1FBG900I integrates hardened PCIe Gen2 x8 endpoint and root port blocks. These blocks reduce logic resource consumption and simplify timing closure compared to soft IP implementations. They support both 2.5 GT/s and 5.0 GT/s signaling and include AXI4 streaming interfaces for direct connection to user logic.

What configuration modes are supported by XC7K325T-1FBG900I?

XC7K325T-1FBG900I supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is commonly used for fast, single-image loading from flash memory, while JTAG supports debugging and field updates without external memory dependency.

Is XC7K325T-1FBG900I qualified for industrial temperature operation?

Yes, XC7K325T-1FBG900I is rated for industrial temperature operation from -40°C to +100°C. This qualification applies to the -1 speed grade and the FBG900 package variant. Thermal performance is validated per JEDEC JESD22-A104 standard, and the device includes on-die temperature monitoring circuitry accessible via XADC.

Can XC7K325T-1FBG900I perform partial reconfiguration?

Yes, XC7K325T-1FBG900I supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logic modules while the rest of the design remains operational. Use cases include runtime algorithm switching in radar systems or protocol adaptation in communication gateways without system reset.