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AMD XC7K325T-1FF676I

Part No.:
XC7K325T-1FF676I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BBGA, FCBGA
Datasheet:
AetrixXC7K325T-1FF676I.pdf
Description:
IC FPGA 400 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,304

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Product details

Overview

XC7K325T-1FF676I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 DSP slices, and 16.4 Mb of block RAM, configured in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FF676) package for high-speed serial interface and embedded processing applications.

For engineers reviewing the XC7K325T-1FF676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, and -40°C to +100°C industrial temperature grade operation.

Technical Context

The XC7K325T-1FF676I implements a heterogeneous architecture with programmable logic fabric, hardened 36-bit multipliers, and integrated PCIe Gen2 x8 endpoint blocks. It supports JTAG and SelectMAP configuration modes and includes dedicated clock management tiles with MMCM and PLL resources.

This device integrates 24 transceivers supporting protocols including SATA, SRIO, and CPRI at up to 13.1 Gb/s per lane, and features 500 user I/Os compliant with LVDS, LVCMOS, and HSTL standards across 24 banks.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells326,080 - total configurable LUT/FF pairs for logic implementation
DSP Slices1,452 - fixed-point arithmetic units with 25×18 multipliers and 48-bit accumulators
Block RAM16.4 Mb - distributed as 720 × 36 Kb BRAM primitives for on-chip data buffering
Transceivers24 - supporting 600 Mb/s to 13.1 Gb/s line rates with built-in 8B/10B encoding
I/O Banks24 - each bank independently configurable for voltage and standard (e.g., LVDS, HSTL)
Operating Temp-40°C to +100°C - qualified for industrial environment deployment without derating

Pinout & Package

XC7K325T-1FF676I is housed in a 676-pin Flip-Chip Fine-Pitch BGA (FF676) package with 25 mm × 25 mm body size, 1.0 mm ball pitch, and thermal pad for enhanced power dissipation.

Pin/TerminalCircuit RoleDesign Meaning
G18VCCINT1.0 V core supply input for FPGA logic fabric and CLBs
A15VCCAUX1.8 V auxiliary supply for configuration, clocking, and transceiver reference
P20VCCO_131.2–3.3 V I/O bank 13 output supply, set per bank
R19MRActive-low master reset input controlling global initialization sequence
T14CLK_IN1_M2CDedicated single-ended clock input for MMCM clock management tile
Y16GTGREFCLK0Reference clock input for transceiver tile 0, supports AC-coupled differential signaling

Key Features

FeatureDesign Value
PCIe Gen2 x8 EndpointHard IP block enabling direct host connection without soft-core overhead or latency penalty
MMCM + PLL Clock ManagementTwo independent clock synthesis resources per tile, supporting jitter filtering and frequency translation
AXI Interconnect SupportNative integration with AXI4/AXI4-Lite protocols for seamless SoC subsystem interconnection
Partial ReconfigurationRuntime logic module swapping without full device reboot or system interruption
Configuration SecurityBitstream encryption via AES-256 and HMAC authentication to prevent cloning or tampering

Applications

Wireless Baseband ProcessingMedical Imaging Acceleration

Use Scenario: Real-time FFT, channel estimation, and MIMO signal processing in LTE/5G remote radio heads.

IC Role / Device Role / Timing Role: Programmable baseband processor handling parallel data paths and low-latency control loops.

Use Value: 1,452 DSP slices enable concurrent 2,048-point FFTs at >100 MSPS with deterministic timing.

Use Scenario: High-throughput image reconstruction in CT and MRI systems using iterative algorithms.

IC Role / Device Role / Timing Role: Hardware-accelerated compute engine interfacing with DDR3 memory and ADC/DAC peripherals.

Use Value: 16.4 Mb block RAM supports dual-frame buffering while maintaining sub-millisecond latency for real-time feedback.

Industrial Machine VisionTest & Measurement Equipment

Use Scenario: Sub-pixel object detection and classification on high-resolution camera streams in automated inspection.

IC Role / Device Role / Timing Role: Vision pipeline controller managing sensor interface, preprocessing, and neural network inference kernels.

Use Value: 500 user I/Os allow simultaneous connection to multiple CMOS sensors and high-speed serial links (e.g., Camera Link HS).

Use Scenario: Multi-channel digital oscilloscope with 12-bit, 1 GS/s sampling and real-time waveform analysis.

IC Role / Device Role / Timing Role: Acquisition controller synchronizing ADCs, managing deep memory buffers, and executing trigger logic.

Use Value: 24 transceivers support 8-lane PCIe Gen2 host interface for sustained 4 GB/s data streaming to PC.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU040-2FFVA1156IUltraScale architecture, higher logic density (504K LC), 25.8 Gb/s transceivers, larger FFVA1156 packageBetter suited for next-gen 5G massive MIMO and AI inference where bandwidth and logic scale exceed Kintex-7 limitsSelect XCKU040-2FFVA1156I when migrating beyond 13.1 Gb/s serial I/O or requiring >326K logic cells
XC7K160T-1FF676ISame Kintex-7 family, reduced logic (162K LC), fewer DSP slices (600), same FF676 package and pin compatibilityTargeted for cost-sensitive designs with lower algorithmic complexity and reduced memory bandwidth needsChoose XC7K160T-1FF676I for footprint-compatible down-bin option with identical thermal and layout constraints

Compared with XC7K325T-1FF676I, XCKU040-2FFVA1156I delivers higher serial bandwidth and logic capacity but requires PCB redesign due to larger package and different power delivery; XC7K160T-1FF676I offers identical form factor and thermal profile at lower performance tier, enabling scalable design reuse.

Availability

XC7K325T-1FF676I is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging systems, and industrial automation requiring stable component supply across extended product lifecycles.

Supply support for XC7K325T-1FF676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA and heterogeneous processing platforms.

The Kintex-7 family was designed for high-performance, cost-optimized applications demanding balanced logic, DSP, memory, and I/O resources - particularly in communications, video, and embedded vision.

FAQ

What is the maximum transceiver line rate supported by XC7K325T-1FF676I?

The XC7K325T-1FF676I supports transceiver line rates from 600 Mb/s up to 13.1 Gb/s per lane. This range enables compliance with protocols including PCIe Gen2, SATA III, and CPRI. The 13.1 Gb/s limit applies to all 24 transceivers under industrial temperature conditions and is verified in AMD's DS182 datasheet revision 2.7.

Does XC7K325T-1FF676I support partial reconfiguration?

Yes, XC7K325T-1FF676I supports partial reconfiguration through its bitstream loading architecture and dedicated ICAP interface. This capability allows dynamic logic module updates during operation without resetting the entire FPGA. Implementation requires Vivado Design Suite 2018.3 or later and adherence to AMD's UG904 guidelines for modular design partitioning.

What configuration modes are available for XC7K325T-1FF676I?

XC7K325T-1FF676I supports JTAG, Master SPI, Slave SPI, and SelectMAP configuration modes. JTAG is used for debugging and programming; SPI modes interface with serial flash; SelectMAP enables high-speed parallel loading from microcontrollers or processors. All modes are electrically defined in the device's configuration user guide UG470.

Is XC7K325T-1FF676I pin-compatible with other Kintex-7 devices in FF676 package?

XC7K325T-1FF676I shares the same FF676 package footprint and pinout with XC7K160T-1FF676I and XC7K410T-1FF676I. Power, ground, configuration, and I/O pin assignments are consistent across these variants. However, unused pins may differ in function assignment, and transceiver placement varies between speed grades and densities per UG475.

What is the operating junction temperature range for XC7K325T-1FF676I?

The XC7K325T-1FF676I is rated for an industrial temperature range of -40°C to +100°C case temperature. Its maximum allowable junction temperature is 125°C, with thermal design guidance provided in AMD's UG475 and XPE power estimator tool. Thermal performance depends on board layout, airflow, and heatsink usage.

XC7K325T-1FF676I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex®-7
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
25475
Number of Logic Elements/Cells:
326080
Total RAM Bits:
16404480
Number of I/O:
400
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)

XC7K325T-1FF676I FAQ

1.How can I place an order for XC7K325T-1FF676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7K325T-1FF676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7K325T-1FF676I reliable?

The price and inventory of XC7K325T-1FF676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FF676I is usually 5 days.

3.What payment methods are accepted for XC7K325T-1FF676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FF676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7K325T-1FF676I?

XC7K325T-1FF676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7K325T-1FF676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7K325T-1FF676I?

For technical support, including XC7K325T-1FF676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FF676I requirements.

6.How does Aetrix verify that XC7K325T-1FF676I is sourced from the original manufacturer or authorized distributors?

All XC7K325T-1FF676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FF676I meets industry standards.

7.What is the process for return or replacement of XC7K325T-1FF676I?

All XC7K325T-1FF676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FF676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7K325T-1FF676I part is unused and in its original packaging.

Return procedure for XC7K325T-1FF676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7K325T-1FF676I Tags

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