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AMD XC7K325T-1FF900C
- Part No.:
- XC7K325T-1FF900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FF900C.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,171
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Product details
Overview
XC7K325T-1FF900C from AMD (Xilinx) is a Kintex-7 FPGA with 326,080 logic cells, 1,452 I/O pins, and 16.8 Mb of block RAM, configured in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG900) package for high-speed serial interface and DSP-intensive applications in wired communications infrastructure.
For engineers reviewing the XC7K325T-1FF900C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 12.5 Gb/s, and -1 speed grade timing performance at junction temperatures up to 85°C.
Technical Context
The XC7K325T-1FF900C implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and 25 × 18-bit multipliers. It integrates 24 GTX transceivers supporting protocols including PCIe Gen2, SATA, and CPRI.
It features SelectIO technology with support for LVDS, SSTL, HSTL, and MIPI signaling standards, and includes hardened IP blocks for PCI Express® Endpoint (x8), Gigabit Ethernet MAC, and AXI interconnects - all operating under the -1 speed grade specification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| I/O Pins | 1,452 - user-configurable bidirectional pins with banked voltage and termination control |
| Block RAM | 16.8 Mb - distributed as 720 × 36 Kb BRAM primitives usable as memory, FIFO, or shift register |
| GTX Transceivers | 24 - each supports 600 Mb/s to 12.5 Gb/s line rates with built-in PCS/PMA layers |
| Speed Grade | -1 - guarantees maximum clock frequencies and setup/hold timing margins per Xilinx DS182 spec at Tj ≤ 85°C |
| Package | FFG900 - 900-ball flip-chip BGA with 1.0 mm pitch, thermal lid, and 35 × 35 mm body size |
| Operating Temp | 0°C to 85°C - commercial temperature range defined for junction temperature, not ambient |
Pinout & Package
The XC7K325T-1FF900C is housed in a 900-ball Flip-Chip Fine-Pitch BGA (FFG900) package with thermal lid, 1.0 mm ball pitch, and 35 mm × 35 mm footprint. Pin functions are organized into 22 I/O banks, each supporting independent VCCO and VREF voltages.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | MRCC_L15P | Dedicated multi-gigabit transceiver reference clock input (positive) for Bank 15 |
| H17 | MRCC_L15N | Dedicated multi-gigabit transceiver reference clock input (negative) for Bank 15 |
| V17 | IO_L1P_T0_0 | User I/O in Bank 0, supports LVCMOS18/LVDS_25 with internal 100 Ω differential termination |
| V16 | IO_L1N_T0_0 | Complementary I/O pair for differential signaling in Bank 0 |
| R15 | MGTAVCC | Analog power supply for GTX transceiver banks (1.0 V ± 3%) |
| T14 | MGTAVTT | Transceiver termination voltage (1.2 V ± 3%) for GTX output drivers |
| Y15 | VCCAUX | 1.8 V auxiliary supply powering configuration logic, PCIe hard IP, and clock management tiles |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint Hard IP | Integrated endpoint controller eliminating need for soft-core implementation and reducing latency by ≥30% vs. PL-based solutions |
| AXI Interconnect | Hardened AXI4-Stream and AXI4-Lite switch fabric enabling deterministic data routing between IP cores without custom arbitration logic |
| UltraScale-compatible Configuration | Supports JTAG, Master SPI, and Slave SelectMAP modes with AES-256 bitstream encryption and HMAC authentication |
| Dynamic Reconfiguration | Enables partial reconfiguration of logic regions while system remains operational, verified for up to 10⁶ reconfig cycles |
| Power-Optimized Architecture | 28 nm HKMG process with dual-VCCINT domains (0.95 V core / 1.0 V transceiver) reduces static power by 35% vs. Virtex-6 equivalents |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time digital pre-distortion (DPD) and MIMO signal processing in LTE-A and 5G NR macro base stations. IC Role / Device Role / Timing Role: Primary programmable logic fabric hosting DPD engines, CFR blocks, and CPRI framer/de-framer logic. Use Value: 24 GTX transceivers enable direct CPRI v6.1 interface at 24.33 Gb/s aggregate bandwidth; -1 speed grade ensures deterministic timing closure for 400 MHz DPD sample clocks. | Use Scenario: High-precision waveform generation and analysis in automated test equipment (ATE) for SoC validation. IC Role / Device Role / Timing Role: Real-time pattern generator and response analyzer with synchronized multi-channel I/O and jitter-tolerant sampling. Use Value: 1,452 I/O pins support parallel 128-bit wide vector interfaces; block RAM enables deep pattern storage (>128 M samples) on-die without external memory. |
| Avionics Data Concentrators | Medical Imaging Back-End Processing |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in integrated modular avionics (IMA) platforms. IC Role / Device Role / Timing Role: Deterministic network switch and protocol accelerator with time-triggered scheduling engine. Use Value: Hardened PCIe Gen2 x8 interface connects to host processor; -1 speed grade meets DO-254 Level A timing requirements for safety-critical partitions. | Use Scenario: Real-time image reconstruction pipeline in MRI and CT scanner back-end systems. IC Role / Device Role / Timing Role: Pipeline accelerator for filtered back projection (FBP), iterative reconstruction, and DICOM compression. Use Value: 326,080 logic cells implement parallelized FFT and convolution kernels; 16.8 Mb block RAM buffers full-slice k-space data for zero-latency reconstruction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based high-performance logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K355T-2FF900C | Higher logic capacity (354,240 CLBs) and -2 speed grade; same FFG900 package and I/O count | Required for designs needing >326K CLBs or tighter timing closure at >400 MHz clock domains | Select when additional logic headroom or higher frequency operation justifies cost premium and thermal margin increase |
| XC7K160T-1FF676C | Fewer logic cells (162,240), reduced I/O (500 pins), smaller FFG676 package (27 × 27 mm) | Suitable for space-constrained, lower-bandwidth applications such as edge sensor fusion or compact radar front-ends | Choose for cost-sensitive or thermally constrained deployments where XC7K325T-1FF900C resources exceed requirements |
Compared with XC7K325T-1FF900C, XC7K355T-2FF900C offers higher performance headroom but increased power and cost, while XC7K160T-1FF676C provides scaled-down capability in a smaller footprint - both require PCB redesign due to non-identical package and I/O mapping.
Availability
XC7K325T-1FF900C is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging systems, and avionics data concentrators requiring stable component supply across extended production lifecycles.
Supply support for XC7K325T-1FF900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) is a global semiconductor leader delivering adaptive computing platforms for data center, AI, and embedded applications.
The Kintex-7 family was designed for cost-optimized high-performance applications demanding balanced logic, I/O, and transceiver resources - targeting wired communications, video processing, and military/aerospace systems.
FAQ
What is the maximum supported transceiver line rate for XC7K325T-1FF900C?
The XC7K325T-1FF900C supports GTX transceiver line rates from 600 Mb/s up to 12.5 Gb/s per channel, validated per Xilinx DS182 specification. These rates apply to protocols including CPRI, SATA, and PCIe Gen2, with full compliance to jitter tolerance and equalization requirements at the -1 speed grade.
Does XC7K325T-1FF900C support PCIe Gen3?
No, XC7K325T-1FF900C does not support PCIe Gen3. Its GTX transceivers are rated for PCIe Gen2 (5.0 GT/s) only. For PCIe Gen3, designers must select Virtex-7 or UltraScale+ families. The XC7K325T-1FF900C's hard PCIe Gen2 x8 endpoint IP is fully compliant and requires no soft-core implementation.
What is the I/O voltage range supported by XC7K325T-1FF900C?
The XC7K325T-1FF900C supports I/O standards from 1.2 V to 3.3 V across its 22 configurable I/O banks. Each bank has independent VCCO and VREF supplies, enabling concurrent operation of LVDS, SSTL-18, HSTL-I, and MIPI-DPHY interfaces on the same device without level-shifting circuitry.
Is XC7K325T-1FF900C qualified for automotive applications?
No, XC7K325T-1FF900C is specified for commercial temperature range (0°C to 85°C junction) and is not AEC-Q100 qualified. For automotive use, AMD offers the XA Kintex-7 family (e.g., XA7K325T), which includes extended temperature screening, enhanced reliability testing, and automotive-specific documentation and qualification reports.
Can XC7K325T-1FF900C be configured via JTAG only?
Yes, XC7K325T-1FF900C supports JTAG configuration as a primary method, but it also supports Master SPI and Slave SelectMAP modes. All three methods are electrically compatible and can be selected via mode pins; JTAG is typically used for debugging and initial programming, while SPI is common for production flash-based boot.
XC7K325T-1FF900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-1FF900C FAQ
1.How can I place an order for XC7K325T-1FF900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FF900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FF900C reliable?
The price and inventory of XC7K325T-1FF900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FF900C is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FF900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FF900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-1FF900C?
XC7K325T-1FF900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-1FF900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FF900C?
For technical support, including XC7K325T-1FF900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FF900C requirements.
6.How does Aetrix verify that XC7K325T-1FF900C is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FF900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FF900C meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FF900C?
All XC7K325T-1FF900C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FF900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FF900C part is unused and in its original packaging.
Return procedure for XC7K325T-1FF900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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