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AMD XC7K325T-1FF900I
- Part No.:
- XC7K325T-1FF900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FF900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,314
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Product details
Overview
XC7K325T-1FF900I from AMD (formerly Xilinx) is a Kintex-7 FPGA with 326,080 logic cells, 1,452 I/O pins, and 1,350 DSP slices, fabricated on 28 nm HKMG process technology. It operates at -1 speed grade (1.0 ns CLB delay), supports DDR3 memory interfaces up to 1,866 Mbps, and is used in high-throughput packet processing systems requiring deterministic latency and multi-gigabit transceivers.
For engineers reviewing the XC7K325T-1FF900I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver count (16 GTP/GTX lanes), thermal design power (15.5 W typical), and configuration interface compatibility (SPIx4, BPI, SelectMAP).
Technical Context
The XC7K325T-1FF900I implements a heterogeneous architecture with Configurable Logic Blocks (CLBs), Block RAM (28,620 KB), UltraScale-compatible clock management tiles (CMTs), and integrated 6.6 Gbps GTX transceivers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.
Its -1 speed grade guarantees timing closure at 640 MHz for register-to-register paths in worst-case industrial temperature (-40°C to +100°C) and 1.0 V core supply conditions. The FF900 package enables dense board routing with 16 banks supporting independent I/O standards per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - determines maximum combinational/sequential logic capacity for RTL implementation |
| I/O Pins | 1,452 - supports high-pin-count parallel interfaces (e.g., DDR3 x72, PCIe x16) |
| DSP Slices | 1,350 - enables concurrent fixed/floating-point operations for signal processing pipelines |
| GTX Transceivers | 16 lanes @ 6.6 Gbps - provides SerDes connectivity for SFP+, CPRI, and JESD204B links |
| Block RAM | 28,620 KB - delivers on-chip memory for FIFOs, buffers, and lookup tables without external DRAM |
| Speed Grade | -1 - specifies maximum operating frequency under industrial temperature and voltage corners |
| Package | FF900 - 900-pin flip-chip fine-pitch BGA with 1.0 mm pitch and 35×35 mm body |
Pinout & Package
XC7K325T-1FF900I is housed in a 900-pin flip-chip BGA (FF900) with 16 I/O banks, each supporting independent VCCO and VREF settings. Thermal pad is exposed on underside for heatsink attachment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Synchronizes master SPI configuration mode; requires 50 MHz max during startup |
| DONE | Configuration Status Output | Drives high when bitstream loading completes and device enters user mode |
| INIT_B | Configuration Initialization | Active-low open-drain signal indicating configuration controller readiness |
| M0–M2 | Mode Selection Inputs | Set boot source (SPI, BPI, or SelectMAP) and configuration width (x1/x2/x4) |
| GTxRXP/GTxTXP | Differential Transceiver Pair | AC-coupled high-speed serial lanes supporting PCIe Gen2 and SATA protocols |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime |
| AXI4-Stream Interface Integration | Provides standardized streaming data path between IP blocks, simplifying interconnect design |
| Multi-Voltage I/O Banks | Allows simultaneous interfacing to 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals |
| Integrated Clock Management | Includes MMCM and PLL with sub-100 fs jitter for high-fidelity clock synthesis |
| UltraFast Carry Chain | Delivers 0.22 ns carry propagation delay for arithmetic-intensive datapaths |
Applications
| High-Speed Network Switching | Radar Signal Processing |
|---|---|
Use Scenario: Line-rate packet classification and forwarding in 10/40/100 GbE switches. IC Role / Device Role / Timing Role: FPGA fabric implements TCAM emulation, header parsing, and queue management logic with deterministic <100 ns latency. Use Value: 1,452 I/O pins enable full-width SerDes aggregation; 16 GTX lanes handle 16×10 GbE ports directly. | Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: XC7K325T-1FF900I executes FFT, CFAR, and STAP algorithms using 1,350 DSP slices and 28,620 KB BRAM. Use Value: -1 speed grade ensures timing closure at 640 MHz for critical loop iterations in hardware-accelerated signal chains. |
| Medical Imaging Backend | Industrial Machine Vision |
Use Scenario: Raw sensor data aggregation and preprocessing in digital PET/CT scanners. IC Role / Device Role / Timing Role: Interfaces to >64-channel ADCs via LVDS and performs real-time histogram equalization and noise filtering. Use Value: Multi-bank I/O supports mixed-voltage sensor interfaces; 28,620 KB BRAM buffers full-frame projection data. | Use Scenario: High-resolution image stitching and defect detection on automated optical inspection (AOI) platforms. IC Role / Device Role / Timing Role: Captures 12-bit 100 MP/s image streams via Camera Link or CoaXPress PHY and runs convolutional kernels in fabric. Use Value: GTX transceivers link to multiple high-bandwidth camera sensors; partial reconfiguration allows algorithm updates mid-inspection run. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, 504,000 logic cells, 28 GTY transceivers @ 12.5 Gbps, higher static power | Better suited for 100+ GbE line cards and coherent optical transport requiring >10 Gbps SerDes | Select when migrating to higher bandwidth or needing hardened PCIe Gen3/Gen4 controllers |
| XC7K160T-2FF676I | Same Kintex-7 family, 162,240 logic cells, 8 GTX lanes, lower I/O count (500 pins), -2 speed grade | Targeted at cost-sensitive embedded vision or motor control where full XC7K325T resources are unused | Choose for footprint-constrained designs with relaxed throughput requirements and lower TDP budget |
Compared with XC7K325T-1FF900I, XCKU040-2FFVA1156I offers higher transceiver bandwidth and logic density but increases PCB layer count and thermal complexity, while XC7K160T-2FF676I reduces cost and power at the expense of SerDes lane count and memory bandwidth-making it suitable only for scaled-down implementations.
Availability
XC7K325T-1FF900I is available at Aetrix Electronics and suitable for high-speed networking, radar signal processing, medical imaging backend, and industrial machine vision applications requiring stable component supply across extended product lifecycles.
Supply support for XC7K325T-1FF900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family was designed for high-performance, cost-sensitive applications demanding balanced logic, memory, and I/O resources-targeting wireline communications, video processing, and test equipment.
FAQ
What is the maximum supported DDR3 data rate for XC7K325T-1FF900I?
The XC7K325T-1FF900I supports DDR3 SDRAM interfaces up to 1,866 Mbps (933 MHz clock) using its MIG (Memory Interface Generator) IP core. This capability is validated across all 16 I/O banks with appropriate termination and layout rules, and applies specifically to the -1 speed grade under industrial temperature conditions.
Does XC7K325T-1FF900I support partial reconfiguration?
Yes, XC7K325T-1FF900I fully supports partial reconfiguration through Vivado Design Suite tools. This feature allows runtime swapping of logical modules-such as protocol engines or filter coefficients-without resetting the entire device, preserving state in unmodified regions of the FPGA fabric.
What configuration modes are supported by XC7K325T-1FF900I?
XC7K325T-1FF900I supports master SPI (x1/x2/x4), slave SPI, BPI (x16/x32), and SelectMAP (x8/x16/x32) configuration modes. Mode selection is controlled by M0–M2 pins at power-up, and all modes are compatible with industrial temperature operation and JTAG boundary-scan verification.
What is the thermal design power (TDP) of XC7K325T-1FF900I?
The typical thermal design power (TDP) of XC7K325T-1FF900I is 15.5 W under worst-case industrial conditions (100°C ambient, -1 speed grade, full utilization). Power estimates scale linearly with logic utilization and transceiver activity, and can be refined using Xilinx Power Estimator (XPE) with actual design netlist data.
Is XC7K325T-1FF900I pin-compatible with other Kintex-7 devices in FF900 package?
No, XC7K325T-1FF900I is not pin-compatible with other Kintex-7 devices in the FF900 package. While the package footprint is identical, I/O bank assignments, power pin locations, and transceiver placement differ across device densities-even within the same package option-requiring unique PCB layouts for each part number.
XC7K325T-1FF900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-1FF900I FAQ
1.How can I place an order for XC7K325T-1FF900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FF900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FF900I reliable?
The price and inventory of XC7K325T-1FF900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FF900I is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FF900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FF900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-1FF900I?
XC7K325T-1FF900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-1FF900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FF900I?
For technical support, including XC7K325T-1FF900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FF900I requirements.
6.How does Aetrix verify that XC7K325T-1FF900I is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FF900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FF900I meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FF900I?
All XC7K325T-1FF900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FF900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FF900I part is unused and in its original packaging.
Return procedure for XC7K325T-1FF900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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