AMD XC7K325T-1FFG676C

Overview

XC7K325T-1FFG676C from AMD (formerly Xilinx) is a Kintex-7 FPGA featuring 326,080 logic cells, 1,452 I/O pins, and 16.9 Mb of block RAM. It operates at -1 speed grade with 1.0V core voltage and supports PCIe Gen2 x8, DDR3-1866 memory interface, and 12.5 Gb/s transceivers. It is used in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC7K325T-1FFG676C datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count, I/O bank voltage flexibility, static timing analysis constraints, and thermal management for 676-pin FCBGA packaging.

Technical Context

The XC7K325T-1FFG676C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and DSP48E1 slices supporting 25 × 18-bit multiply-accumulate operations. It integrates 24 GTX transceivers capable of 0.6–12.5 Gb/s line rates and supports multi-gigabit serial protocols including CPRI, SATA, and SRIO.

It features SelectIO technology with support for LVDS, SSTL, HSTL, and TMDS signaling across 34 I/O banks, and includes integrated configuration interfaces (JTAG, SPI, BPI) and system monitoring (on-chip temperature/voltage sensors).

Key Specifications

Pinout & Package

The XC7K325T-1FFG676C is housed in a 676-ball Fine-Pitch Flip-Chip Ball Grid Array (FFG676) package with 1.0 mm ball pitch, thermal lid, and exposed thermal pad. Pin assignment follows Xilinx UG475 v1.14 for Kintex-7 pinout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC7K325T-1FFG676C, the XCKU040 offers higher transceiver speed and logic density at lower power per function, while the XC7VX485T delivers greater I/O count and extended thermal range-making each suitable for distinct scalability and environmental requirements.

Availability

XC7K325T-1FFG676C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, wireless baseband processing, and industrial machine vision requiring stable component supply across long-lifecycle programs.

Supply support for XC7K325T-1FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions through its acquisition of Xilinx in 2022. It focuses on high-performance, heterogeneous processing platforms.

The Kintex-7 family was designed by Xilinx (now AMD) for cost-optimized, high-bandwidth applications including wired communications, video processing, and aerospace systems.

FAQ

What is the maximum supported DDR3 memory interface speed for XC7K325T-1FFG676C?

The XC7K325T-1FFG676C supports DDR3-1866 (933 MHz) with a 16-bit or 32-bit interface per memory controller. This requires proper PCB layout adherence to Xilinx UG586 guidelines, including matched trace lengths and controlled impedance routing. The memory controller is implemented in PL fabric using MIG IP, and timing closure depends on speed grade (-1) and board-level signal integrity.

Does XC7K325T-1FFG676C include hard IP for PCIe Gen2?

Yes, XC7K325T-1FFG676C integrates dedicated hard PCIe Gen2 endpoint blocks supporting x1, x2, x4, and x8 configurations. These blocks provide AXI4 streaming interfaces and handle link training, TLP generation, and error reporting without consuming programmable logic resources. Configuration is managed via Xilinx Vivado tools using the PCIe IP core.

What thermal management is required for sustained operation of XC7K325T-1FFG676C?

XC7K325T-1FFG676C requires a thermal solution rated for ≤ 3.5 W total power dissipation under typical usage. Xilinx UG475 specifies a maximum junction temperature of 100°C. A 25 mm² copper thermal pad beneath the FFG676 package must connect to a heatsink or PCB internal plane. Thermal simulation using Xilinx Power Estimator (XPE) is mandatory before final layout.

Can XC7K325T-1FFG676C be configured via JTAG only, or are other methods supported?

XC7K325T-1FFG676C supports multiple configuration modes: JTAG (debug and programming), master SPI (fastest single-image load), slave SPI, and BPI parallel flash. Mode selection is controlled by M0–M2 pins at power-up. JTAG is sufficient for development and debugging, but production systems typically use SPI or BPI for autonomous boot without external programmers.

Is partial reconfiguration supported on XC7K325T-1FFG676C, and what tooling is required?

Yes, partial reconfiguration is fully supported on XC7K325T-1FFG676C using Xilinx Vivado Design Suite 2018.2 or later. It requires hierarchical design partitioning, checkpoint-based flow, and bitstream encryption for secure module swapping. PR enables runtime updates of functional modules-such as filter coefficients or protocol stacks-without resetting the entire XC7K325T-1FFG676C device.