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AMD XC7K325T-1FFG676CES9937
- Part No.:
- XC7K325T-1FFG676CES9937
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FFG676CES9937.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,585
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Product details
Overview
XC7K325T-1FFG676CES9937 from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 I/O pins, and 1,350 DSP slices, fabricated on 28 nm process technology and operating at -1 speed grade. It serves as a high-performance programmable logic fabric for reconfigurable digital signal processing in radar baseband subsystems.
For engineers reviewing the XC7K325T-1FFG676CES9937 datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver line rate (13.1 Gb/s), block RAM depth (36 Kb per BRAM), and thermal design power (19.2 W).
Technical Context
The XC7K325T-1FFG676CES9937 implements a heterogeneous architecture integrating programmable logic, 24 transceivers supporting JESD204B, PCIe Gen2 x8, and SATA 3.0, plus hardened IP including dual 10/100/1000 Ethernet MACs and AXI interconnect. It supports configuration via SPIx4, BPI, or JTAG and includes SEU mitigation features such as CRC checking and partial reconfiguration support.
This device targets deterministic low-latency processing in aerospace and defense systems, with guaranteed timing closure across -40°C to +100°C junction temperature range and support for IEEE 1149.1/1149.6 boundary-scan testing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total configurable LUT-based resources for combinatorial and sequential logic implementation |
| I/O Pins | 1,452 - user-configurable single-ended or differential I/Os with programmable drive strength and slew rate |
| DSP Slices | 1,350 - dedicated 25×18-bit multiplier-accumulator units for high-throughput arithmetic |
| Block RAM | 15,300 Kb - distributed memory capacity usable as true dual-port RAM or FIFO buffers |
| Transceiver Line Rate | 13.1 Gb/s - maximum serial data rate per GT lane supporting JESD204B subclass 1 |
| TDP | 19.2 W - thermal design power under typical high-activity conditions at junction temperature ≤100°C |
| Speed Grade | -1 - timing specification guaranteeing operation up to 640 MHz system clock in worst-case industrial temperature |
Pinout & Package
XC7K325T-1FFG676CES9937 is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm ball pitch and 27 × 27 array footprint. The package supports thermal dissipation via exposed thermal pad and complies with JEDEC MO-271AB mechanical standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC | Analog supply for transceiver banks | Must be regulated to 1.0 V ±3% with low-noise filtering; shared across all GTY transceivers |
| IO_L1P_T0_0 | User I/O bank 0 differential pair positive | Configurable as LVDS, TMDS, or RSDS; requires matched trace length to IO_L1N_T0_0 |
| CCLK | Configuration clock input | Drives internal configuration logic during master SPI mode; frequency ≤50 MHz |
| INIT_B | Configuration status output | Active-low open-drain signal indicating successful bitstream loading or error condition |
| PROGRAM_B | Configuration reset input | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2 x8 Endpoint | Reduces integration effort by eliminating need for external PHY or link-layer logic |
| JESD204B Subclass 1 Support | Enables deterministic latency and multi-device synchronization for ADC/DAC interfacing |
| Partial Reconfiguration Capability | Allows dynamic logic module swapping without full device reset or system interruption |
| SEU Detection and Correction | On-chip circuitry detects and corrects single-event upsets in configuration memory using Hamming code |
| Dual 1 GbE MACs | Provides integrated Ethernet connectivity without external MAC or PHY, reducing BOM count |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable digital front-end processor handling ADC sample ingestion, FIR filtering, and FFT computation. Use Value: Achieves <100 ns latency from ADC input to processed output using deterministic timing paths and hardwired DSP blocks. | Use Scenario: Multi-channel oscilloscope capturing at 1 GS/s with 12-bit resolution across 16 channels. IC Role / Device Role / Timing Role: Central aggregation and preprocessing unit synchronizing time-stamped samples from parallel ADCs. Use Value: Leverages 24 GTY transceivers to serialize 16 × 1 GSPS streams into four 4-lane JESD204B links at 13.1 Gb/s each. |
| Avionics Communication Hub | Test Equipment Controller |
Use Scenario: ARINC 429 and MIL-STD-1553B bus bridging in flight control computers. IC Role / Device Role / Timing Role: Protocol translation engine with deterministic jitter-controlled timing for safety-critical message forwarding. Use Value: Uses hardened Ethernet MACs and PCIe endpoint to interface with host processor while managing legacy avionics buses via soft-core peripherals. | Use Scenario: Automated test equipment executing parametric measurements on mixed-signal ICs. IC Role / Device Role / Timing Role: High-precision pattern generator and response analyzer with sub-nanosecond timing alignment. Use Value: Delivers 640 MHz system clock stability and <±50 ps skew across 1,452 I/Os for synchronized stimulus/response capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | UltraScale architecture, higher DSP count (1,920), lower TDP (14.5 W), but only 1,128 I/Os | Better suited for compute-dense workloads with less I/O bandwidth demand | Select when algorithmic throughput outweighs I/O channel count and thermal envelope is constrained |
| XC7VX485T-2FFG1157C | Virtex-7 family, larger logic capacity (485,760 CLBs), same 28 nm node, but no hardened 1 GbE MACs | Preferred for ultra-high gate-count designs requiring maximum LUT density over integrated networking | Choose when system-level Ethernet offload is handled externally and logic utilization exceeds 85% |
Compared with XC7K325T-1FFG676CES9937, XCKU040-2FFVA1156E offers superior computational efficiency per watt but reduced I/O scalability, while XC7VX485T-2FFG1157C delivers greater raw logic density at the cost of increased power and loss of integrated Ethernet functionality.
Availability
XC7K325T-1FFG676CES9937 is available at Aetrix Electronics and suitable for radar subsystems, avionics communication hubs, and high-speed test equipment requiring stable component supply and long-term production continuity.
Supply support for XC7K325T-1FFG676CES9937 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace applications.
The Kintex-7 FPGA product line was designed for cost-optimized high-performance applications demanding balanced logic, I/O, and DSP resources in harsh-environment deployments.
FAQ
What is the maximum supported transceiver line rate for XC7K325T-1FFG676CES9937?
The XC7K325T-1FFG676CES9937 supports a maximum transceiver line rate of 13.1 Gb/s per GTY lane. This enables compliance with JESD204B subclass 1, PCIe Gen2, and SATA 3.0 standards. The XC7K325T-1FFG676CES9937 achieves this performance across its 24 transceiver quads under industrial temperature conditions with proper power and signal integrity design.
Does XC7K325T-1FFG676CES9937 include hardened Ethernet MACs?
Yes, XC7K325T-1FFG676CES9937 integrates two hardened 10/100/1000 Mb/s Ethernet MACs compliant with IEEE 802.3. These MACs operate independently and support full-duplex operation with integrated statistics counters. The XC7K325T-1FFG676CES9937 does not include physical layer (PHY) circuitry, requiring external PHY devices for media interface.
What configuration modes are supported by XC7K325T-1FFG676CES9937?
XC7K325T-1FFG676CES9937 supports master SPI, slave SPI, master BPI, slave parallel, and JTAG configuration modes. Master SPI is commonly used for compact flash-based boot, while JTAG enables debugging and in-system programming. The XC7K325T-1FFG676CES9937 requires external non-volatile memory for storing configuration bitstreams unless using JTAG-based configuration.
Is XC7K325T-1FFG676CES9937 qualified for extended temperature operation?
Yes, XC7K325T-1FFG676CES9937 is rated for operation from -40°C to +100°C junction temperature, meeting extended industrial requirements. This qualification includes thermal cycling, humidity testing, and accelerated life testing per AMD's reliability standards. The XC7K325T-1FFG676CES9937 maintains full timing specification compliance across this range at speed grade -1.
What is the purpose of the MGTAVCC supply pin on XC7K325T-1FFG676CES9937?
The MGTAVCC pin supplies analog power to the GTY transceiver banks in XC7K325T-1FFG676CES9937. It must be regulated to 1.0 V ±3% with low-noise decoupling and isolated from digital supplies to maintain transceiver jitter performance below 0.3 ps RMS. The XC7K325T-1FFG676CES9937 specifies separate MGTAVCC routing for each transceiver quad to minimize crosstalk.
XC7K325T-1FFG676CES9937 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K325T-1FFG676CES9937 FAQ
1.How can I place an order for XC7K325T-1FFG676CES9937 through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FFG676CES9937 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FFG676CES9937 reliable?
The price and inventory of XC7K325T-1FFG676CES9937 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FFG676CES9937 is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FFG676CES9937?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FFG676CES9937 transactions.
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Once your XC7K325T-1FFG676CES9937 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FFG676CES9937?
For technical support, including XC7K325T-1FFG676CES9937 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FFG676CES9937 requirements.
6.How does Aetrix verify that XC7K325T-1FFG676CES9937 is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FFG676CES9937 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FFG676CES9937 meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FFG676CES9937?
All XC7K325T-1FFG676CES9937 units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FFG676CES9937, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FFG676CES9937 part is unused and in its original packaging.
Return procedure for XC7K325T-1FFG676CES9937:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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