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AMD XC7K325T-1FFG676I
- Part No.:
- XC7K325T-1FFG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FFG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,082
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Product details
Overview
XC7K325T-1FFG676I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,440 DSP slices, and 16.2 Mb of block RAM, packaged in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) with industrial temperature range (–40°C to +100°C). It serves as a high-performance reconfigurable fabric for PCIe Gen2 endpoint interfaces in radar signal processing systems.
For engineers reviewing the XC7K325T-1FFG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 6.6 Gb/s, and configuration via Master SelectMAP or JTAG.
Technical Context
The XC7K325T-1FFG676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and CPRI. It includes clock management tiles with MMCM and PLL blocks for precise clock synthesis and phase alignment.
Configuration is performed through dual-mode SPIx4 or BPI parallel interface, with bitstream encryption and HMAC authentication enabled for secure boot. The device supports partial reconfiguration and AXI4-Stream interconnects for dynamic system updates and high-throughput data movement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 1,440 - enables concurrent multiply-accumulate operations for filtering, FFT, and beamforming |
| Block RAM | 16.2 Mb - provides on-chip memory for buffering, lookup tables, and FIFOs without external DRAM |
| Transceiver Line Rate | 6.6 Gb/s - supports PCIe Gen2 x8 links and serial video interfaces at full bandwidth |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - allows direct interfacing with ADCs, DACs, DDR3 memory, and FMC mezzanine cards |
| Configuration Interface | Master SelectMAP, JTAG, SPIx4 - enables flexible, field-upgradable bitstream loading with security options |
Pinout & Package
XC7K325T-1FFG676I is housed in a 27×27 mm, 676-ball Flip-Chip Fine-Pitch BGA (FFG) package with 0.8 mm ball pitch and thermal lid. The package supports industrial-grade thermal dissipation and mechanical reliability under vibration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration Pins | Determine boot source (SPI/BPI/JTAG) and configuration mode at power-up |
| CCLK | Configuration Clock | Drives synchronous bitstream loading during Master SelectMAP or slave serial modes |
| DONE | Configuration Status | Open-drain output indicating successful configuration completion and release of I/O pins |
| INIT_B | Configuration Initialization | Active-low signal indicating configuration controller readiness and bitstream validity check status |
| GTX/GTH RefClk | Transceiver Reference Clock | Provides low-jitter reference for multi-gigabit transceivers; requires external differential source |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables runtime update of functional modules without resetting system operation or affecting active logic regions |
| AXI4-Stream Interconnect | Provides standardized, high-bandwidth, low-latency streaming interface between IP cores and external memory controllers |
| Secure Boot with HMAC | Verifies bitstream authenticity using SHA-256 hash and 256-bit key stored in eFUSE, preventing unauthorized firmware execution |
| MMCM + PLL Clock Management | Delivers up to 12 independent clock outputs per tile with sub-100 fs jitter for timing-critical SerDes and sampling circuits |
| PCIe Gen2 Endpoint Hard IP | Integrates fully compliant root port/endpoint logic with DMA engines, eliminating need for soft-core PCIe implementations |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and synthetic aperture beamforming in ground-based radar systems. IC Role / Device Role / Timing Role: Configurable digital front-end processor handling ADC sample ingestion, FIR filtering, and FFT acceleration. Use Value: 1,440 DSP slices enable simultaneous 128-channel FFTs at 100 MS/s input rate with deterministic latency under 2 µs. | Use Scenario: High-speed CT scanner data acquisition and image reconstruction pipeline. IC Role / Device Role / Timing Role: Data concentrator and preprocessing engine interfacing with 64-channel analog front-ends and feeding GPU-accelerated reconstruction kernels. Use Value: 16.2 Mb block RAM buffers full projection frames while AXI4-Stream enables zero-copy transfer to PCIe Gen2 host memory. |
| Avionics Data Concentrator | 5G Wireless Baseband Unit |
Use Scenario: ARINC 429/664 (AFDX) protocol bridging and time-triggered scheduling in flight control subsystems. IC Role / Device Role / Timing Role: Deterministic network interface controller with hardware timestamping and traffic shaping logic. Use Value: MMCM-generated 80 MHz and 125 MHz clocks meet AFDX jitter requirements (<50 ns peak-to-peak) across all 16 Ethernet ports. | Use Scenario: Massive MIMO precoding and channel estimation in 3.5 GHz mid-band base stations. IC Role / Device Role / Timing Role: Real-time baseband processor executing LTE/NR Layer 1 algorithms with adaptive modulation mapping. Use Value: GTX transceivers handle 8×2.4576 Gb/s CPRI lanes; DSP slices implement 64-point FFTs at 2.5 GHz effective throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, higher DSP count (1,920), 16.3 Gb/s transceivers, larger package (1156-ball) | Better suited for 5G NR Layer 1 with >100 MHz bandwidth and real-time LDPC decoding | Select when requiring >6.6 Gb/s serial I/O or >326K logic cells; requires PCB redesign due to different footprint and power delivery |
| XC7K160T-1FFG676I | Same Kintex-7 family, reduced logic (162,240 cells), fewer DSP slices (840), identical FFG676 package | Targeted for cost-sensitive radar warning receivers with lower channel count and no CPRI support | Select for pin-compatible migration path where logic/DSP demand is ≤50% of XC7K325T-1FFG676I; retains same board layout and thermal design |
Compared with XC7K325T-1FFG676I, XCKU040-2FFVA1156I delivers higher bandwidth and computational density but demands new PCB and power infrastructure, while XC7K160T-1FFG676I offers a drop-in logic-downgrade option within the same package for budget-constrained deployments.
Availability
XC7K325T-1FFG676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and 5G wireless baseband unit applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC7K325T-1FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt and heterogeneous integration.
The Kintex-7 FPGA product line targets high-throughput, low-latency applications in aerospace, defense, medical imaging, and wired/wireless communications where balanced logic, DSP, and I/O resources are critical.
FAQ
What is the maximum supported transceiver line rate for XC7K325T-1FFG676I?
The XC7K325T-1FFG676I supports a maximum transceiver line rate of 6.6 Gb/s across its GTX transceivers. This enables compliance with PCIe Gen2, SATA II, and CPRI Option 3 standards. The actual achievable rate depends on PCB layout quality, reference clock stability, and signal integrity margin - verified in AMD's Kintex-7 transceiver characterization reports.
Does XC7K325T-1FFG676I support partial reconfiguration?
Yes, XC7K325T-1FFG676I supports partial reconfiguration through Vivado Design Suite tools and hardware flow. This capability allows dynamic swapping of logic modules - such as filter banks or modulation schemes - without resetting the entire device. The feature relies on dedicated ICAP and FRAME_ECC mechanisms documented in UG474.
What configuration modes are available for XC7K325T-1FFG676I?
XC7K325T-1FFG676I supports Master SelectMAP, Slave SelectMAP, JTAG, and SPIx4 configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SelectMAP enables autonomous boot from external flash, while JTAG is used for debugging and programming during development - both fully supported in AMD's iMPACT and Vivado tools.
Is XC7K325T-1FFG676I qualified for industrial temperature operation?
Yes, XC7K325T-1FFG676I is rated for industrial temperature range (–40°C to +100°C) as indicated by the "I" suffix in the part number. Thermal performance validation includes junction temperature monitoring under worst-case power conditions per UG475, confirming reliable operation in enclosed avionics and outdoor radar enclosures.
What I/O standards does XC7K325T-1FFG676I support?
XC7K325T-1FFG676I supports LVCMOS (1.2 V to 3.3 V), LVDS, SSTL, HSTL, and differential signaling standards. These allow direct connection to DDR3 memory (SSTL15), high-speed ADCs (LVDS), and FMC-HPC mezzanine cards (Virtex-7 compatible I/O banks). Bank-specific voltage constraints apply per UG475.
XC7K325T-1FFG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K325T-1FFG676I FAQ
1.How can I place an order for XC7K325T-1FFG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FFG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FFG676I reliable?
The price and inventory of XC7K325T-1FFG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FFG676I is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FFG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FFG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-1FFG676I?
XC7K325T-1FFG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-1FFG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FFG676I?
For technical support, including XC7K325T-1FFG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FFG676I requirements.
6.How does Aetrix verify that XC7K325T-1FFG676I is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FFG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FFG676I meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FFG676I?
All XC7K325T-1FFG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FFG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FFG676I part is unused and in its original packaging.
Return procedure for XC7K325T-1FFG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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